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중도 성향
IT/기술
New method turns ocean water into drinking water, without waste
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IT/기술 · "METHOD" · 총 24건
필터 보기현재 지수
50.3
0 = 부정 우세
50 = 중립
100 = 긍정 우세
최근 7일 기준 84,410건을 분석한 결과, 뉴스 심리지수는 50.2(균형)입니다. 긍정 4,225건(5.0%)·중립 78,088건(92.5%)·부정 2,097건(2.5%)이며, 중립 비중이 뚜렷하게 높습니다. 성향 지수는 종합 14.8(중도 균형)입니다.
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Google's Debug research program plans to release millions of sterile mosquitoes to fight species that spread diseases like dengue. How does the method work — and should humans interfere with nature like this?
At SXSW London, Canadian production designer Patrice Vermette took the audience inside his process, talking about “method designing" and "scientific jam sessions."
Google's Debug research program plans to release millions of sterile mosquitoes to fight species that spread diseases like dengue. How does the method work — and should humans interfere with nature like this?
Cybersecurity researchers have identified a growing class of attacks that exploit AI chatbots through sophisticated conversational manipulation rather than traditional technical hacking methods. The post Hackers Are Using the Same Conversational Tricks on AI that Con Artists Use on People appeared first on Breitbart.
In den USA steigert sich Diskuswerfer Steven Richter auf beachtliche 74 Meter. Die Leistung verdankt er nicht nur günstigen Wettkampfbedingungen, sondern auch einer ungewöhnlichen Trainingsmethode.
A practical introduction to phase noise concepts, explaining how oscillator instability affects RF systems and how phase noise is measured, analyzed, and reported. What Attendees will Learn What phase noise is and why it matters — Learn how real-world oscillators differ from ideal ones, why short-term frequency instability arises, and why phase variations typically have a much greater impact than amplitude variations on system performance. How phase noise degrades system performance — Understand the most common effects of excessive phase noise: spectral regrowth, reciprocal mixing, and constellation rotation in digital communications. How phase noise is measured and reported — Explore the spectrum analyzer method and the cross-correlation technique, understand single sideband (SSB) phase noise plots and spot noise tables. What advanced phase noise measurements look like in practice — Discover additional measurement types including integrated phase noise, additive (residual) phase noise, pulsed signal phase noise, and amplitude noise. Download this free whitepaper now!
China has unveiled an artificial intelligence platform for drug discovery that can screen a vast library of chemical compounds, cutting the initial drug screening phase from months or years down to tens of seconds. Developers said they expected the system to provide a novel method for identifying lead molecules to treat tumours, neurodegenerative conditions, rare diseases and emerging infectious diseases, as well as possibly speeding up drug research during public health crises. Called GalaxyVS,...
This article is adapted by the author with permission from Tech Policy Press. Read the original article. South Africa is not just another developing country struggling to govern artificial intelligence; it is the exception with leverage, and the window to act on it is closing. It holds approximately 88 percent of global platinum-group metal reserves, critical inputs to parts of the semiconductor and data-center supply chains that make AI infrastructure possible. It hosts the largest data-center market on the continent. Its existing hyperscaler relationships give it procurement leverage that most African states will never have. And a major geopolitical contest over AI infrastructure is being fought on its soil right now, between Chinese and American technology companies competing for control of the systems that will underpin an entire continent’s public sector. In physics, leverage requires three things: a fulcrum, a lever arm, and the ability to apply force. The Bushveld Complex, the world’s largest platinum-group metal deposit, is the fulcrum: a mineral endowment that gives South Africa a position in the semiconductor supply chain that no other African state holds. The since-withdrawn draft policy is the lever arm. The unresolved “OPTION” provisions in the policy are where force would be applied. Without a policy that specifies what South Africa wants in return for market access, the lever arm sits unused, and the weight of two of the world’s largest technology ecosystems settles exactly where those ecosystems want it to settle. This makes South Africa a global test case. Not because its proposed means of governance is exemplary, but because it is the one developing country with enough structural leverage to negotiate genuinely different terms, and the one that is choosing, through inaction, not to. The recent announcement of a new panel to update the draft policy is an important opportunity. But the deeper failure is not that an AI policy contained bad references. It is that no verification process caught them before the document entered the public domain. That is a systems problem, not merely a political one. It points to a missing layer in how governments are adopting AI. The contest already underway Last year, Huawei pitched an emerging-product bundle to tech executives across the continent. Huawei was now bundling access to DeepSeek’s large language model with its own cloud and storage infrastructure. The price differential was stark—in some cases by more than 90 percent. At the same time, Microsoft announced plans to spend ZAR 5.4 billion ($300 million) by the end of 2027 on cloud and AI infrastructure in South Africa, building on a prior ZAR 20.4 billion investment. Google, Amazon Web Services, and Oracle already have cloud regions in the country. According to one analysis, the country’s data-center market was valued at US $2.16 billion in 2024, the largest in Africa. These are not commercially neutral investments. Huawei’s infrastructure reach has been explicitly linked to Chinese strategic objectives, including a documented track record of providing governments with surveillance infrastructure through its Safe Cities network. U.S. hyperscaler investment comes with its own dependency structure: closed models, pricing set unilaterally, and terms of access that no African government has meaningfully shaped. South Africa is being asked to choose between these dependency models without a policy that specifies what it wants in return. The leverage it has There is a particular irony in South Africa’s position. The country whose mines supply platinum-group metals essential to semiconductor manufacturing, and through them to AI compute, has drafted a policy that treats it as a consumer of AI systems rather than a stakeholder in their governance. South Africa digs up the minerals that make AI possible. It has no say over the AI built from them. The AI triad framework covers algorithms, compute, and data. South Africa has no frontier model development capacity. South Africa holds significant data assets in financial services, health care, and agriculture, with no clear framework for their sovereign management. South Africa possesses PGM (Platinum Group Metals) leverage of global significance on the compute axis, currently being transferred without meaningful condition. It also has exceptionally high solar irradiance and significant renewable-energy potential. A country that can offer both critical mineral inputs and the energy to power the infrastructure those minerals help build occupies a negotiating position of unusual strength. The Draft Policy proposes no minimum terms for hyperscaler investment, no data sovereignty requirements, no technology transfer conditions and no compute visibility mechanism. Multiple provisions are explicitly left unresolved, marked “OPTION,” including the most consequential choices about how governance will function. Infrastructure decisions made now determine what is renegotiable later, and the answer is: very little. Three futures, one default The three infrastructure futures on offer each create a structurally different form of dependency, and only one creates sovereign capability. The Huawei-hosted DeepSeek integration offers low cost and open-source weights, but with data stored on infrastructure potentially accessible under Chinese legal frameworks, creating surveillance dependency in a pattern already documented across Africa. The second is U.S. closed-model dependency: higher capability, more reliable data protection, but complete API dependency on developers abroad. The third is locally hosted open-weight infrastructure: models governed under South African data-sovereignty rules, on infrastructure subject to minimum terms, developed with South African data. As Nathan Lambert at Interconnects has observed, open-weight models are likely the only realistic way to get sovereign AI off the ground as a real effort, enabling local communities and economies to integrate meaningfully with the technology. But this requires procurement conditions, not goodwill. What binding governance looks like The GovAI “Governing Through the Cloud” framework identifies four roles compute providers should accept as conditions of operating at scale: securers (protecting model weights and training data), record keepers (maintaining infrastructure usage logs), verifiers (confirming customer compliance with safety standards) and enforcers (restricting access when violations occur). These are operational requirements, not theoretical categories—specific, enforceable, and well within the bargaining power of a market of South Africa’s size and mineral position. A detailed policy analysis submitted to the Department of Communications and Digital Technologies (DCDT) identifies the specific provisions the final policy must contain: mandatory minimum terms for foreign compute infrastructure investments above ZAR 500 million (~$30 million); a compute reporting threshold; a National AI Safety Institute mandate covering defensive monitoring of AI capability accumulation; and National AI Champion Sector designations to create data assets for domestic model development. Each provision converts a structural advantage into a governance instrument before that advantage is foreclosed by market reality. Just as modern software security increasingly depends on knowing what components are inside a system—model provider, training data, compute environment, evaluation methods, update cadence, human review points, and failure-reporting procedures—public-sector AI governance requires a clear account of the stack before deployment, not after a problem surfaces. A public institution that cannot verify the sources in its own AI policy is unlikely to be ready to verify the AI systems it procures, deploys, or regulates. Why this is the continental test case South Africa’s choices will establish a regional precedent for what is commercially negotiable in AI infrastructure. If South Africa negotiates data-sovereignty guarantees and technology-transfer conditions as requirements for hyperscaler investment, it creates a replicable model. If Microsoft’s $300 million investment and Huawei’s infrastructure expansion proceed on standard commercial terms, as they are currently, it normalizes extractive AI infrastructure across the continent. The lesson is not specific to Africa. Governments everywhere are producing AI strategies while lacking AI assurance infrastructure. South Africa is an early warning, not an isolated case. The public comment period closed when the policy was withdrawn. But a parallel process remains live: the National Treasury’s Draft General Public Procurement Regulations—the legal instrument that will govern every government AI contract—closes for comment on June 15. Those regulations contain no AI-specific provisions. South Africa has more AI leverage than any country on the continent. Some argue, with force, that governance requirements risk deterring the infrastructure investment South Africa urgently needs: compute capacity, reliable energy, venture capital, and talent retention. That concern deserves a direct answer. Minimum procurement terms, compute reporting thresholds, and technology transfer conditions are not barriers to investment. They are the conditions under which investment serves the host country rather than extracting from it. Infrastructure built without minimum terms produces dependency. Infrastructure built with them produces leverage. To serve the public interest, its AI policy must use it. When late last month News24 reported AI-hallucinated references in the draft AI policy, Minister of Communications and Digital Technologies Solly Malatsi withdrew the draft policy. That was a mistake that could cost South Africa and the rest of the continent the initiative on this urgent issue. His more recent constitution of an independent panel is a belated step in the right direction, if it can turn South Africa’s leverage into policy. The panel—chaired by Professor Benjamin Rosman of the Wits Machine Intelligence and Neural Discovery Institute, and including Professors Vukosi Marivate and Alison Gillwald of Research ICT Africa and Dr. Jabu Mtsweni of the Council for Scientific and Industrial Research—has the technical and governance credibility to produce a stronger document. What it has not yet produced is a timeline. No revised draft has been scheduled. South Africa remains without a formal AI governance framework in the interim.
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Floppy disks are several decades old—many of the disks are degrading and the data stored on them is at risk of being lost. In response, Leontien Talboom, a technical analyst at Cambridge University Libraries and Archives, led a roughly year-long project preserving floppy disks called “Future Nostalgia,” which concluded in January. Leontien Talboom Leontien Talboom is a technical analyst at Cambridge University Libraries and Archives, where she transfers material from a wide range of storage media to make them accessible to archivists. IEEE Spectrum spoke to Talboom about her work preserving data from Cambridge’s collection of floppy disks and collecting knowledge about the disks themselves. Why is it important to preserve floppy disks now? Leontien Talboom: Two reasons. First, the physical media is starting to degrade. Floppy disks are made from plastic, but they’ve got a magnetic layer of iron oxide, and that’s deteriorating. A lot of floppy disks are found in attics or garages, which means they also suffer from mold. Second, a lot of people who developed floppy disks and systems that use floppy disks are starting to retire or pass away, which means that a lot of tacit knowledge is disappearing. Whom did you go to for that tacit knowledge? Talboom: I went to the retro computing community. Their work is more around preserving these machines to keep them running [than] the data that lives on the floppy disk. But they know their stuff about floppy disks. For example, they know that in a lot of the older disks, the inside of the disk—the doughnut—gets stuck to the top. So if you flex the casing, the doughnut falls down again. If I hadn’t known that, I would have assumed that those disks in our collection were broken or corrupt. What is the most difficult part of working with floppy disks? Talboom: Accessing the files can be quite challenging if we don’t understand the file system. Within libraries and archives, we get a lot of material from machines that are not as well loved. Many of the personal computers that you had at home, such as the Amstrad or ZX Spectrum or BBC Micro, are very well documented. But a bunch of our material comes from business or research systems. They’re not as nostalgic for people, so there’s not as big a community preserving this type of material. Do you have a favorite type of floppy disk? Talboom: Five and a quarter. The weirder the system, the more frustrating and fun it is. I quite like doing that detective work. The Amstrad disk has also really stolen my heart. The popularity of floppy disks is very geographically dependent. Our library, for example, has these Amstrad 3-inch disks. But if you go to the U.S., they’re really uncommon. They weren’t able to manufacture enough of these drives, and [3.5-inch disks] took over at a certain point. But they’re really cute. What’s the best method for sustainably storing data? Talboom: The main thing is actively looking after it. A lot of the floppy disks we get in the library haven’t been accessed for 20 or 30 years, which means that you need certain special hardware to actually read them, and then work with emulators or other tools to make these file formats accessible. Now that we’ve done that work and transferred it, we can monitor it and make sure it’s not suffering from anything like bit rot. We can also make decisions around migrating it to other file formats or working on specific file systems or unknown file formats in more detail.
Investigators at the Don State Technical University (DSTU) have developed a method for assessing anxiety in dogs that could help pet owners distinguish between anxiety, fear and aggression.
The OnCampus program, administered by IEEE Educational Activities, last year expanded its engineering experiences from two to seven universities. Part of TryEngineering, the program is held at universities around the world, offering preuniversity students hands-on opportunities to solve engineering problems. The IEEE Innovation Committee provided funding for the additional locations. New participating institutions The electrical engineering and computing faculty at the University of Zagreb, in Croatia, hosted a two-day program in June. Twenty-five children ages 10 to 14 participated in lectures and workshops on artificial intelligence, computer science, robotics, and astronomy. Tomislav Jagušt, an IEEE senior member and the chair of the IEEE preuniversity coordinating committee, led the program. In September the Arab Academy for Science, Technology, and Maritime Transport’s engineering college held a two-day session at its Abu Kir, Egypt, campus. Fifty students participated in hands-on activities on Ohm’s law, radio communications, and circuit building. They also learned from professors about engineering careers and job opportunities. Also in September, the Majan University College, in Muscat, Oman, hosted 40 high school students who competed in six challenges to design and build circuits. These include an IoT design and an LED brightness control using a potentiometer, a three-terminal, manually adjustable resistor that functions as a variable voltage divider. The program also highlighted AI and quantum computing technologies and introduced students to job opportunities in the fields. The workshop transformed curiosity into creation, empowering students with technical skills and confidence in emerging technologies. In November at the Universiti Malaysia Perlis, in Arau, 50 students explored the fundamentals of quantum computational intelligence and AI through hands-on activities and interactive simulations. IEEE Senior Member Mohd Hafiz Ismail, a professor of electronic engineering and technology, gave an introduction about quantum computing intelligence technology. The Hellenic Robotics Center of Excellence at the National Technical University of Athens hosted a two-day session in December. Twenty-five students explored robotics and AI through hands-on design challenges such as TryEngineering’s AI and machine learning methods. They also toured the university’s research facilities. Hong Kong and Greek universities participate again The City University and St. Francis University in Hong Kong, and the University of Ioannina, Arta campus, Greece, participated in the program for a second year. Under the leadership of IEEE Senior Member Paulina Chan and volunteers from the IEEE Hong Kong Section, the City and St. Francis universities jointly held the program in July. They welcomed 55 students ages 12 to 18 from 41 schools. The students attended tutorials on foundational concepts and theories of AI. They worked in small teams on projects using AI-generated images, voice, and music manipulations. They were coached by students from St. Francis and Imperial College London. The participants presented their projects to judges, teachers, and parents. The students also visited a nearby semiconductor equipment manufacturer to learn about technology careers from engineers working there. The results of a post-program survey showed strong satisfaction with OnCampus, with nearly 75 percent of participants giving it a rating of 4 or higher out of 5. “I enjoyed getting to know about deep learning and its application,” one student participant said. “The content of the activity matched my interest, and I gained new knowledge.” “OnCampus is led by a strong team with lots of experts in the field,” another said. “It’s a rare chance for students to use software, learn about the theory behind how deep learning works, and get a glance at future possibilities.” The University of Ioannina hosted the program in Arta in July with support from IEEE Senior Member Stamatis Dragoumanos and IEEE members Nikos Giannakeas and Eleftheria Kallinikou. Nearly 50 students, ages 12 to 16, attended the seven-day event, supported by 17 instructors and six volunteers from the university’s IEEE student branch. The students learned about AI, augmented reality, microchip design, microcontrollers, and 3D printing. They also attended presentations by engineers from the industry. To give the students exposure to real-world engineering, they visited two hydroelectric power plants and a green data center. At the end of the program, students presented their projects and showcased the technical skills they had developed. Those involved in the TryEngineering OnCampus program are proud of the impactful experiences students have gained. The opportunities are possible because universities open their doors, share their expertise, and invest in the next generation of innovators. The University of Zagreb, the Arab Academy for Science, Technology, and Maritime Transport, the Majan University College, and The City University and St. Francis University will be participating again this year. To learn how you can bring the OnCampus program to your educational institution, send a request to tryengineering@ieee.org.
Chinese tech company Huawei said Monday it has developed a new method for manufacturing semiconductors that could allow it to produce cutting-edge chips within several years without relying on adva
Leo denounced the 'culture of power' driving the AI race, especially in developing ever more sophisticated methods of remote warfare.
The many methods we use to gather data ultimately boil down to either counting or comparing.
Patients who use mobile applications to manage medical conditions including depression and chronic pain might assume the apps have been evaluated by regulatory agencies to be safe and effective. But that isn’t necessarily the case. Most of the more than 55,000 medical apps that claim to diagnose or treat a condition—or ones that provide clinical decision support, known as “therapeutic” apps—have never been assessed by any trusted neutral bodies or regulatory agencies to evaluate them for technical soundness, ethical design, or clinical benefit. The apps often don’t comply with regional data security and privacy laws to protect people’s sensitive health information. Medical apps differ from traditional wellness apps, which provide users with insights into becoming healthier by, for example, tracking fitness activities, monitoring blood pressure, and analyzing sleep patterns. There is no reliable way to verify that therapeutic apps deliver the results they indicate. To help ensure such apps are credible, the IEEE Standards Association (IEEE SA) recently launched the IEEE Global Medical Mobile App Assessment and Registry. The publicly searchable directory is designed to list apps that have been vetted by experts across several criteria including technical soundness, ethical design, compliance with data security and privacy regulations, and clinical efficacy, which is evidence of a clinical benefit for the patient. “Patients, clinicians, payers, and health care systems often struggle to distinguish clinically meaningful therapeutic apps from those that are simply well-marketed,” says IEEE Senior Member Yuri Quintana, chair of the assessment and registry program. He is chief of the clinical informatics division at Beth Israel Deaconess Medical Center, in Boston. “Our goal is to establish a standardized review method using criteria developed by experts.” Why regulation is lacking Because the apps are intended for medical use without being part of a medical implement, they fall under the designation of software as a medical device (SaMD), according to the International Medical Device Regulators Forum. SaMD is supposed to be regulated by public health agencies such as the U.S. Food and Drug Administration, but the apps have developed and grown in popularity so quickly that regulators haven’t been able to keep up, Quintana says. Some companies have received approval, but most have not, he says. Many users are unaware of the regulatory gap, he says. “Seeing an app from a well-known company often creates the impression that it has been meaningfully vetted for safety and efficacy, even when that is not the case,” he says. Some companies are using deceptive advertising to sell their product, he adds. Marketing materials might claim that all of a company’s health apps are certified, even though only one app has been approved by a regulatory body to treat a particular condition. Or the verbiage might imply the company has clinical evidence proving its application works, even though the app has never been tested independently. Another concern is that updated apps aren’t being vetted, says Maria Palombini, IEEE SA’s director of health care and life sciences global practice lead. “The original app might have received approval from a regulatory agency, but not the updated version,” Palombini says. “There could have been significant changes from the original.” “Not every medical-related app triggers the same regulatory classification or review across jurisdictions,” Quintana adds. “That leaves a large gray zone of clinically relevant but lower-risk apps that haven’t undergone an independent assessment. The IEEE registry was created to help fill these gaps. “IEEE is the best organization to address this problem because this is fundamentally a standards, trust, interoperability, and conformity assessment challenge,” he says. IEEE “is the world’s largest technical professional organization, with deep expertise in developing globally recognized standards including in health care, cybersecurity, AI ethics, and interoperability.” “Through the IEEE Conformity Assessment Program, we already run rigorous assessment and registry programs,” Palombini says. “Our neutral, consensus-driven, multidisciplinary approach—bringing together clinicians, regulators, developers, and ethicists without commercial bias—makes IEEE uniquely positioned to create trustworthy global guardrails that can scale across jurisdictions and support regulatory harmonization.” How the registry works The assessment framework was developed by a multidisciplinary group of 35 volunteer experts from 10 countries, Quintana says. The panel includes academics, AI experts, app developers, clinicians, ethicists, mental health experts, patient advocates, regulators, researchers, technologists, and those who assess safety in health care. The registry is for any app used for clinical care or therapeutics that claims to demonstrate a medical benefit. That includes apps designed for cardiology, diabetes, mental health, neurology, oncology, rehabilitation, and respiratory diseases, Quintana says. Initially, he says, the focus will be on apps that aim to treat mental health conditions, given the large number of offerings in that area and the registry committee’s expertise. The submission of apps is voluntary. There is no government mandate that requires a company to use the IEEE registry. The products will be evaluated against about 150 consensus-based criteria across three major areas: Clinical efficacy including therapeutic effectiveness, any sustained benefits, risk management, comparison to standard care, user engagement, and real clinical value. Technical soundness including accessibility, privacy and security, error handling, interoperability, AI governance, usability, and operational quality. Ethical design including bias prevention, patient consent, data governance, conflict-of-interest transparency, responsible use of AI and large language models, and prioritization of public health benefits. IEEE charges a nonrefundable submission fee that covers the cost of the assessment plus the registry’s annual subscription for the first year. Developers first must demonstrate they are a legally established entity before they can complete the app publisher registration form and then submit documentation and attestations about the product. The IEEE review of an app is estimated to take six to eight weeks, Palombini says. The assessment results will be privately shared with the app publisher, she says, and to be listed in the registry, an app must achieve more than 85 percent compliance in each category. Upgraded apps must be submitted and reassessed, Palombini says. Similar to how users are notified when an app on their smart devices has , the registry will be notified when listed apps have a new update available, she says. Applicants who do not pass the assessment are to receive feedback explaining why. They will be given an opportunity to make changes or provide additional documentation, Palombini says. “It’s a pretty methodological process, with checks and balances,” Quintana says. “We’re being very transparent about the process.” Approved apps added to the registry receive an IEEE certification badge and submission identifier, which the company can display on its website, app store listings, and marketing materials. “The badge serves as visible proof that the app has met the independent, consensus-based assessment for clinical value, technical robustness, and ethical design,” Quintana says. The registry will be publicly available at no cost, he says. Patients and families seeking safe, trustworthy apps—and payers and insurers evaluating reimbursement potential—will find the registry helpful, he says. The application website is open. The public registry page does not yet list a specific count of approved apps because assessments are ongoing. Approved apps and their unique identifiers are to be published when the initial reviews are completed. To learn more, you can watch a webinar recorded in March. The assessment framework that underpins the registry is supporting the formal recognition of IEEE P3962 Standard for Criteria Assessment Framework f
Pokrovsky's work contributed to the identification of “patient zero” in the Soviet Union’s first HIV outbreak and helped establish the methodology for a nationwide network of AIDS prevention and treatment centers.
Yale's Jeffrey Sonnenfeld and Stephen Henriques and NYU's Gary Marcus offer a method for separating necessary AI regulation from legislative noise.
This sponsored article is brought to you by Applied Materials. At pivotal moments in history, progress has required more than individual brilliance. The most consequential breakthroughs — such as those achieved under the Human Genome Project — required a new operating paradigm: Concentrate the world’s best talent around a single mission, establish a common platform, share critical infrastructure, and collapse feedback loops. When stakes are high and timelines are compressed, sequential and siloed innovation simply cannot keep pace. Today’s AI era is creating an engineering race with similar demands. Every company is pushing to deliver higher-performance AI systems, faster. But performance is no longer defined by compute alone. AI workloads are increasingly dominated by the movement of data: In many cases, moving bits consumes as much — or more — energy than compute itself. As a result, reducing energy per bit can extend system‑level performance alongside gains in peak compute. The path to energy‑efficient AI therefore runs through system‑level engineering, spanning three tightly interconnected domains: Logic, where performance per watt depends on efficient transistor switching, low‑loss power, and signal delivery through dense wiring stacks. Memory, where surging bandwidth and capacity demands expose the memory wall, with processor capability advancing faster than memory access. Advanced packaging, where 3D integration, chiplet architectures, and high‑density interconnects bring compute and memory closer together — enabling system designs monolithic scaling can no longer sustain. These domains can no longer be optimized independently. Gains in logic efficiency stall without sufficient memory bandwidth. Advances in memory bandwidth fall short if packaging cannot deliver proximity within thermal and mechanical constraints. Packaging, in turn, is constrained by the precision of both front‑end device fabrication and back‑end integration processes. In the angstrom era, the hardest problems arise at the boundaries — between compute and memory in the package, front‑end and back‑end integration, and the tightly coupled process steps needed for precise 3D fabrication. And it is precisely this boundary‑driven complexity where the traditional innovation model breaks down. The Traditional R&D Workflow Is Too Slow for Angstrom‑Era AI For decades, the semiconductor industry’s R&D model has resembled a relay race. Capabilities are developed in one part of the ecosystem, handed off downstream through integration and manufacturing, evaluated by chip and system designers, and only then fed back for the next iteration. That model worked when progress was dominated by relatively modular steps that could be scaled independently and simply dropped into the manufacturing flow. But the AI timeline has upended these rules. At angstrom‑scale dimensions, the physics enforces inescapable coupling across the entire stack: materials choices shape integration schemes; integration defines design rules; design rules dictate power delivery; wiring sets thermal budgets; and thermals ultimately constrain packaging scaling. System architects simply cannot wait 10–15 years for each major semiconductor technology inflection to mature. Representing a roughly $5 billion investment, EPIC is the largest commitment to advanced semiconductor equipment R&D in U.S. history. A long‑term perspective is essential to align materials innovation with emerging device architectures — and to develop the tools and processes required to integrate both with manufacturable precision. At Applied Materials, together with our customers, we are charting a course across the next 3–4 generations, extending as far as 10 years down the roadmap. The angstrom era demands that we break down silos and bring together the industry’s best minds — from leading companies to leading academic institutions. If the problem is coupled, the solution must be coupled. If the timeline is compressed, the learning loop must be compressed. It’s not enough to just innovate — we must innovate how we innovate. EPIC: A Center and Platform for High‑Velocity Co‑Innovation This is the challenge that Applied Materials EPIC Center is designed to solve. Representing a roughly US $5 billion investment, EPIC is the largest commitment to advanced semiconductor equipment R&D in U.S. history. When it opens in 2026, it will deliver state‑of‑the‑art cleanroom capabilities built from the ground up to shorten the path from early‑stage research to full‑scale manufacturing. But the facilities are only one component of the model. EPIC is also a platform, an operating system for high-velocity co‑innovation that revolutionizes how ideas move from the lab to the fab. EPIC is a platform, an operating system for high-velocity co‑innovation that revolutionizes how ideas move from the lab to the fab.Applied Materials The EPIC model compresses the traditional workflow. Customer engineers work side‑by‑side with Applied technologists from day one — moving beyond isolated process optimization and downstream handoffs. Within a shared, secure environment, EPIC tightly integrates atomistic modeling, test vehicles, process development, validation, and metrology feedback. Constraints that once surfaced late in development are identified and addressed early. The result is a potentially 2x faster path that benefits the entire ecosystem under one roof: Chipmakers gain earlier access to Applied’s R&D portfolio, faster learning cycles, and accelerated transfer of next‑generation technologies into high‑volume manufacturing. Ecosystem partners gain earlier access to advanced manufacturing technology and collaboration opportunities that expand what is possible through materials innovation. Academic institutions gain opportunities to strengthen the lab‑to‑fab pipeline and help develop future semiconductor talent. Building on decades of co‑development, we are reinventing the innovation pipeline with our partners across logic, memory, and advanced packaging to deliver the next leap in energy‑efficient AI. Accelerating Advanced Logic Logic remains the engine of AI compute. In the angstrom era, however, system‑level gains are increasingly constrained by power and energy. Extending AI performance now depends on architectures that deliver more performance per watt — accelerating the move to 3D devices such as gate‑all‑around (GAA) transistors, which boost density within a compact footprint while preserving power efficiency. Architectures that deliver more performance per watt are accelerating the move to 3D devices such as gate‑all‑around (GAA) transistors, and further out, complementary FETs (CFETs), which push density scaling even more.Applied Materials These architectural shifts are unfolding at unprecedented scale, with the logic roadmap already extending beyond first‑generation GAA toward more advanced designs. One key example is GAA with backside power delivery, which relocates thick power lines to the backside of the wafer, reducing resistive losses and freeing front‑side routing for tighter logic cell integration. Another example brings adjacent GAA PMOS and NMOS transistors closer together while inserting a dielectric isolation wall between them to minimize electrical interference. Further out, complementary FETs (CFETs) push density scaling even more by stacking PMOS and NMOS devices directly atop one another. While these architectures deliver compelling gains in performance per watt and logic density without relying solely on tighter lithography, they significantly raise integration complexity. Manufacturing a single GAA device today can involve more than 2,000 tightly interdependent process steps. At the same time, wiring stacks continue to grow taller and denser to connect these advanced logic devices. Modern leading‑edge GPUs now in development pack more than 300 billion transistors into an area little larger than a postage stamp, interconnected by over 2,000 miles of wiring. Modern leading‑edge GPUs now in development pack more than 300 billion transistors into an area little larger than a postage stamp, interconnected by over 2,000 miles of wiring.Applied Materials At this level of complexity, the process steps used to create these precise 3D devices and wiring stacks cannot be optimized independently. Design and process must evolve in lockstep, and materials innovation and fabrication methods must advance alongside device architecture. EPIC’s co‑innovation model is designed to accelerate exactly this convergence — enabling logic compute to continue advancing the frontiers of AI at the pace the roadmap demands. Powering the Memory Roadmap At the same time, the AI computing era is fundamentally reshaping how data is generated, moved, and processed — making memory technologies, especially DRAM, central to delivering the energy‑efficient performance AI systems require. As models grow larger and more data‑hungry, the DRAM roadmap is shifting toward architectures that deliver higher density, greater bandwidth, and faster access per watt. At the DRAM cell level, AI performance requirements are driving a transition from 6F² buried‑channel array transistors (BCAT) to more compact 4F², and beyond that, architectures that move past what 2D scaling alone can deliver. Applied Materials At the DRAM cell level, this shift is driving a transition from 6F² buried‑channel array transistors (BCAT) to more compact 4F² architectures, which orient the transistor vertically to boost density and reduce chip area. Looking beyond 4F², sustaining gains in performance per watt will require moving past what 2D scaling alone can deliver. The industry is therefore turning to 3D DRAM, stacking memory cells vertically to add capacity within a constrained footprint. As these structures grow taller and aspect ratios intensify, high-mobility materials engineering in three dimensions becomes increasingly critical to performance and reliability. Beyond the memory cell array, another powerful lever for DRAM scaling is shrinking the peripheral circuitry, which includes logic transistors and interconnect wiring. One emerging approach places select periphery functions beneath the DRAM array by bonding two wafers — one optimized for the DRAM cells and the other for CMOS logic — using multiple wiring layers. Beyond the memory cell array, another powerful lever for DRAM scaling is shrinking the peripheral circuitry, which includes logic transistors and interconnect wiring.Applied Materials In parallel, DRAM performance is being extended by leveraging logic‑proven enhancers in the memory periphery. These include mobility boosters such as embedded silicon germanium and stress films, along with wiring upgrades like improved low‑k dielectrics and advanced copper interconnects. Memory manufacturers are also transitioning periphery transistors from planar devices to FinFET architectures, following the logic roadmap to further improve I/O speed. These valuable inflections are central to EPIC’s mission — where they can be co-developed and rapidly validated for next‑generation memory systems. Driving System Scaling With Advanced Packaging As data movement becomes the dominant energy cost in AI systems, advanced packaging has emerged as a critical lever for improving system‑level efficiency—shortening interconnect distances, increasing bandwidth density, and reducing the power required to move data between logic and memory. The rise of 3D packages such as high‑bandwidth memory (HBM) underscores why advanced packaging is becoming central to the AI era.Applied Materials High‑bandwidth memory (HBM) marks a major inflection along this path. By stacking DRAM dies — scaling to 16 layers and beyond — and placing memory much closer to the processor, HBM enables rapid access to ever‑larger working datasets. This delivers step‑function gains in both bandwidth and energy efficiency. More broadly, the rise of 3D packages such as HBM underscores why advanced packaging is becoming central to the AI era. Packaging now addresses system‑level constraints that logic and memory device scaling alone can no longer overcome. It also enables a move away from monolithic systems‑on‑chip toward chiplet‑based architectures, as AI workloads increasingly demand flexible designs that combine logic, memory, and specialized accelerators optimized for specific tasks. A vital technology powering this roadmap is hybrid bonding. With interconnect pitches approaching those of on‑chip wiring, conventional bumps and microbumps run into fundamental limits in density, power, and signal integrity. Hybrid bonding removes these barriers by allowing dramatically higher interconnect and I/O density, supporting a broad range of chiplet architectures — from memory stacking to tighter compute‑memory integration. EPIC tackles high‑value advanced‑packaging challenges through early, parallel co‑innovation across materials, integration, and manufacturing.Applied Materials As bonded structures like HBM stacks grow larger and more complex, warpage control, die placement, stack alignment, and thermal management become first‑order challenges. EPIC tackles these and other high‑value advanced‑packaging challenges through early, parallel co‑innovation across materials, integration, and manufacturing. Bringing It All Together Across logic, memory, and advanced packaging, our industry faces an ambitious roadmap that promises significant gains in energy efficiency for AI systems. But realizing that potential demands breakthrough materials innovation at a time when feature sizes are shrinking, interfaces are multiplying, and process interdependencies are escalating. These challenges cannot be solved on 10–15‑year timelines under the traditional relay‑race model. We must break down silos, align earlier across the ecosystem, and parallelize learning to keep pace with AI’s demands. In the AI era, progress will be defined by the speed at which lightbulb moments turn into manufacturing and commercialization reality. The only viable path forward is a new innovation model — and EPIC is how we are driving it.