New York Post
보수 성향
스포츠
Shaq has trouble getting past security in viral NBA Finals scene
It made for a lighthearted scene ahead of a pivotal Game 2.
🇺🇸 미국 · "VOTA" · 총 18건
필터 보기현재 지수
50.0
0 = 부정 우세
50 = 중립
100 = 긍정 우세
최근 7일 기준 11,958건을 분석한 결과, 뉴스 심리지수는 50.0(균형)입니다. 긍정 1건(0.0%)·중립 11,956건(100.0%)·부정 1건(0.0%)이며, 중립 비중이 뚜렷하게 높습니다. 성향 지수는 종합 18.8(중도 균형)입니다.
It made for a lighthearted scene ahead of a pivotal Game 2.
The queen’s third cousin, she was a bridesmaid at the royal wedding in 1947, and witnessed firsthand pivotal moments in British history.
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This summer marks a historic milestone as the nation commemorates and celebrates the 250th anniversary of its founding. As Americans reflect on the patriotism, ingenuity, and progress that have shaped the country, it would be remiss to not recognize the pivotal role that chemistry has played in its development. From the materials that built the...
Microsoft is heading to San Francisco this week in a bid to win back developers at its Build conference. I've been attending Build since the days when Microsoft called it the Professional Developers Conference, and I can't remember a more pivotal moment. As Microsoft continues to reshuffle its entire business around AI, it's moving Build […]
Emily Blunt rejected using artificial intelligence (AI) when filming a pivotal scene in Steven Spielberg's forthcoming sci-fi film Disclosure Day, saying she is terrified of the creative medium. The post Emily Blunt Is ‘Terrified of AI’ and Refused to Use It on Steven Spielberg’s ‘Disclosure Day’ appeared first on Breitbart.
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Emily Blunt is “terrified” of AI and chose not to rely on it during a pivotal sequence in Steven Spielberg’s upcoming film “Disclosure Day.” The Spielberg-directed sci-fi film follows a Kansas City TV meteorologist, played by Blunt, who is suddenly overcome by a mysterious extraterrestrial force while taping a weather segment live on air. The […]
After wrapping its Saint-Tropez leg at the posh Chateau de la Messardiere, the production of Mike White’s hit anthology series “The White Lotus” Season 4 has moved to Cannes, where it has taken over the Palais des Festivals for what appears to be some of the season’s most pivotal scenes. The production has been shooting […]
Texas state Rep. James Talarico is reacting to Ken Paxton's win in the Republican runoff that set up what's bound to be a pivotal race in the 2026 midterms. Ed O'Keefe reports.
Nicolas Cage is still remembering that he might have blown a big chance when he turned down a role in Christopher Nolan’s “Insomnia.” The Oscar-winning actor covered numerous pivotal moments in his career in an antic, wide-ranging interview with the New York Times ahead of the premiere of his “Spider-Noir” series on MGM+, and recalled […]
"“Humanity... is today facing a pivotal choice: either to construct a new Tower of Babel or to build the city in which God and humanity dwell together," the pope writes in first encyclical
Kevin Warsh is becoming Federal Reserve chair at a pivotal moment for the U.S. economy — forcing him to be something other than the disruptor he hoped to be.
This sponsored article is brought to you by Applied Materials. At pivotal moments in history, progress has required more than individual brilliance. The most consequential breakthroughs — such as those achieved under the Human Genome Project — required a new operating paradigm: Concentrate the world’s best talent around a single mission, establish a common platform, share critical infrastructure, and collapse feedback loops. When stakes are high and timelines are compressed, sequential and siloed innovation simply cannot keep pace. Today’s AI era is creating an engineering race with similar demands. Every company is pushing to deliver higher-performance AI systems, faster. But performance is no longer defined by compute alone. AI workloads are increasingly dominated by the movement of data: In many cases, moving bits consumes as much — or more — energy than compute itself. As a result, reducing energy per bit can extend system‑level performance alongside gains in peak compute. The path to energy‑efficient AI therefore runs through system‑level engineering, spanning three tightly interconnected domains: Logic, where performance per watt depends on efficient transistor switching, low‑loss power, and signal delivery through dense wiring stacks. Memory, where surging bandwidth and capacity demands expose the memory wall, with processor capability advancing faster than memory access. Advanced packaging, where 3D integration, chiplet architectures, and high‑density interconnects bring compute and memory closer together — enabling system designs monolithic scaling can no longer sustain. These domains can no longer be optimized independently. Gains in logic efficiency stall without sufficient memory bandwidth. Advances in memory bandwidth fall short if packaging cannot deliver proximity within thermal and mechanical constraints. Packaging, in turn, is constrained by the precision of both front‑end device fabrication and back‑end integration processes. In the angstrom era, the hardest problems arise at the boundaries — between compute and memory in the package, front‑end and back‑end integration, and the tightly coupled process steps needed for precise 3D fabrication. And it is precisely this boundary‑driven complexity where the traditional innovation model breaks down. The Traditional R&D Workflow Is Too Slow for Angstrom‑Era AI For decades, the semiconductor industry’s R&D model has resembled a relay race. Capabilities are developed in one part of the ecosystem, handed off downstream through integration and manufacturing, evaluated by chip and system designers, and only then fed back for the next iteration. That model worked when progress was dominated by relatively modular steps that could be scaled independently and simply dropped into the manufacturing flow. But the AI timeline has upended these rules. At angstrom‑scale dimensions, the physics enforces inescapable coupling across the entire stack: materials choices shape integration schemes; integration defines design rules; design rules dictate power delivery; wiring sets thermal budgets; and thermals ultimately constrain packaging scaling. System architects simply cannot wait 10–15 years for each major semiconductor technology inflection to mature. Representing a roughly $5 billion investment, EPIC is the largest commitment to advanced semiconductor equipment R&D in U.S. history. A long‑term perspective is essential to align materials innovation with emerging device architectures — and to develop the tools and processes required to integrate both with manufacturable precision. At Applied Materials, together with our customers, we are charting a course across the next 3–4 generations, extending as far as 10 years down the roadmap. The angstrom era demands that we break down silos and bring together the industry’s best minds — from leading companies to leading academic institutions. If the problem is coupled, the solution must be coupled. If the timeline is compressed, the learning loop must be compressed. It’s not enough to just innovate — we must innovate how we innovate. EPIC: A Center and Platform for High‑Velocity Co‑Innovation This is the challenge that Applied Materials EPIC Center is designed to solve. Representing a roughly US $5 billion investment, EPIC is the largest commitment to advanced semiconductor equipment R&D in U.S. history. When it opens in 2026, it will deliver state‑of‑the‑art cleanroom capabilities built from the ground up to shorten the path from early‑stage research to full‑scale manufacturing. But the facilities are only one component of the model. EPIC is also a platform, an operating system for high-velocity co‑innovation that revolutionizes how ideas move from the lab to the fab. EPIC is a platform, an operating system for high-velocity co‑innovation that revolutionizes how ideas move from the lab to the fab.Applied Materials The EPIC model compresses the traditional workflow. Customer engineers work side‑by‑side with Applied technologists from day one — moving beyond isolated process optimization and downstream handoffs. Within a shared, secure environment, EPIC tightly integrates atomistic modeling, test vehicles, process development, validation, and metrology feedback. Constraints that once surfaced late in development are identified and addressed early. The result is a potentially 2x faster path that benefits the entire ecosystem under one roof: Chipmakers gain earlier access to Applied’s R&D portfolio, faster learning cycles, and accelerated transfer of next‑generation technologies into high‑volume manufacturing. Ecosystem partners gain earlier access to advanced manufacturing technology and collaboration opportunities that expand what is possible through materials innovation. Academic institutions gain opportunities to strengthen the lab‑to‑fab pipeline and help develop future semiconductor talent. Building on decades of co‑development, we are reinventing the innovation pipeline with our partners across logic, memory, and advanced packaging to deliver the next leap in energy‑efficient AI. Accelerating Advanced Logic Logic remains the engine of AI compute. In the angstrom era, however, system‑level gains are increasingly constrained by power and energy. Extending AI performance now depends on architectures that deliver more performance per watt — accelerating the move to 3D devices such as gate‑all‑around (GAA) transistors, which boost density within a compact footprint while preserving power efficiency. Architectures that deliver more performance per watt are accelerating the move to 3D devices such as gate‑all‑around (GAA) transistors, and further out, complementary FETs (CFETs), which push density scaling even more.Applied Materials These architectural shifts are unfolding at unprecedented scale, with the logic roadmap already extending beyond first‑generation GAA toward more advanced designs. One key example is GAA with backside power delivery, which relocates thick power lines to the backside of the wafer, reducing resistive losses and freeing front‑side routing for tighter logic cell integration. Another example brings adjacent GAA PMOS and NMOS transistors closer together while inserting a dielectric isolation wall between them to minimize electrical interference. Further out, complementary FETs (CFETs) push density scaling even more by stacking PMOS and NMOS devices directly atop one another. While these architectures deliver compelling gains in performance per watt and logic density without relying solely on tighter lithography, they significantly raise integration complexity. Manufacturing a single GAA device today can involve more than 2,000 tightly interdependent process steps. At the same time, wiring stacks continue to grow taller and denser to connect these advanced logic devices. Modern leading‑edge GPUs now in development pack more than 300 billion transistors into an area little larger than a postage stamp, interconnected by over 2,000 miles of wiring. Modern leading‑edge GPUs now in development pack more than 300 billion transistors into an area little larger than a postage stamp, interconnected by over 2,000 miles of wiring.Applied Materials At this level of complexity, the process steps used to create these precise 3D devices and wiring stacks cannot be optimized independently. Design and process must evolve in lockstep, and materials innovation and fabrication methods must advance alongside device architecture. EPIC’s co‑innovation model is designed to accelerate exactly this convergence — enabling logic compute to continue advancing the frontiers of AI at the pace the roadmap demands. Powering the Memory Roadmap At the same time, the AI computing era is fundamentally reshaping how data is generated, moved, and processed — making memory technologies, especially DRAM, central to delivering the energy‑efficient performance AI systems require. As models grow larger and more data‑hungry, the DRAM roadmap is shifting toward architectures that deliver higher density, greater bandwidth, and faster access per watt. At the DRAM cell level, AI performance requirements are driving a transition from 6F² buried‑channel array transistors (BCAT) to more compact 4F², and beyond that, architectures that move past what 2D scaling alone can deliver. Applied Materials At the DRAM cell level, this shift is driving a transition from 6F² buried‑channel array transistors (BCAT) to more compact 4F² architectures, which orient the transistor vertically to boost density and reduce chip area. Looking beyond 4F², sustaining gains in performance per watt will require moving past what 2D scaling alone can deliver. The industry is therefore turning to 3D DRAM, stacking memory cells vertically to add capacity within a constrained footprint. As these structures grow taller and aspect ratios intensify, high-mobility materials engineering in three dimensions becomes increasingly critical to performance and reliability. Beyond the memory cell array, another powerful lever for DRAM scaling is shrinking the peripheral circuitry, which includes logic transistors and interconnect wiring. One emerging approach places select periphery functions beneath the DRAM array by bonding two wafers — one optimized for the DRAM cells and the other for CMOS logic — using multiple wiring layers. Beyond the memory cell array, another powerful lever for DRAM scaling is shrinking the peripheral circuitry, which includes logic transistors and interconnect wiring.Applied Materials In parallel, DRAM performance is being extended by leveraging logic‑proven enhancers in the memory periphery. These include mobility boosters such as embedded silicon germanium and stress films, along with wiring upgrades like improved low‑k dielectrics and advanced copper interconnects. Memory manufacturers are also transitioning periphery transistors from planar devices to FinFET architectures, following the logic roadmap to further improve I/O speed. These valuable inflections are central to EPIC’s mission — where they can be co-developed and rapidly validated for next‑generation memory systems. Driving System Scaling With Advanced Packaging As data movement becomes the dominant energy cost in AI systems, advanced packaging has emerged as a critical lever for improving system‑level efficiency—shortening interconnect distances, increasing bandwidth density, and reducing the power required to move data between logic and memory. The rise of 3D packages such as high‑bandwidth memory (HBM) underscores why advanced packaging is becoming central to the AI era.Applied Materials High‑bandwidth memory (HBM) marks a major inflection along this path. By stacking DRAM dies — scaling to 16 layers and beyond — and placing memory much closer to the processor, HBM enables rapid access to ever‑larger working datasets. This delivers step‑function gains in both bandwidth and energy efficiency. More broadly, the rise of 3D packages such as HBM underscores why advanced packaging is becoming central to the AI era. Packaging now addresses system‑level constraints that logic and memory device scaling alone can no longer overcome. It also enables a move away from monolithic systems‑on‑chip toward chiplet‑based architectures, as AI workloads increasingly demand flexible designs that combine logic, memory, and specialized accelerators optimized for specific tasks. A vital technology powering this roadmap is hybrid bonding. With interconnect pitches approaching those of on‑chip wiring, conventional bumps and microbumps run into fundamental limits in density, power, and signal integrity. Hybrid bonding removes these barriers by allowing dramatically higher interconnect and I/O density, supporting a broad range of chiplet architectures — from memory stacking to tighter compute‑memory integration. EPIC tackles high‑value advanced‑packaging challenges through early, parallel co‑innovation across materials, integration, and manufacturing.Applied Materials As bonded structures like HBM stacks grow larger and more complex, warpage control, die placement, stack alignment, and thermal management become first‑order challenges. EPIC tackles these and other high‑value advanced‑packaging challenges through early, parallel co‑innovation across materials, integration, and manufacturing. Bringing It All Together Across logic, memory, and advanced packaging, our industry faces an ambitious roadmap that promises significant gains in energy efficiency for AI systems. But realizing that potential demands breakthrough materials innovation at a time when feature sizes are shrinking, interfaces are multiplying, and process interdependencies are escalating. These challenges cannot be solved on 10–15‑year timelines under the traditional relay‑race model. We must break down silos, align earlier across the ecosystem, and parallelize learning to keep pace with AI’s demands. In the AI era, progress will be defined by the speed at which lightbulb moments turn into manufacturing and commercialization reality. The only viable path forward is a new innovation model — and EPIC is how we are driving it.
This sponsored article is brought to you by Ampace. As AI workloads grow to gigascale levels, the global data center industry has hit a hidden physical wall. The real bottleneck is no longer just the thermal limit of the chip or the capacity of the cooling system — it is the dynamic resilience of the power chain. Modern AI computing clusters, driven by massive GPU clusters, generate high-frequency, abrupt, and synchronized spikey pulse loads. As rack densities soar beyond 100 kW, these fluctuations are amplified into a “power paradox”: while the digital logic of AI is moving faster than ever, the physical infrastructure supporting it remains tethered to legacy response capabilities. The power usage of these gigascale sites and their drastic, high frequency, abrupt load surges from the AI GPU clusters can trigger transient voltage events and frequency instability, risking the entire local grid. The grid itself is not robust enough to support these loads. This leads to the infrastructure gap: The utility is not robust enough and traditional backup sources, such as diesel generators and gas turbines, simply cannot react to millisecond-level power spikes in output. This will often force operators into a cycle of costly infrastructure over sizing just to buffer the volatility. AI infrastructure requires energy systems capable of instantaneous response while safeguarding continuity and reliability. The industry has explored various mitigations — from rack-level BBUs to 800V DC architectures — yet the mature, high volume, traditional UPS system remains the most viable and scalable foundation for gigawatt-level facilities. Consequently, the UPS-integrated battery system has emerged as the critical “physical buffer” to neutralize these pulses at the source. At Data Center World 2026 in Washington, D.C., Ampace led a pivotal technical dialogue with Eaton during the session “Powering Giga-scale AI.” Their exchange unveiled a fundamental paradigm shift: To bridge the AI power gap, energy storage must evolve from a passive insurance policy into an active, high-speed stabilizer. By aligning Ampace’s semi-solid-state battery innovation with Eaton’s proven system intelligence, we are moving beyond simple backup to solve the physical paradox of the AI era. To move beyond simple backup and solve the physical paradox of the AI era, Ampace is aligning its semi-solid-state battery innovation with Eaton’s proven system intelligence.Ampace The “Shock Absorber” physics: semi-solid chemistry for AI pulses Conventional power systems were designed for steady-state loads, not the rapid heartbeat of a massive AI GPU cluster. When thousands of GPUs synchronize their computing cycles, they generate high-frequency, abrupt pulse loads that can lead to voltage sags, frequency oscillations, and potential interruptions of critical AI training. Ampace’s PU Series semi-solid and low-electrolyte cells address this challenge by acting as high-speed “shock absorbers.” Leveraging ultra-low internal resistance (DCR) and high cycle capability, these batteries neutralize millisecond-level power spikes at the source, stabilizing the local power loop before disturbances propagate upstream to the grid or on-site generators. These high-rate cells enable 100 kW+ racks to maintain peak performance without transmitting instability across the power chain. This capability aligns closely with Eaton’s matured UPS architectures, such as double-conversion topologies and advanced power electronics upgrades, which have long prioritized rapid load responsiveness and high system stability. Together, these approaches embody a shared industry philosophy: AI infrastructure requires energy systems capable of instantaneous response while safeguarding continuity and reliability. Ampace’s semi-solid state chemistry minimizes liquid electrolyte, greatly reducing the risk of leakage and thermal runaway under continuous AI high-load conditions.Ampace Algorithmic intelligence: synchronizing energy and control Hardware alone cannot solve the AI power paradox; the system also requires intelligent coordination between energy storage and power management. Sophisticated battery management systems (BMS) like Ampace’s high-precision design track state-of-charge (SOC) with high-speed sampling, even during rapid, shallow cycling typical in AI workloads. Complementary algorithmic approaches in modern UPS platforms — such as ramp-rate control and average power management — effectively suppress sub-synchronous oscillations and optimize load smoothing. In large-scale AI training environments, where thousands of GPUs can trigger millisecond-level power pulses, these intelligent layers ensure that batteries buffer high-frequency fluctuations without compromising the mandatory emergency backup reserves. By transforming energy storage from passive “standby insurance” into active, schedulable assets, the system simultaneously safeguards continuous AI training and maintains the long-term health of the data center infrastructure. In practical terms, this means that even during peak compute bursts, the infrastructure remains stable, training cycles continue uninterrupted, and operators avoid costly oversizing or grid stress. Eaton’s dual-layer algorithms serve as a valuable benchmark in this space, demonstrating how advanced control logic can achieve similar objectives, reinforcing Ampace’s approach and philosophy within the broader data center power ecosystem. Economic scalability: optimizing AI infrastructure efficiently One of the largest costs in deploying AI infrastructure is “oversizing”: procuring transformers, generators, and UPS systems to handle brief peak spikes. This traditional approach inflates the Total Cost of Ownership (TCO) and leads to wasted capital on underutilized hardware. Ampace’s turn-key cabinet design developed by its independent R&D is engineered for seamless compatibility with mature, high volume UPS systems. By leveraging Eaton’s double-conversion UPS topologies alongside intelligent ramp-rate and average power management algorithms, AI data centers can scale dynamically without requiring costly infrastructure redesigns. This approach allows the UPS and batteries to act as active load-shapers, smoothing AI-driven pulses while strictly maintaining mandatory emergency backup capacity. By utilizing energy storage as an active, schedulable asset, operators can right-size their infrastructure, avoid unnecessary grid upgrades, and deploy gigascale AI clusters with unprecedented efficiency. Safety First: Protecting AI Infrastructure While Enabling Innovation In high-density AI facilities, safety is non-negotiable. Ampace’s semi-solid state chemistry minimizes liquid electrolyte, greatly reducing the risk of leakage and thermal runaway under continuous AI high-load conditions. Ampace’s turn-key cabinet design developed by its independent R&D is engineered for seamless compatibility with mature, high volume UPS systems. Ampace At the same time, Eaton’s UPS design emphasizes system-level energy scheduling that never sacrifices mandatory emergency backup reserves, ensuring thermal safety and uninterrupted operation. This “safety-first” approach ensures that infrastructure can sustain aggressive performance targets without compromising the physical integrity of the facility. Coupled with over a decade of proven high-cycle life operation and design under shallow pulse conditions, these systems can extend operational lifespan, reduce replacement requirements, and provide operators with confidence that safety and reliability remain uncompromised as compute density continues to grow. To remain the scalable backbone of AI data centers As AI computing scales over the next two to three years, the industry will face stricter grid requirements and even more demanding pulse load characteristics. This evolution demands a forward-looking design philosophy that harmonizes UPS, battery, and grid compatibility. Ampace views current low-electrolyte semi-solid technologies as the optimal transitional step toward a fully solid-state future — one that promises ultimate safety and performance. Ampace remains committed to this long-term technological roadmap. We view current low-electrolyte semi-solid technologies as the optimal transitional step toward a fully solid-state future — one that promises ultimate safety and performance. Whether through rack-level BBU, integrated UPS systems, or containerized storage, the universal core of the AI era remains constant: high-speed response, long shallow-cycle life, and refined energy management. By engaging in deep technical exchanges with Eaton and leading energy innovators, Ampace ensures that its solutions not only meet today’s AI pulse challenges but also harmonize with broader infrastructure strategies and shared industry best practices. Ultimately, as traditional diesel generators gradually give way to diversified alternatives, the integrated UPS-plus-energy-storage system will become the fundamental infrastructure standard. The dialogue has just begun. Ampace will continue to engage in strategic exchanges with global industrial automation leaders and digital energy pioneers, co-authoring the playbook for a safer, more efficient, and more resilient AI-ready world.
More than 30 years ago, in the mountain village of Mbem in northwest Cameroon, the moon and stars in the night sky were the only light young Jude Numfor knew after the sunset. Electricity had not yet reached his rural community. “There was one person in the village with a petrol generator and a small television,” Numfor says. “When he turned it on, all the children would run to his house and peep through the window.” That memory became the spark for Numfor’s mission: to bring electricity to rural communities like his hometown. To accomplish his goal, in 2006 he cofounded Wireless Light and Power, since renamed Renewable Energy Innovators Cameroon, and he serves as its CEO. REI Cameroon designs, installs, and maintains solar minigrids for rural electrification. The minigrids use photovoltaic technology and battery-energy storage systems to generate electricity at 50 hertz. The electricity is distributed through smart meters. In 2017 the company received a grant from IEEE Smart Village to fund the expansion of REI’s minigrid operations and refine its business model. Smart Village supports projects and organizations bringing electricity and educational and employment opportunities to remote communities worldwide. The program is supported by IEEE societies and donations to the IEEE Foundation. The partnership has led to a collaboration developing open source metering, a free, community-driven way of tracking energy usage. Unlike proprietary utility meters, the system allows users, researchers, and utilities to view, customize, and verify how data is collected, ensuring transparency in billing, consumption tracking, and grid management. Smart Village’s support has been pivotal, Numfor says: “It’s not just about money. We share ideas, we get advice, and we have made friends. Entrepreneurship is lonely, but with the [Smart Village] community, it is different.” From teenage tinkerer to entrepreneur Numfor’s first experience of life with electricity was in 2001, after moving in with a missionary family in the small village of Allat. They used solar panels to power their whole home—an unimaginable luxury in Mbem. “I could watch TV, eat ice cream, and turn on lights,” he says. “It made me wish my brothers in Mbem had the same opportunity.” Numfor’s curiosity about electricity was ignited when a motion-sensor solar light in the family’s home stopped working. He tinkered with the device to find out why. “My missionary family told me to play with it like a toy,” he says, laughingly. “I replaced the dead battery with a motorcycle battery and was able to bring the power back for the night.” Jude Numfor [right] testing a rechargeable solar lantern, which aimed to replace hazardous kerosene lamps—known locally as “bush lamps.”REI Cameroon His missionary parents encouraged Numfor to study technology and engineering on his own, as none of the country’s universities offered solar energy educational programs at the time. They built him a library and stocked it with books on engineering, management, and entrepreneurship. In 2006, armed with his new knowledge, Numfor launched Wireless Light and Power with a friend, Ludwig Teichgraber. The nonprofit aimed to replace hazardous kerosene lamps—known locally as “bush lamps”—with rechargeable solar lanterns. These solar lanterns—called “light packs”—were built locally by Numfor and a team of 11 young Cameroonians using PVC pipes, nickel-metal hydride batteries, and LED bulbs. Families rented the lamps for a small fee, swapping discharged lamps for fully charged ones at solar-powered charging kiosks when they ran out of power. The kiosks then recharged the depleted lamps, making them available for the next swap. “The solar lantern was safer and cleaner, plus it gave children a chance to read at night,” Numfor explains. “People loved them.” Between 2006 and 2010, his team replicated the model across several villages. But when the global financial crisis hit in 2008, donor support dwindled, forcing the organization to evolve. “We pivoted from being an NGO to a commercial venture,” he says. “That’s how REI was born.” Building solar minigrids to serve community needs The new company’s goal was to move away from the lanterns and toward full electrification of communities. Villagers’ aspirations changed, Numfor says, as they now wanted to power their TVs, music systems, and mobile phones. In response, in 2010, REI developed one of the first solar minigrids in West Africa. Using locally procured components, the prototype supplied steady power to six households. The minigrid system used 12 123-watt solar photovoltaic panels manufactured by Sharp, 16 12-volt 100 ampere-hour automatic gain control lead acid batteries, and a Xantrex charge controller and inverter. Locally sourced wooden light poles were erected to distribute electricity throughout the village. REI charged each household a fee for the electricity. “It was a product-market-fit moment,” Numfor says. “People immediately asked, ‘When can we get this, too?’” The word-of-mouth, grassroots growth caught the attention of global partners. Numfor connected with Smart Village and in 2017, REI Cameroon received its first seed grant from the program. With that funding, Numfor was able to grow organically and attract additional grants, including one from the U.S. Trade Development Agency (USTDA), in partnership with the U.S. Department of Energy’s National Renewable Energy Laboratory. REI has since expanded to six villages, providing power to more than 1,000 households and businesses. With a dedicated team of 16 people, the company operates in multiple regions of the country, each with unique terrain, languages, and cultural dynamics. “It wasn’t easy,” he acknowledges. “I’m not an academic person—I had to learn everything by doing. [Smart Village] helped me structure the project and grow as an entrepreneur.” Today, Numfor pays it forward by sharing his Smart Village experience and mentoring new entrepreneurs. Launching a coalition for smart metering Minigrids can’t operate efficiently without clarifying operating rules to ensure quality service requirements and consumer protection, while also enabling reliable and effective monitoring of the system, Numfor says. “We need to know how power is being used, detect problems early, and manage the minigrid from a distance,” he explains. Existing commercial smart-meter providers offer limited and proprietary solutions. One major provider left the market, making their technology infrastructure obsolete. “It’s risky for an entire sector to depend on a few companies for such a critical technology,” Numfor says. In 2025, with the help of the Smart Village technical community, Numfor convened a consortium of open-source power advocates, including the Africa Mini-Grid Developers Association, EnAccess, Energy IOT, and NESL. The goal was to develop an open smart metering system that is accessible, transparent, and sustainable for all energy providers. “These organizations are collaborating as Open Advanced Metering Infrastructure [OpenAMI], which is about giving control back to the people who deliver the energy,” he says. Scaling for impact Numfor’s passion has grown from bringing light to local rural communities to bringing light to his entire country. Just 54 percent of Cameroon’s citizens have access to electricity, according to the International Energy Agency. For Numfor, the challenge is not just technological—it’s social and economic as well. “Electricity is the most important enabler of education and economic growth today,” he says. “When you have power, you unlock everything else.” “Electricity changed my life. Now I want to make sure every child can grow up with that same light.” —Jude Numfor Across the villages where REI has installed sustainable electricity solutions, small businesses are flourishing. Barbershops hum with community chatter, food vendors can preserve perishables, and entrepreneurs run companies such as phone-charging stations and small mills. “Some villages even have laundromats now,” Numfor says proudly. “Electricity creates jobs and changes mindsets.” Still, it has been a bumpy journey. It wasn’t until 2025 that REI obtained its official authorization (license) from Cameroon’s government to produce and distribute electricity in off-grid areas using solar minigrids. This was a major milestone because REI is one of the first private enterprises in the country to receive such authorization. “We were stuck between pilot projects and growth,” he explains. “Our projects were successful, and there was community demand for more, but to grow, we needed investors who require legal guarantees before committing funds. Now we can scale up and attract investors.” REI plans to expand its reach dramatically, beginning with 134 new villages identified through a feasibility study supported by the USTDA. Their long-term goal is to electrify 760 villages across Cameroon by 2031. While authorization opens doors, financing remains one of REI’s biggest challenges. “The minigrid space doesn’t attract venture capitalists easily,” Numfor notes. “Our return on investment is under 15 percent, so it’s not a typical tech startup model. The real return here is the impact” on the community. He hopes to attract investors who understand that access to electricity drives education, health care, and entrepreneurship. “There are people out there who want to make meaningful change,” he says. “We just need to connect with them. When you electrify a village, you never know who the next innovator will be. Maybe it’s another kid like me, looking through a window, dreaming.” Finding skilled staff is another challenge, Numfor says. To address this, REI developed an intensive recruitment and training process. “It used to take years to find the right people,” he says. “Now, we can identify who fits our company culture within six months.” Numfor’s wife, Angela Taliklong, who joined the venture in 2010, now oversees administration and human resources. A brighter Cameroon and beyond Numfor offers simple words of advice to other impact-driven entrepreneurs: Keep moving. “One of my mistakes early on was trying to be perfect,” he says. “I was spending time improving prototypes instead of increasing the number of our project installations and scaling how many communities we could electrify. You must keep momentum. Don’t wait until everything is perfect before you move forward.” That mindset, rooted in resilience and experimentation, has defined his journey. Rajan Kapur, president of Smart Village, says Numfor is a “shining example” of the program’s vision: “scalable and enduring impact through local entrepreneurs, local procurement, and community engagement based on the use of IEEE technology in underserved communities.” With the ongoing Smart Village partnership, Numfor is determined to bring light and opportunity to every corner of Cameroon, and beyond. He already has launched REI Nigeria. “Electricity changed my life,” he says. “Now I want to make sure every child can grow up with that same light.”