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Show HN: DomainTasker โ avoid losing domains and surprise renewals
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๐บ๐ธ ๋ฏธ๊ตญ ยท "DOMAINS" ยท ์ด 9๊ฑด
ํํฐ ๋ณด๊ธฐํ์ฌ ์ง์
48.8
0 = ๋ถ์ ์ฐ์ธ
50 = ์ค๋ฆฝ
100 = ๊ธ์ ์ฐ์ธ
์ต๊ทผ 7์ผ ๊ธฐ์ค 11,084๊ฑด์ ๋ถ์ํ ๊ฒฐ๊ณผ, ๋ด์ค ์ฌ๋ฆฌ์ง์๋ 48.8(๊ท ํ)์ ๋๋ค. ๊ธ์ 1,115๊ฑด(10.1%)ยท์ค๋ฆฝ 7,930๊ฑด(71.5%)ยท๋ถ์ 2,039๊ฑด(18.4%)์ด๋ฉฐ, ์ค๋ฆฝ ๋น์ค์ด ๋๋ ทํ๊ฒ ๋์ต๋๋ค. ์ฑํฅ ์ง์๋ ์ข ํฉ 21.8(๋ณด์ ๊ฒฝํฅ)์ ๋๋ค.
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Immigration attorneys are having to take down sites and social media channels as scammers use AI, deepfakes and cloned domains to impersonate them and scam clients.
More than ever, women are driving major changes in technology, media and markets. They donโt all have a CEO title, but they are unquestionably the masters of their domains.
A new report, first reported by PBS News, warns that November's midterm elections in the United States will drive "elevated" cyber threats to political organizations, fundraising and media platforms, and that some of the groundwork for election misinformation and disinformation likely is already being laid. Check Point, a cyber security company, found that in January of this year, approximately 1,300 newly registered domains contained the keyword "election," and approximately 2,957 contained "vote." Registering website domains...
Law enforcement intercepted VPN traffic, seized domains, and arrested its operator.
This sponsored article is brought to you by Applied Materials. At pivotal moments in history, progress has required more than individual brilliance. The most consequential breakthroughs โ such as those achieved under the Human Genome Project โ required a new operating paradigm: Concentrate the worldโs best talent around a single mission, establish a common platform, share critical infrastructure, and collapse feedback loops. When stakes are high and timelines are compressed, sequential and siloed innovation simply cannot keep pace. Todayโs AI era is creating an engineering race with similar demands. Every company is pushing to deliver higher-performance AI systems, faster. But performance is no longer defined by compute alone. AI workloads are increasingly dominated by the movement of data: In many cases, moving bits consumes as much โ or more โ energy than compute itself. As a result, reducing energy per bit can extend systemโlevel performance alongside gains in peak compute. The path to energyโefficient AI therefore runs through systemโlevel engineering, spanning three tightly interconnected domains: Logic, where performance per watt depends on efficient transistor switching, lowโloss power, and signal delivery through dense wiring stacks. Memory, where surging bandwidth and capacity demands expose the memory wall, with processor capability advancing faster than memory access. Advanced packaging, where 3D integration, chiplet architectures, and highโdensity interconnects bring compute and memory closer together โ enabling system designs monolithic scaling can no longer sustain. These domains can no longer be optimized independently. Gains in logic efficiency stall without sufficient memory bandwidth. Advances in memory bandwidth fall short if packaging cannot deliver proximity within thermal and mechanical constraints. Packaging, in turn, is constrained by the precision of both frontโend device fabrication and backโend integration processes. In the angstrom era, the hardest problems arise at the boundaries โ between compute and memory in the package, frontโend and backโend integration, and the tightly coupled process steps needed for precise 3D fabrication. And it is precisely this boundaryโdriven complexity where the traditional innovation model breaks down. The Traditional R&D Workflow Is Too Slow for AngstromโEra AI For decades, the semiconductor industryโs R&D model has resembled a relay race. Capabilities are developed in one part of the ecosystem, handed off downstream through integration and manufacturing, evaluated by chip and system designers, and only then fed back for the next iteration. That model worked when progress was dominated by relatively modular steps that could be scaled independently and simply dropped into the manufacturing flow. But the AI timeline has upended these rules. At angstromโscale dimensions, the physics enforces inescapable coupling across the entire stack: materials choices shape integration schemes; integration defines design rules; design rules dictate power delivery; wiring sets thermal budgets; and thermals ultimately constrain packaging scaling. System architects simply cannot wait 10โ15 years for each major semiconductor technology inflection to mature. Representing a roughly $5 billion investment, EPIC is the largest commitment to advanced semiconductor equipment R&D in U.S. history. A longโterm perspective is essential to align materials innovation with emerging device architectures โ and to develop the tools and processes required to integrate both with manufacturable precision. At Applied Materials, together with our customers, we are charting a course across the next 3โ4 generations, extending as far as 10 years down the roadmap. The angstrom era demands that we break down silos and bring together the industryโs best minds โ from leading companies to leading academic institutions. If the problem is coupled, the solution must be coupled. If the timeline is compressed, the learning loop must be compressed. Itโs not enough to just innovate โ we must innovate how we innovate. EPIC: A Center and Platform for HighโVelocity CoโInnovation This is the challenge that Applied Materials EPIC Center is designed to solve. Representing a roughly US $5 billion investment, EPIC is the largest commitment to advanced semiconductor equipment R&D in U.S. history. When it opens in 2026, it will deliver stateโofโtheโart cleanroom capabilities built from the ground up to shorten the path from earlyโstage research to fullโscale manufacturing. But the facilities are only one component of the model. EPIC is also a platform, an operating system for high-velocity coโinnovation that revolutionizes how ideas move from the lab to the fab. EPIC is a platform, an operating system for high-velocity coโinnovation that revolutionizes how ideas move from the lab to the fab.Applied Materials The EPIC model compresses the traditional workflow. Customer engineers work sideโbyโside with Applied technologists from day one โ moving beyond isolated process optimization and downstream handoffs. Within a shared, secure environment, EPIC tightly integrates atomistic modeling, test vehicles, process development, validation, and metrology feedback. Constraints that once surfaced late in development are identified and addressed early. The result is a potentially 2x faster path that benefits the entire ecosystem under one roof: Chipmakers gain earlier access to Appliedโs R&D portfolio, faster learning cycles, and accelerated transfer of nextโgeneration technologies into highโvolume manufacturing. Ecosystem partners gain earlier access to advanced manufacturing technology and collaboration opportunities that expand what is possible through materials innovation. Academic institutions gain opportunities to strengthen the labโtoโfab pipeline and help develop future semiconductor talent. Building on decades of coโdevelopment, we are reinventing the innovation pipeline with our partners across logic, memory, and advanced packaging to deliver the next leap in energyโefficient AI. Accelerating Advanced Logic Logic remains the engine of AI compute. In the angstrom era, however, systemโlevel gains are increasingly constrained by power and energy. Extending AI performance now depends on architectures that deliver more performance per watt โ accelerating the move to 3D devices such as gateโallโaround (GAA) transistors, which boost density within a compact footprint while preserving power efficiency. Architectures that deliver more performance per watt are accelerating the move to 3D devices such as gateโallโaround (GAA) transistors, and further out, complementary FETs (CFETs), which push density scaling even more.Applied Materials These architectural shifts are unfolding at unprecedented scale, with the logic roadmap already extending beyond firstโgeneration GAA toward more advanced designs. One key example is GAA with backside power delivery, which relocates thick power lines to the backside of the wafer, reducing resistive losses and freeing frontโside routing for tighter logic cell integration. Another example brings adjacent GAA PMOS and NMOS transistors closer together while inserting a dielectric isolation wall between them to minimize electrical interference. Further out, complementary FETs (CFETs) push density scaling even more by stacking PMOS and NMOS devices directly atop one another. While these architectures deliver compelling gains in performance per watt and logic density without relying solely on tighter lithography, they significantly raise integration complexity. Manufacturing a single GAA device today can involve more than 2,000 tightly interdependent process steps. At the same time, wiring stacks continue to grow taller and denser to connect these advanced logic devices. Modern leadingโedge GPUs now in development pack more than 300 billion transistors into an area little larger than a postage stamp, interconnected by over 2,000 miles of wiring. Modern leadingโedge GPUs now in development pack more than 300 billion transistors into an area little larger than a postage stamp, interconnected by over 2,000 miles of wiring.Applied Materials At this level of complexity, the process steps used to create these precise 3D devices and wiring stacks cannot be optimized independently. Design and process must evolve in lockstep, and materials innovation and fabrication methods must advance alongside device architecture. EPICโs coโinnovation model is designed to accelerate exactly this convergence โ enabling logic compute to continue advancing the frontiers of AI at the pace the roadmap demands. Powering the Memory Roadmap At the same time, the AI computing era is fundamentally reshaping how data is generated, moved, and processed โ making memory technologies, especially DRAM, central to delivering the energyโefficient performance AI systems require. As models grow larger and more dataโhungry, the DRAM roadmap is shifting toward architectures that deliver higher density, greater bandwidth, and faster access per watt. At the DRAM cell level, AI performance requirements are driving a transition from 6Fยฒ buriedโchannel array transistors (BCAT) to more compact 4Fยฒ, and beyond that, architectures that move past what 2D scaling alone can deliver. Applied Materials At the DRAM cell level, this shift is driving a transition from 6Fยฒ buriedโchannel array transistors (BCAT) to more compact 4Fยฒ architectures, which orient the transistor vertically to boost density and reduce chip area. Looking beyond 4Fยฒ, sustaining gains in performance per watt will require moving past what 2D scaling alone can deliver. The industry is therefore turning to 3D DRAM, stacking memory cells vertically to add capacity within a constrained footprint. As these structures grow taller and aspect ratios intensify, high-mobility materials engineering in three dimensions becomes increasingly critical to performance and reliability. Beyond the memory cell array, another powerful lever for DRAM scaling is shrinking the peripheral circuitry, which includes logic transistors and interconnect wiring. One emerging approach places select periphery functions beneath the DRAM array by bonding two wafers โ one optimized for the DRAM cells and the other for CMOS logic โ using multiple wiring layers. Beyond the memory cell array, another powerful lever for DRAM scaling is shrinking the peripheral circuitry, which includes logic transistors and interconnect wiring.Applied Materials In parallel, DRAM performance is being extended by leveraging logicโproven enhancers in the memory periphery. These include mobility boosters such as embedded silicon germanium and stress films, along with wiring upgrades like improved lowโk dielectrics and advanced copper interconnects. Memory manufacturers are also transitioning periphery transistors from planar devices to FinFET architectures, following the logic roadmap to further improve I/O speed. These valuable inflections are central to EPICโs mission โ where they can be co-developed and rapidly validated for nextโgeneration memory systems. Driving System Scaling With Advanced Packaging As data movement becomes the dominant energy cost in AI systems, advanced packaging has emerged as a critical lever for improving systemโlevel efficiencyโshortening interconnect distances, increasing bandwidth density, and reducing the power required to move data between logic and memory. The rise of 3D packages such as highโbandwidth memory (HBM) underscores why advanced packaging is becoming central to the AI era.Applied Materials Highโbandwidth memory (HBM) marks a major inflection along this path. By stacking DRAM dies โ scaling to 16 layers and beyond โ and placing memory much closer to the processor, HBM enables rapid access to everโlarger working datasets. This delivers stepโfunction gains in both bandwidth and energy efficiency. More broadly, the rise of 3D packages such as HBM underscores why advanced packaging is becoming central to the AI era. Packaging now addresses systemโlevel constraints that logic and memory device scaling alone can no longer overcome. It also enables a move away from monolithic systemsโonโchip toward chipletโbased architectures, as AI workloads increasingly demand flexible designs that combine logic, memory, and specialized accelerators optimized for specific tasks. A vital technology powering this roadmap is hybrid bonding. With interconnect pitches approaching those of onโchip wiring, conventional bumps and microbumps run into fundamental limits in density, power, and signal integrity. Hybrid bonding removes these barriers by allowing dramatically higher interconnect and I/O density, supporting a broad range of chiplet architectures โ from memory stacking to tighter computeโmemory integration. EPIC tackles highโvalue advancedโpackaging challenges through early, parallel coโinnovation across materials, integration, and manufacturing.Applied Materials As bonded structures like HBM stacks grow larger and more complex, warpage control, die placement, stack alignment, and thermal management become firstโorder challenges. EPIC tackles these and other highโvalue advancedโpackaging challenges through early, parallel coโinnovation across materials, integration, and manufacturing. Bringing It All Together Across logic, memory, and advanced packaging, our industry faces an ambitious roadmap that promises significant gains in energy efficiency for AI systems. But realizing that potential demands breakthrough materials innovation at a time when feature sizes are shrinking, interfaces are multiplying, and process interdependencies are escalating. These challenges cannot be solved on 10โ15โyear timelines under the traditional relayโrace model. We must break down silos, align earlier across the ecosystem, and parallelize learning to keep pace with AIโs demands. In the AI era, progress will be defined by the speed at which lightbulb moments turn into manufacturing and commercialization reality. The only viable path forward is a new innovation model โ and EPIC is how we are driving it.
This article is brought to you by DAIMON Robotics. This April, Hong Kong-based DAIMON Robotics has released Daimon-Infinity, which it describes as the largest omni-modal robotic dataset for physical AI, featuring high resolution tactile sensing and spanning a wide range of tasks from folding laundry at home to manufacturing on factory assembly lines. The project is supported by collaborative efforts of partners across China and the globe, including Google DeepMind, Northwestern University, and the National University of Singapore. The move signals a key strategic initiative for DAIMON, a two-and-a-half-year-old company known for its advanced tactile sensor hardware, most notably a monochromatic, vision-based tactile sensor that packs over 110,000 effective sensing units into a fingertip-sized module. Drawing on its high-resolution tactile sensing technology and a distributed out-of-lab collection network capable of generating millions of hours of data annually, DAIMON is building large-scale robot manipulation datasets that include vast amounts of tactile sensing data. To accelerate the real-world deployment of embodied AI, the company has also open-sourced 10,000 hours of its data. Prof. Michael Yu Wang, co-founder and chief scientist at DAIMON Robotics, has pioneered Vision-Tactile-Language-Action (VTLA) architecture, elevating the tactile to a modality on par with vision.DAIMON Robotics Behind the strategy is Prof. Michael Yu Wang, DAIMONโs co-founder and chief scientist. Prof. Wang earned his PhD at Carnegie Mellon โ studying manipulation under Matt Mason โ and went on to found the Robotics Institute at the Hong Kong University of Science and Technology. An IEEE Fellow and former Editor-in-Chief of IEEE Transactions on Automation Science and Engineering, he has spent roughly four decades in the field. His objective is to address the missing โinsensitivityโ of robot manipulation, which practically relies on the dominant Vision-Language-Action (VLA) model. He and his team have pioneered Vision-Tactile-Language-Action (VTLA) architecture, elevating the tactile to a modality on par with vision. We spoke with Prof. Wang about how tactile feedback aims to change dexterous manipulation, how the dataset initiative is foreseen to improve our understanding of robotic hands in natural environments, and where โ from hotels to convenience stores in China โ he sees touch-enabled robots making their first real-world inroads. Daimon-Infinity is the worldโs largest omni-modal dataset for Physical AI, featuring million-hour scale multimodal data, ultra-high-res tactile feedback, data from 80+ real scenarios and 2,000+ human skills, and more.DAIMON Robotics The Dataset Initiative This month, DAIMON Robotics released the largest and most comprehensive robotic manipulation dataset with multiple leading academic institutions and enterprises. Why releasing the dataset now, rather than continuing to focus on product development? What impact will this have on the embodied intelligence industry? DAIMON Robotics has been around for almost two and a half years. We have been committed to developing high-resolution, multimodal tactile sensing devices to perceive the interaction between a robotโs hand (particularly its fingertips) and objects. Our devices have become quite robust. They are now accepted and used by a large segment of users, including academic and research institutes as well as leading humanoid robotics companies. As embodied AI continues to advance, the critical role of data has been clearer. Data scarcity remains a primary bottleneck in robot learning, particularly the lack of physical interaction data, which is essential for robots to operate effectively in the real world. Consequently, data quality, reliability, and cost have become major concerns in both research and commercial development. This is exactly where DAIMON excels. Our vision-based tactile technology captures high-quality, multimodal tactile data. Beyond basic contact forces, it records deformation, slip and friction, material properties and surface textures โ enabling a comprehensive reconstruction of physical interactions. Building on our expertise in multimodal fusion, we have developed a robust data processing pipeline that seamlessly integrates tactile feedback with vision, motion trajectories, and natural language, transforming raw inputs into training-ready dataset for machine learning models. Recognizing the industry-wide data gap, we view large-scale data collection not only as our unique competitive advantage, but as a responsibility to the broader community. By building and open-sourcing the dataset, we aim to provide the high-quality โfuelโ needed to power embodied AI, ultimately accelerating the real-world deployment of general-purpose robotic foundation models. The robotics industry is highly competitive, and many teams have chosen to focus on data. DAIMON is releasing a large and highly comprehensive cross-embodiment, vision-based tactile multimodal robotic manipulation dataset. How were you able to achieve this? We have a dedicated in-house team focused on expanding our capabilities, including building hardware devices and developing our own large-scale model. Although we are a relatively small company, our core tactile sensing technology and innovative data collection paradigm enable us to build large-scale dataset. Our approach is to broaden our offering. We have built the worldโs largest distributed out-of-lab data collection network. Rather than relying on centralized data factories, this lightweight and scalable system allows data to be gathered across diverse real-world environments, enabling us to generate millions of hours of data per year. โTo drive the advancement of the entire embodied AI field, we have open-sourced 10,000 hours of the dataset for the broader community.โ โProf. Michael Yu Wang, DAIMON Robotics This dataset is being jointly developed with several institutions worldwide. What roles did they play in its development, and how will the dataset benefit their research and products? Besides China based teams, our partners include leading research groups from universities, such as Northwestern University and the National University of Singapore, as well as top global enterprises like Google DeepMind and China Mobile. Their decision to partner with DAIMON is a strong testament to the value of our tactile-rich dataset. Among the companies involved there are some that have already built their own models but are now incorporating tactile information. By deploying our data collection devices across research, manufacturing and other real-world scenarios, they help us to gather highly practical, application-driven data. In turn, our partners leverage the data to train models tailored to their specific use cases. Furthermore, to drive the advancement of the entire embodied AI field, we have open-sourced 10,000 hours of the dataset for the broader community. Equipped with Daimonโs visuotactile sensor, the gripper delicately senses contact and precisely controls force to pick up a fragile eggshell.Daimon Robotics From VLA to VTLA: Why Tactile Sensing Changes the Equation The mainstream paradigm in robotics is currently the Vision-Language-Action (VLA) model, but your team has proposed a Vision-Tactile-Language-Action (VTLA) model. Why is it necessary to incorporate tactile sensing? What does it enable robots to achieve, and which tasks are likely to fail without tactile feedback? Over these years of working to make generalist robots capable of performing manipulation tasks, especially dexterous manipulation โ not just power grasping or holding an object, but manipulating objects and using tools to impart forces and motion onto parts โ we see these robots being used in household as well as industrial assembly settings. It is well established that tactile information is essential for providing feedback about contact states so that robots can guide their hands and fingers to perform reliable manipulation. Without tactile sensing, robots are severely limited. They struggle to locate objects in dark environments, and without slip detection, they can easily drop fragile items like glass. Furthermore, the inability to precisely control force often leads to failed manipulation tasks or, in severe cases, physical damage. Naturally, the VLA approach needs to be enhanced to incorporate tactile information. We expanded the VLA framework to incorporate tactile data, creating the VTLA model. An additional benefit of our tactile sensor is that it is vision-based: We capture visual images of the deformation on the fingertip surface. We capture multiple images in a time sequence that encodes contact information, from which we can infer forces and other contact states. This aligns well with the visual framework that VLA is based upon. Having tactile information in a visual image format makes it naturally suitable for integration into the VLA framework, transforming it into a VTLA system. That is the key advantage: Vision-based tactile sensors provide very high resolution at the pixel level, and this data can be incorporated into the framework, whether it is an end-to-end model or another type of architecture. DAIMON has been known for its vision-based tactile sensors that can pack over 110,000 effective sensing units.DAIMON Robotics The Technology: Monochromatic Vision-based Tactile Sensing You and your team have spent many years deeply engaged in vision-based tactile sensing and have developed the worldโs first monochromatic vision-based tactile sensing technology. Why did you choose this technical path? Once we started investigating tactile sensors, we understood our needs. We wanted sensors that closely mimic what we have under our fingertip skin. Physiological studies have well documented the capabilities humans have at their fingertips โ knowing what we touch, what kind of material it is, how forces are distributed, and whether it is moving into the right position as our brain controls our hands. We knew that replicating these capabilities on a robot handโs fingertips would help considerably. When we surveyed existing technologies, we found many types, including vision-based tactile sensors with tri-color optics and other simpler designs. We decided to integrate the best of these into an engineering-robust solution that works well without being overly complicated, keeping cost, reliability, and sensitivity within a satisfactory range, thus ultimately developing a monochromatic vision-based tactile sensing technique. This is fundamentally an engineering approach rather than a purely scientific one, since a great deal of foundational research already existed. With the growing realization of the necessity of tactile data, all of this will advance hand in hand. DAIMON vision-based tactile sensor captures high-quality, multimodal tactile data.DAIMON Robotics Last year, DAIMON launched a multi-dimensional, high-resolution, high-frequency vision-based tactile sensor. Compared with traditional tactile sensors, where does its core advantage lie? Which industries could it potentially transform? The key features of our sensors are the density of distributed force measurement and the deformation we can capture over the area of a fingertip. I believe we have the highest density in terms of sensing units. That is one very important metric. The other is dynamics: the frequency and bandwidth โ how quickly we can detect force changes, transmit signals, and process them in real time. Other important aspects are largely engineering-related, such as reliability, drift, durability of the soft surface, and resistance to interference from magnetic, optical, or environmental factors. A growing number of researchers and companies are recognizing the importance of tactile sensing and adopting our technology. I believe the advances in tactile sensing will elevate the entire community and industry to a higher level. One of our potential customers is deploying humanoid robots in a small convenience store, with densely packed shelves where shelf space is at a premium. The robot needs to reach into very tight spaces โ tighter than books on a shelf โ to pick out an object. Current two-jaw parallel grippers cannot fit into most of these spaces. Observing how humans pick up objects, you clearly need at least three slim fingers to touch and roll the object toward you and secure it. Thus, we are starting to see very specific needs where tactile sensing capabilities are essential. From Academia to Startup After 40 years in academia โ founding the HKUST Robotics Institute, earning prestigious honors including IEEE Fellow, and serving as Editor-in-Chief of IEEE TASE โ what motivated you to found DAIMON Robotics? I have come a long way. I started learning robotics during my PhD at Carnegie Mellon, where there were truly remarkable groups working on locomotion under Marc Raibert, who founded Boston Dynamics, and on manipulation under my advisor, Matt Mason, a leader in the field. We have been working on dexterous manipulation, not only at Carnegie Mellon, but globally for many years. However, progress has been limited for a long time, especially in building dexterous hands and making them work. Only recently have locomotion robots truly taken off, and only in the last few years have we begun to see major advancements in robot hands. There is clearly room for advancing manipulation capabilities, which would enable robots to do work like humans. While at Hong Kong University of Science and Technology, I saw increasingly greater people entering this area in the form of students and postdoctoral researchers. We wanted to jumpstart our effort by leveraging the available capital and talent resources. Fortunately, one of my postdocs, Dr. Duan Jianghua, has a strong sense for commercial opportunities. Recognizing the rapid growth of robotics market and the unique value that our vision-based tactile sensing technology could bring, together we started DAIMON Robotics, and it has progressed well. The community has grown tremendously in China, Japan, Korea, the U.S., and Europe. Robots equipped with DAIMON technology have been deployed in factory settings. The company aims to enable robots to achieve โembodied intelligenceโ and close the gap between what they can see and what they can feel.DAIMON Robotics Business Model and Commercial Strategy What is DAIMONโs current business model and strategic focus? What role does the dataset release play in your commercial strategy? We started as a device company focused on making highly capable tactile sensors, especially for robot hands. But as technology and business developed, everyone realized it is not just about one component, rather the entire technology chain: devices, data of adequate quality and quantity, and finally the right framework to build, train, and deploy models on robots in real application environments. Our business strategy is best described as โ3Dโ: Devices, Data, and Deployment. We build devices for data collection, our own ecosystem, and for deploying them in our partnersโ potential application domains. This enables the collection of real-world tactile-rich data and complete closed-loop validation. This will become an integral part of the 3D business model. Most startups in this space are following a similar path until eventually some may become more specialized or more tightly integrated with other companies. For now, it is mostly vertical integration. Embodied Skills and the Convergence Moment Youโve introduced the concept of โembodied skillsโ as essential for humanoid robots to move beyond having just an advanced AI โbrain.โ What prompted this insight? What new capabilities could embodied skills enable? After the rapid evolution of models and hardware over the past two years, has your definition or roadmap for embodied skills evolved? We have come a long way now see a convergence point where electrical, electronic, and mechatronic hardware technologies have advanced tremendously in last two decades. Robots are now fully electric, do not require hydraulics, because hardware has evolved rapidly. Modern electronics provide tremendous bandwidth with high torques. If we can build intelligence into these systems, we can create truly humanoid robots with the ability to operate in unstructured environments, make decisions, and take actions autonomously. โOur vision is for robots to achieve robust manipulation capabilities and evolve into reliable partners for humans.โ โProf. Michael Yu Wang, DAIMON Robotics AI has arrived at exactly the right time. Enormous resources have been invested in AI development, especially large language models, which are now being generalized into world models that enable physical AI capabilities. We would like to see these manifested in real-world systems. While both AI and core hardware technologies continue to evolve, the focus is much clearer now. For example, human-sized robots are preferred in a home environment. This is an exciting domain with a promise of great societal benefit if we can eventually achieve safe, reliable, and cost-effective robots. The Road to Real-World Deployment Today, many robots can deliver impressive demos, yet there remains a gap before they truly enter real-world applications. What could be a potential trigger for real-world deployment? Which scenarios are most likely to achieve large-scale deployment first? I think the road toward large-scale deployment of generalist robots is still long, but we are starting to see signs of feasibility within specific domains. It is very similar to autonomous vehicles, where we are yet to see full deployment of robo-taxis, while we have already started to find mobile robots and smaller vehicles widely deployed in the hospitality industry. Virtually every major hotel in China now has a delivery robot โ no arms, just a vehicle that picks up items from the hotel lobby (e.g., food deliveries). The delivery person just loads the food and selects the room number. It is up to the robot thereafter to navigate and reach the guestโs room, which includes using the elevator, to deliver the food. This is already nearly 100 percent deployed in major Chinese hotels. Hotel and restaurant robots are viewed as a model for deploying humanoid robots in specific domains like overnight drugstores and convenience stores. I expect complete deployment in such settings within a short timeframe, followed by other applications. Overall, we can expect autonomous robots, including humanoids, to progressively penetrate specific sectors, delivering value in each and expanding into others. Ultimately, our vision is for robots to achieve robust manipulation capabilities and evolve into reliable partners for humans. By seamlessly integrating into our homes and daily lives, they will genuinely benefit and serve humanity. This interview has been edited for length and clarity.
When it comes to AI models, size matters. Even though some artificial-intelligence experts warn that scaling up large language models (LLMs) is hitting diminishing performance returns, companies are still coming out with ever larger AI tools. Metaโs latest Llama release had a staggering 2 trillion parameters that define the model. As models grow in size, their capabilities increase. But so do the energy demands and the time it takes to run the models, which increases their carbon footprint. To mitigate these issues, people have turned to smaller, less capable models and using lower-precision numbers whenever possible for the model parameters. But there is another path that may retain a staggeringly large modelโs high performance while reducing the time it takes to run an energy footprint. This approach involves befriending the zeros inside large AI models. For many models, most of the parametersโthe weights and activationsโare actually zero, or so close to zero that they could be treated as such without losing accuracy. This quality is known as sparsity. Sparsity offers a significant opportunity for computational savings: Instead of wasting time and energy adding or multiplying zeros, these calculations could simply be skipped; rather than storing lots of zeros in memory, one need only store the nonzero parameters. Unfortunately, todayโs popular hardware, like multicore CPUs and GPUs, do not naturally take full advantage of sparsity. To fully leverage sparsity, researchers and engineers need to rethink and re-architect each piece of the design stack, including the hardware, low-level firmware, and application software. In our research group at Stanford University, we have developed the first (to our knowledge) piece of hardware thatโs capable of calculating all kinds of sparse and traditional workloads efficiently. The energy savings varied widely over the workloads, but on average our chip consumed one-seventieth the energy of a CPU, and performed the computation on average eight times as fast. To do this, we had to engineer the hardware, low-level firmware, and software from the ground up to take advantage of sparsity. We hope this is just the beginning of hardware and model development that will allow for more energy-efficient AI. What is sparsity? Neural networks, and the data that feeds into them, are represented as arrays of numbers. These arrays can be one-dimensional (vectors), two-dimensional (matrices), or more (tensors). A sparse vector, matrix, or tensor has mostly zero elements. The level of sparsity varies, but when zeroes make up more than 50 percent of any type of array, it can stand to benefit from sparsity-specific computational methods. In contrast, an object that is not sparseโthat is, it has few zeros compared with the total number of elementsโis called dense. Sparsity can be naturally present, or it can be induced. For example, a social-network graph will be naturally sparse. Imagine a graph where each node (point) represents a person, and each edge (a line segment connecting the points) represents a friendship. Since most people are not friends with one another, a matrix representing all possible edges will be mostly zeros. Other popular applications of AI, such as other forms of graph learning and recommendation models, contain naturally occurring sparsity as well. Beyond naturally occurring sparsity, sparsity can also be induced within an AI model in several ways. Two years ago, a team at Cerebras showed that one can set up to 70 to 80 percent of parameters in an LLM to zero without losing any accuracy. Cerebras demonstrated these results specifically on Metaโs open-source Llama 7B model, but the ideas extend to other LLM models like ChatGPT and Claude. The case for sparsity Sparse computationโs efficiency stems from two fundamental properties: the ability to compress away zeros and the convenient mathematical properties of zeros. Both the algorithms used in sparse computation and the hardware dedicated to them leverage these two basic ideas. First, sparse data can be compressed, making it more memory efficient to store โsparselyโโthat is, in something called a sparse data type. Compression also makes it more energy efficient to move data when dealing with large amounts of it. This is best understood by an example. Take a four-by-four matrix with three nonzero elements. Traditionally, this matrix would be stored in memory as is, taking up 16 spaces. This matrix can also be compressed into a sparse data type, getting rid of the zeros and saving only the nonzero elements. In our example, this results in 13 memory spaces as opposed to 16 for the dense, uncompressed version. These savings in memory increase with increased sparsity and matrix size. In addition to the actual data values, compressed data also requires metadata. The row and column locations of the nonzero elements also must be stored. This is usually thought of as a โfibertreeโ: The row labels containing nonzero elements are listed and linked to the column labels of the nonzero elements, which are then linked to the values stored in those elements. In memory, things get a bit more complicated still: The row and column labels for each nonzero value must be stored as well as the โsegmentsโ that indicate how many such labels to expect, so the metadata and data can be clearly delineated from one another. In a dense, noncompressed matrix data type, values can be accessed either one at a time or in parallel, and their locations can be calculated directly with a simple equation. However, accessing values in sparse, compressed data requires looking up the coordinates of the row index and using that information to โindirectlyโ look up the coordinates of the column index before finally reaching the value. Depending on the actual locations of the sparse data values, these indirect lookups can be extremely random, making the computation data-dependent and requiring the allocation of memory lookups on the fly. Second, two mathematical properties of zero let software and hardware skip a lot of computation. Multiplying any number by zero will result in a zero, so thereโs no need to actually do the multiplication. Adding zero to any number will always return that number, so thereโs no need to do the addition either. In matrix-vector multiplication, one of the most common operations in AI workloads, all computations except those involving two nonzero elements can simply be skipped. Take, for example, the four-by-four matrix from the previous example and a vector of four numbers. In dense computation, each element of the vector must be multiplied by the corresponding element in each row and then added together to compute the final vector. In this case, that would take 16 multiplication operations and 16 additions (or four accumulations). In sparse computation, only the nonzero elements of the vector need be considered. For each nonzero vector element, indirect lookup can be used to find any corresponding nonzero matrix element, and only those need to be multiplied and added. In the example shown here, only two multiplication steps will be performed, instead of 16. The trouble with GPUs and CPUs Unfortunately, modern hardware is not well suited to accelerating sparse computation. For example, say we want to perform a matrix-vector multiplication. In the simplest case, in a single CPU core, each element in the vector would be multiplied sequentially and then written to memory. This is slow, because we can do only one multiplication at a time. So instead people use CPUs with vector support or GPUs. With this hardware, all elements would be multiplied in parallel, greatly speeding up the application. Now, imagine that both the matrix and vector contain extremely sparse data. The vectorized CPU and GPU would spend most of their efforts multiplying by zero, performing completely ineffectual computations. Newer generations of GPUs are capable of taking some advantage of sparsity in their hardware, but only a particular kind, called structured sparsity. Structured sparsity assumes that two out of every four adjacent parameters are zero. However, some models benefit more from unstructured sparsityโthe ability for any parameter (weight or activation) to be zero and compressed away, regardless of where it is and what it is adjacent to. GPUs can run unstructured sparse computation in software, for example, through the use of the cuSparse GPU library. However, the support for sparse computations is often limited, and the GPU hardware gets underutilized, wasting energy-intensive computations on overhead. Petra Pรฉterffy When doing sparse computations in software, modern CPUs may be a better alternative to GPU computation, because they are designed to be more flexible. Yet, sparse computations on the CPU are often bottlenecked by the indirect lookups used to find nonzero data. CPUs are designed to โprefetchโ data based on what they expect theyโll need from memory, but for randomly sparse data, that process often fails to pull in the right stuff from memory. When that happens, the CPU must waste cycles calling for the right data. Apple was the first to speed up these indirect lookups by supporting a method called an array-of-pointers access pattern in the prefetcher of their A14 and M1 chips. Although innovations in prefetching make Apple CPUs more competitive for sparse computation, CPU architectures still have fundamental overheads that a dedicated sparse computing architecture would not, because they need to handle general-purpose computation. Other companies have been developing hardware that accelerates sparse machine learning as well. These include Cerebrasโs Wafer Scale Engine and Metaโs Training and Inference Accelerator (MTIA). The Wafer Scale Engine, and its corresponding sparse programming framework, have shown incredibly sparse results of up to 70 percent sparsity on LLMs. However, the companyโs hardware and software solutions support only weight sparsity, not activation sparsity, which is important for many applications. The second version of the MTIA claims a sevenfold sparse compute performance boost over the MTIA v1. However, the only publicly available information regarding sparsity support in the MTIA v2 is for matrix multiplication, not for vectors or tensors. Although matrix multiplications take up the majority of computation time in most modern ML models, itโs important to have sparsity support for other parts of the process. To avoid switching back and forth between sparse and dense data types, all of the operations should be sparse. Onyx Instead of these halfway solutions, our team at Stanford has developed a hardware accelerator, Onyx, that can take advantage of sparsity from the ground up, whether itโs structured or unstructured. Onyx is the first programmable accelerator to support both sparse and dense computation; itโs capable of accelerating key operations in both domains. To understand Onyx, it is useful to know what a coarse-grained reconfigurable array (CGRA) is and how it compares with more familiar hardware, like CPUs and field-programmable gate arrays (FPGAs). CPUs, CGRAs, and FPGAs represent a trade-off between efficiency and flexibility. Each individual logic unit of a CPU is designed for a specific function that it performs efficiently. On the other hand, since each individual bit of an FPGA is configurable, these arrays are extremely flexible, but very inefficient. The goal of CGRAs is to achieve the flexibility of FPGAs with the efficiency of CPUs. CGRAs are composed of efficient and configurable units, typically memory and compute, that are specialized for a particular application domain. This is the key benefit of this type of array: Programmers can reconfigure the internals of a CGRA at a high level, making it more efficient than an FPGA but more flexible than a CPU. The Onyx chip, built on a coarse-grained reconfigurable array (CGRA), is the first (to our knowledge) to support both sparse and dense computations. Olivia Hsu Onyx is composed of flexible, programmable processing element (PE) tiles and memory (MEM) tiles. The memory tiles store compressed matrices and other data formats. The processing element tiles operate on compressed matrices, eliminating all unnecessary and ineffectual computation. The Onyx compiler handles conversion from software instructions to CGRA configuration. First, the input expressionโfor instance, a sparse vector multiplicationโis translated into a graph of abstract memory and compute nodes. In this example, there are memories for the input vectors and output vectors, a compute node for finding the intersection between nonzero elements, and a compute node for the multiplication. The compiler figures out how to map the abstract memory and compute nodes onto MEMs and PEs on the CGRA, and then how to route them together so that they can transfer data between them. Finally, the compiler produces the instruction set needed to configure the CGRA for the desired purpose. Since Onyx is programmable, engineers can map many different operations, such as vector-vector element multiplication, or the key tasks in AI, like matrix-vector or matrix-matrix multiplication, onto the accelerator. We evaluated the efficiency gains of our hardware by looking at the product of energy used and the time it took to compute, called the energy-delay product (EDP). This metric captures the trade-off of speed and energy. Minimizing just energy would lead to very slow devices, and minimizing speed would lead to high-area, high-power devices. Onyx achieves up to 565 times as much energy-delay product over CPUs (we used a 12-core Intel Xeon CPU) that utilize dedicated sparse libraries. Onyx can also be configured to accelerate regular, dense applications, similar to the way a GPU or TPU would. If the computation is sparse, Onyx is configured to use sparse primitives, and if the computation is dense, Onyx is reconfigured to take advantage of parallelism, similar to how GPUs function. This architecture is a step toward a single system that can accelerate both sparse and dense computations on the same silicon. Just as important, Onyx enables new algorithmic thinking. Sparse acceleration hardware will not only make AI more performance- and energy efficient but also enable researchers and engineers to explore new algorithms that have the potential to dramatically improve AI. The future with sparsity Our team is already working on next-generation chips built off of Onyx. Beyond matrix multiplication operations, machine learning models perform other types of math, like nonlinear layers, normalization, the softmax function, and more. We are adding support for the full range of computations on our next-gen accelerator and within the compiler. Since sparse machine learning models may have both sparse and dense layers, we are also working on integrating the dense and sparse accelerator architecture more efficiently on the chip, allowing for fast transformation between the different data types. Weโre also looking at ways to manage memory constraints by breaking up the sparse data more effectively so we can run computations on several sparse accelerator chips. We are also working on systems that can predict the performance of accelerators such as ours, which will help in designing better hardware for sparse AI. Longer term, weโre interested in seeing whether high degrees of sparsity throughout AI computation will catch on with more model types, and whether sparse accelerators become adopted at a larger scale. Building the hardware to unstructured sparsity and optimally take advantage of zeros is just the beginning. With this hardware in hand, AI researchers and engineers will have the opportunity to explore new models and algorithms that leverage sparsity in novel and creative ways. We see this as a crucial research area for managing the ever-increasing runtime, costs, and environmental impact of AI.
Andrew Ng has serious street cred in artificial intelligence. He pioneered the use of graphics processing units (GPUs) to train deep learning models in the late 2000s with his students at Stanford University, cofounded Google Brain in 2011, and then served for three years as chief scientist for Baidu, where he helped build the Chinese tech giantโs AI group. So when he says he has identified the next big shift in artificial intelligence, people listen. And thatโs what he told IEEE Spectrum in an exclusive Q&A. Ngโs current efforts are focused on his company Landing AI, which built a platform called LandingLens to help manufacturers improve visual inspection with computer vision. He has also become something of an evangelist for what he calls the data-centric AI movement, which he says can yield โsmall dataโ solutions to big issues in AI, including model efficiency, accuracy, and bias. Andrew Ng on... Whatโs next for really big models The career advice he didnโt listen to Defining the data-centric AI movement Synthetic data Why Landing AI asks its customers to do the work The great advances in deep learning over the past decade or so have been powered by ever-bigger models crunching ever-bigger amounts of data. Some people argue that thatโs an unsustainable trajectory. Do you agree that it canโt go on that way? Andrew Ng: This is a big question. Weโve seen foundation models in NLP [natural language processing]. Iโm excited about NLP models getting even bigger, and also about the potential of building foundation models in computer vision. I think thereโs lots of signal to still be exploited in video: We have not been able to build foundation models yet for video because of compute bandwidth and the cost of processing video, as opposed to tokenized text. So I think that this engine of scaling up deep learning algorithms, which has been running for something like 15 years now, still has steam in it. Having said that, it only applies to certain problems, and thereโs a set of other problems that need small data solutions. When you say you want a foundation model for computer vision, what do you mean by that? Ng: This is a term coined by Percy Liang and some of my friends at Stanford to refer to very large models, trained on very large data sets, that can be tuned for specific applications. For example, GPT-3 is an example of a foundation model [for NLP]. Foundation models offer a lot of promise as a new paradigm in developing machine learning applications, but also challenges in terms of making sure that theyโre reasonably fair and free from bias, especially if many of us will be building on top of them. What needs to happen for someone to build a foundation model for video? Ng: I think there is a scalability problem. The compute power needed to process the large volume of images for video is significant, and I think thatโs why foundation models have arisen first in NLP. Many researchers are working on this, and I think weโre seeing early signs of such models being developed in computer vision. But Iโm confident that if a semiconductor maker gave us 10 times more processor power, we could easily find 10 times more video to build such models for vision. Having said that, a lot of whatโs happened over the past decade is that deep learning has happened in consumer-facing companies that have large user bases, sometimes billions of users, and therefore very large data sets. While that paradigm of machine learning has driven a lot of economic value in consumer software, I find that that recipe of scale doesnโt work for other industries. Back to top Itโs funny to hear you say that, because your early work was at a consumer-facing company with millions of users. Ng: Over a decade ago, when I proposed starting the Google Brain project to use Googleโs compute infrastructure to build very large neural networks, it was a controversial step. One very senior person pulled me aside and warned me that starting Google Brain would be bad for my career. I think he felt that the action couldnโt just be in scaling up, and that I should instead focus on architecture innovation. โIn many industries where giant data sets simply donโt exist, I think the focus has to shift from big data to good data. Having 50 thoughtfully engineered examples can be sufficient to explain to the neural network what you want it to learn.โ โAndrew Ng, CEO & Founder, Landing AI I remember when my students and I published the first NeurIPS workshop paper advocating using CUDA, a platform for processing on GPUs, for deep learningโa different senior person in AI sat me down and said, โCUDA is really complicated to program. As a programming paradigm, this seems like too much work.โ I did manage to convince him; the other person I did not convince. I expect theyโre both convinced now. Ng: I think so, yes. Over the past year as Iโve been speaking to people about the data-centric AI movement, Iโve been getting flashbacks to when I was speaking to people about deep learning and scalability 10 or 15 years ago. In the past year, Iโve been getting the same mix of โthereโs nothing new hereโ and โthis seems like the wrong direction.โ Back to top How do you define data-centric AI, and why do you consider it a movement? Ng: Data-centric AI is the discipline of systematically engineering the data needed to successfully build an AI system. For an AI system, you have to implement some algorithm, say a neural network, in code and then train it on your data set. The dominant paradigm over the last decade was to download the data set while you focus on improving the code. Thanks to that paradigm, over the last decade deep learning networks have improved significantly, to the point where for a lot of applications the codeโthe neural network architectureโis basically a solved problem. So for many practical applications, itโs now more productive to hold the neural network architecture fixed, and instead find ways to improve the data. When I started speaking about this, there were many practitioners who, completely appropriately, raised their hands and said, โYes, weโve been doing this for 20 years.โ This is the time to take the things that some individuals have been doing intuitively and make it a systematic engineering discipline. The data-centric AI movement is much bigger than one company or group of researchers. My collaborators and I organized a data-centric AI workshop at NeurIPS, and I was really delighted at the number of authors and presenters that showed up. You often talk about companies or institutions that have only a small amount of data to work with. How can data-centric AI help them? Ng: You hear a lot about vision systems built with millions of imagesโI once built a face recognition system using 350 million images. Architectures built for hundreds of millions of images donโt work with only 50 images. But it turns out, if you have 50 really good examples, you can build something valuable, like a defect-inspection system. In many industries where giant data sets simply donโt exist, I think the focus has to shift from big data to good data. Having 50 thoughtfully engineered examples can be sufficient to explain to the neural network what you want it to learn. When you talk about training a model with just 50 images, does that really mean youโre taking an existing model that was trained on a very large data set and fine-tuning it? Or do you mean a brand new model thatโs designed to learn only from that small data set? Ng: Let me describe what Landing AI does. When doing visual inspection for manufacturers, we often use our own flavor of RetinaNet. It is a pretrained model. Having said that, the pretraining is a small piece of the puzzle. Whatโs a bigger piece of the puzzle is providing tools that enable the manufacturer to pick the right set of images [to use for fine-tuning] and label them in a consistent way. Thereโs a very practical problem weโve seen spanning vision, NLP, and speech, where even human annotators donโt agree on the appropriate label. For big data applications, the common response has been: If the data is noisy, letโs just get a lot of data and the algorithm will average over it. But if you can develop tools that flag where the dataโs inconsistent and give you a very targeted way to improve the consistency of the data, that turns out to be a more efficient way to get a high-performing system. โCollecting more data often helps, but if you try to collect more data for everything, that can be a very expensive activity.โ โAndrew Ng For example, if you have 10,000 images where 30 images are of one class, and those 30 images are labeled inconsistently, one of the things we do is build tools to draw your attention to the subset of data thatโs inconsistent. So you can very quickly relabel those images to be more consistent, and this leads to improvement in performance. Could this focus on high-quality data help with bias in data sets? If youโre able to curate the data more before training? Ng: Very much so. Many researchers have pointed out that biased data is one factor among many leading to biased systems. There have been many thoughtful efforts to engineer the data. At the NeurIPS workshop, Olga Russakovsky gave a really nice talk on this. At the main NeurIPS conference, I also really enjoyed Mary Grayโs presentation, which touched on how data-centric AI is one piece of the solution, but not the entire solution. New tools like Datasheets for Datasets also seem like an important piece of the puzzle. One of the powerful tools that data-centric AI gives us is the ability to engineer a subset of the data. Imagine training a machine-learning system and finding that its performance is okay for most of the data set, but its performance is biased for just a subset of the data. If you try to change the whole neural network architecture to improve the performance on just that subset, itโs quite difficult. But if you can engineer a subset of the data you can address the problem in a much more targeted way. When you talk about engineering the data, what do you mean exactly? Ng: In AI, data cleaning is important, but the way the data has been cleaned has often been in very manual ways. In computer vision, someone may visualize images through a Jupyter notebook and maybe spot the problem, and maybe fix it. But Iโm excited about tools that allow you to have a very large data set, tools that draw your attention quickly and efficiently to the subset of data where, say, the labels are noisy. Or to quickly bring your attention to the one class among 100 classes where it would benefit you to collect more data. Collecting more data often helps, but if you try to collect more data for everything, that can be a very expensive activity. For example, I once figured out that a speech-recognition system was performing poorly when there was car noise in the background. Knowing that allowed me to collect more data with car noise in the background, rather than trying to collect more data for everything, which would have been expensive and slow. Back to top What about using synthetic data, is that often a good solution? Ng: I think synthetic data is an important tool in the tool chest of data-centric AI. At the NeurIPS workshop, Anima Anandkumar gave a great talk that touched on synthetic data. I think there are important uses of synthetic data that go beyond just being a preprocessing step for increasing the data set for a learning algorithm. Iโd love to see more tools to let developers use synthetic data generation as part of the closed loop of iterative machine learning development. Do you mean that synthetic data would allow you to try the model on more data sets? Ng: Not really. Hereโs an example. Letโs say youโre trying to detect defects in a smartphone casing. There are many different types of defects on smartphones. It could be a scratch, a dent, pit marks, discoloration of the material, other types of blemishes. If you train the model and then find through error analysis that itโs doing well overall but itโs performing poorly on pit marks, then synthetic data generation allows you to address the problem in a more targeted way. You could generate more data just for the pit-mark category. โIn the consumer software Internet, we could train a handful of machine-learning models to serve a billion users. In manufacturing, you might have 10,000 manufacturers building 10,000 custom AI models.โ โAndrew Ng Synthetic data generation is a very powerful tool, but there are many simpler tools that I will often try first. Such as data augmentation, improving labeling consistency, or just asking a factory to collect more data. Back to top To make these issues more concrete, can you walk me through an example? When a company approaches Landing AI and says it has a problem with visual inspection, how do you onboard them and work toward deployment? Ng: When a customer approaches us we usually have a conversation about their inspection problem and look at a few images to verify that the problem is feasible with computer vision. Assuming it is, we ask them to upload the data to the LandingLens platform. We often advise them on the methodology of data-centric AI and help them label the data. One of the foci of Landing AI is to empower manufacturing companies to do the machine learning work themselves. A lot of our work is making sure the software is fast and easy to use. Through the iterative process of machine learning development, we advise customers on things like how to train models on the platform, when and how to improve the labeling of data so the performance of the model improves. Our training and software supports them all the way through deploying the trained model to an edge device in the factory. How do you deal with changing needs? If products change or lighting conditions change in the factory, can the model keep up? Ng: It varies by manufacturer. There is data drift in many contexts. But there are some manufacturers that have been running the same manufacturing line for 20 years now with few changes, so they donโt expect changes in the next five years. Those stable environments make things easier. For other manufacturers, we provide tools to flag when thereโs a significant data-drift issue. I find it really important to empower manufacturing customers to correct data, retrain, and update the model. Because if something changes and itโs 3 a.m. in the United States, I want them to be able to adapt their learning algorithm right away to maintain operations. In the consumer software Internet, we could train a handful of machine-learning models to serve a billion users. In manufacturing, you might have 10,000 manufacturers building 10,000 custom AI models. The challenge is, how do you do that without Landing AI having to hire 10,000 machine learning specialists? So youโre saying that to make it scale, you have to empower customers to do a lot of the training and other work. Ng: Yes, exactly! This is an industry-wide problem in AI, not just in manufacturing. Look at health care. Every hospital has its own slightly different format for electronic health records. How can every hospital train its own custom AI model? Expecting every hospitalโs IT personnel to invent new neural-network architectures is unrealistic. The only way out of this dilemma is to build tools that empower the customers to build their own models by giving them tools to engineer the data and express their domain knowledge. Thatโs what Landing AI is executing in computer vision, and the field of AI needs other teams to execute this in other domains. Is there anything else you think itโs important for people to understand about the work youโre doing or the data-centric AI movement? Ng: In the last decade, the biggest shift in AI was a shift to deep learning. I think itโs quite possible that in this decade the biggest shift will be to data-centric AI. With the maturity of todayโs neural network architectures, I think for a lot of the practical applications the bottleneck will be whether we can efficiently get the data we need to develop systems that work well. The data-centric AI movement has tremendous energy and momentum across the whole community. I hope more researchers and developers will jump in and work on it. Back to top This article appears in the April 2022 print issue as โAndrew Ng, AI Minimalist.โ