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IndyCar’s Christian Rasmussen Signs Multi-Year Deal To Remain At ECR

Christian Rasmussen of Copenhagen, Denmark signed a multi-year deal to remain at ECR in the NTT IndyCar Series. The 25-year-old Rasmussen is an IndyCar star on the rise.

Jeff Bezos Is Funding a Wild Hunt for the Brain’s ‘Core Algorithm’

With $500 million in funding and a reported $2.5 billion valuation, Flourish wants to reinvent AI by putting real neurons under the microscope.

Radio scans find no evidence of alien tech from interstellar comet 3I/Atlas

The SETI Institute said Wednesday that extensive radio scans by its telescope in Northern California found no signs of otherworldly technology from our solar system's latest interstellar visitor.

Iran war hasn’t slowed the economy, but higher inflation spurs companies to freeze hiring

The largest part of the economy grew faster in May even as businesses had to cope with the worst inflation in several years, but it came at a cost to jobseekers. Many companies have adopted temporary hiring freezes to offset their own rising costs.

NASA’s $4 Billion Roman Space Telescope Heads To Florida For Launch

NASA’s next great space telescope will see 100 times more sky than Hubble. It’s about to arrive in Florida for launch in September.

Supreme Court takes up another case over First Step Act brought by inmate

The Supreme Court added a case to its next term on Monday that addresses how the First Step Act applies to inmates seeking quicker transfers from prison to lower-security confinement, such as a halfway house, marking the latest instance of the justices reviewing the scope of the 2018 criminal justice reform law. The high court […]

Over 40 dead in Ebola outbreak in DR Congo and Uganda

Over 40 people have died in a growing Ebola outbreak in the Democratic Republic of the Congo and Uganda, where government and international aid organizations are struggling to cope with the spread of the disease

Checking out The Human Library

At a very special library in Copenhagen, Denmark, the "books" being checked out are actual human beings, who offer 30-minute conversations on a wealth of subjects – allowing "readers" a better understanding of humanity.

Checking out The Human Library

At a very special library in Copenhagen, Denmark, the "books" being checked out are actual human beings. The Human Library, founded 26 years ago, offers 30-minute conversations with living books on a wealth of subjects, and is now available in 80 countries (including the United States) and online. CBS News chief medical correspondent Dr. Jon LaPook talked with the library's co-founder Ronni Abergel, and checked out three unique books on the topics of schizophrenia, refugees, and Greenland.

Russia Signs Military Cooperation Deal With Afghanistan’s Taliban Government

Russia and Afghanistan’s Taliban government have signed a military agreement, in a move that signals deepening cooperation between the sides, experts said. The deal was signed on May 27 by Sergei Shoigu, secretary of Russia’s Security Council, and the Taliban’s defense minister, Mohammad Yaqub, on the sidelines of a security forum outside of Moscow, Russian media reported. Neither side has released the text of the military cooperation agreement or offered details about its scope, making it difficult to gauge whether the deal represents…

A New Copernican Revolution?

SEC proposes rolling back controversial Biden climate disclosure rules

The Securities and Exchange Commission has proposed rescinding rules imposed under the Biden administration that mandate that public companies report their carbon emissions and climate change-related risks. The commission described the climate disclosure rules as “unnecessary,” claiming the dormant rules exceed the scope of the agency’s statutory authority and impose significant costs on public companies […]

Finding Success in Industry as a Chip Designer

I have been an application-specific IC (ASIC) designer for almost three decades. Over that time, I’ve moved through the full academic trajectory, from graduate student to full professor; later, I transitioned to industry after an unsuccessful stint at entrepreneurship. When I made the switch to the private sector in 2019, I began focusing on a critically important aspect of the electronic industry: silicon intellectual property. As much as 80 percent of the physical area in today’s most advanced chips is occupied by blocks that aren’t made for specific products or even designed by the consumer-facing companies that built them. Instead, chipmakers draw heavily on established silicon IP from companies like Arm, Cadence, Rambus, Synopsys, and the company I work for, Silicon Creations. Throughout my career, I’ve designed chips for very different purposes, including enabling the research program in my academic lab and expanding the IP portfolio of my company. When I joined Silicon Creations, I had no idea how differently the industry approaches IC design and encountered a steep learning curve. Initially, it seemed that much of my two decades of academic research and training did not directly translate to the role. I had to learn new skills and adopt a new mindset. Today, demand for ASICs is rapidly growing, driven by the need for specialized chips in the automotive sector, AI applications, and more. By one market estimate, the ASIC market is expected to grow from US $23.4 billion to $38.8 billion by 2033, and the semiconductor industry as a whole is projected to hit $1 trillion by 2030. The industry needs more chip designers—but if you’re coming from an academic background as I did, there are a few things you’ll need to know. Different goals lead to different strategies The differences between industry and academe begin with a divergence in purpose. In academia, my primary objective was to generate new knowledge: to propose a novel circuit technique, validate an unconventional architecture, or explore the limits of performance in a given domain. A successful chip is one that demonstrates a concept. In industry, it is not nearly enough to prove that something can work. The goal is to ensure that it works reliably, repeatedly, and at scale. Success is measured not by novelty but by whether the silicon meets specifications, yields as expected in production, and supports a competitive product delivered on schedule. This leads to a stark contrast in risk tolerance. Academic designs often deliberately push into unproven territory, where even partial success can yield valuable insight. In industry, however, we systematically minimize risk. The cost of failure makes first-time silicon success a central requirement—especially at advanced technology nodes, where the lithography masks used to transfer circuit designs onto silicon wafers alone can cost tens of millions of dollars. As a result, industry design flows are built around eliminating uncertainty through conservative margins, extensive validation, and careful reuse of proven solutions. “Academia explores the design space, asking what is possible, while industry exploits it, determining what is viable at scale.” This paradigm has existed since the 1970s, when application-specific chip design was established. However, the gulf between academia and industry has expanded since the mid-2010s, when FinFET technology, a 3D architecture using vertical “fins” of silicon, was widely adopted in industry. System designs are also becoming increasingly modular with the advent of chiplets. This fundamentally altered the economics and complexity of ASIC development, with design costs rising by almost an order of magnitude. Initiatives like Taiwan Semiconductor Manufacturing Co.’s University FinFET Program and new government-funded chip-design hubs now let some well-resourced universities design for more advanced architectures, but the technology is still out of reach for many academics. What the industry-academia split means in practice Consider a startup developing an ASIC. Its engineering team may have deep expertise in a particular algorithm, sensor interface, or system architecture, the features that define its competitive advantage. But it is unlikely to possess world-class expertise in every supporting function. Developing each of these blocks internally would require significant time, capital, and specialized talent. Doing so could delay market entry beyond the startup’s viability. Even large semiconductor companies face similar constraints. Advanced-node development demands intense focus. Allocating a team to redesign a standard interface block that has already been implemented elsewhere may be difficult to justify when differentiation lies at the system level, such as an inference chip’s ability to speed up neural network computations. The time it takes to move a new chip from conception to market and risk mitigation, not self-sufficiency, govern most decisions about in-house development versus outsourcing. The economics of advanced IC manufacturing reinforce this reality. When the development cost of a leading-edge chip reaches hundreds of millions of dollars, minimizing risk becomes a central design imperative. In this context, silicon IP emerged as a practical solution. Similar to how software developers rely on preexisting libraries rather than writing every function from scratch, ASIC designers license predesigned, preverified silicon blocks—such as processor cores, memory interfaces, and security engines—from highly specialized IP vendors. These blocks can then be integrated into larger, increasingly complex systems. Design scope, verification, and time horizons With the use of silicon IP, industry is able to widen the scope of its designs. Academic efforts tend to focus on block-level innovation: a new analog-to-digital converter architecture or an ultralow-noise amplifier, for instance. These designs typically abstract away many of the complexities of bringing a chip to market, such as packaging constraints, long-term reliability, and manufacturing yield. In industry, the focus shifts to system-level integration. Modern systems on chips, or SoCs, incorporate dozens or even hundreds of functional blocks. Managing signal integrity, timing, firmware interaction, and system-level validation becomes as critical as the design of any individual block. Verification philosophy also diverges sharply. In academia, the goal of verification is to demonstrate that the concept works under nominal conditions, which may not always reflect how it would perform in real applications. Even if only a fraction of fabricated chips from a multiproject wafer operates correctly, the design may still be considered a success if it validates the underlying idea. At my academic lab for instance, we used to receive 40 chips from a TSMC prototyping service and started testing them in batches of five. If the first five or 10 chips proved functional, we had already collected more than enough data for a publication. If some of them failed, we weren’t required to mention this when publishing the results. In industry, verification is exhaustive, critical, and often dominates the development schedule. Failures are measured in parts per million, and even rare anomalies are carefully analyzed and documented to identify root causes and prevent recurrence. When I started at Silicon Creations, I was surprised by the level of detail and scrutiny designs face. Differences in time horizons and economic constraints reinforce each of these contrasts. Academic projects operate on flexible timelines aligned with research and funding cycles. If I missed a deadline, I just had to wait for the next cycle. Industry projects are driven by fixed product schedules and market windows, frequently targeting costly leading-edge nodes to achieve competitive performance, power, and area efficiency. Missing a deadline can negate the value of an entire design and may have major financial consequences along the entire supply chain. In essence, academia explores the design space, asking what is possible, while industry exploits it, determining what is viable at scale. Both are indispensable, but they operate under fundamentally different definitions of success. As ASIC complexity continues to grow, understanding both perspectives will be essential for the next generation of engineers navigating the evolving semiconductor landscape. This article appears in the June 2026 print issue.

Dear Abby: I want my son to be healthy, but he binge eats to cope with depression

Dear Abby advises a father who is worried about his son, who is binge eats to cope with his anxiety and depression.

Man known for pro-Trump displays who died after attack outside his home was ‘caring’ and ‘kind,’ family says

The death of a Southern California man who was attacked outside his home decorated with Donald Trump memorabilia has left his family struggling to cope.

Fact check: Delaney Hall, the ICE detention center in New Jersey under Democrats’ microscope

A federal immigrant detention facility in New Jersey is at the center of a debate between Democrats and the Trump administration for the second time in a year. Democratic elected officials showed up outside the Delaney Hall detention facility in Newark on Memorial Day and accused U.S. Immigration and Customs Enforcement of holding hundreds of […]

Amid FPV threat, Aussie company to offer Ukraine armored roofs for ATVs

Ballistic protection from overhead dangers come as modern militaries learn to cope with FPV killers.

Meet NASA Low Outgassing Standards With Adhesives for Aerospace and Optical Systems

This sponsored article is brought to you by Master Bond. Outgassing is the release of volatile substances from a cured adhesive over time. These released materials, which may include residual solvents, unreacted monomers, or other chemical species, can deposit on nearby surfaces, causing contamination that interferes with sensitive components. What Is Outgassing and How Is It Measured? The industry standard for measuring outgassing is ASTM E595, developed by NASA. This test exposes a cured sample to 125 °C at high vacuum (10⁻⁵ to 10⁻⁶ torr) for 24 hours, measuring Total Mass Loss (TML) and Collected Volatile Condensable Materials (CVCM). To meet NASA low outgassing requirements, materials must exhibit less than 1 percent TML and less than 0.1 percent CVCM. Optical assemblies need contamination-free bonding and prevention of fogging the optics to maintain clarity. High-vacuum scientific equipment, semiconductor manufacturing tools, and aerospace electronics also demand low outgassing materials. Key Applications Low outgassing adhesives are essential wherever contamination could compromise performance and this is particularly relevant for space and satellite systems. Optical assemblies, including cameras, telescopes, and laser systems, need contamination-free bonding and prevention of fogging the optics to maintain clarity. High-vacuum scientific equipment, semiconductor manufacturing tools, and aerospace electronics also demand low outgassing materials. Even terrestrial optical devices benefit from reduced outgassing to ensure long-term reliability. EP30-2 is a versatile system can be used in a variety of applications in aerospace, electronic, optical and specialty OEM industries, especially when optical clarity and low outgassing are important criteria.Master Bond Ensuring Low Outgassing Performance Through Proper Handling Achieving specified outgassing performance requires attention to storage, mixing, and curing. For two-part systems, use the correct mix ratio and mix thoroughly to ensure complete reaction. Follow recommended cure schedules — adding heat, even at modest temperatures of 150-200 °F, significantly improves cross-linking and reduces outgassing. For UV-curable adhesives, ensure complete cure by using the correct lamp wavelength (typically 365 nm), adequate intensity, and proper exposure time with no shadowed areas. Troubleshooting Outgassing Issues If contamination appears on optical surfaces or outgassing test results are higher than expected, an incomplete cure might be one of the root causes. The first step is to verify that the adhesive has fully hardened to its specified Shore hardness. The next step is to consider adding or extending heat cure to improve cross-linking. Master Bond Product Recommendations Master Bond offers a range of adhesives meeting NASA low outgassing requirements. EP30-2 and EP21TCHT-1 are some examples of two-part epoxy systems that have been successfully deployed in demanding vacuum applications, including ultra-high vacuum environments. For applications requiring UV cure, Master Bond provides specialty UV formulations such as UV16 meeting ASTM E595, as well as dual-cure systems (UV plus heat) such as UV22DC80-10F for assemblies where shadows prevent complete UV exposure. These dual-cure products initiate with UV light and complete curing with heat as low as 180 °F (80 °C).

Adam Copeland, Christian Cage snap 25-year drought, win AEW Tag Team Championship at Double or Nothing

Adam Copeland and Christian Cage end a 25-year title drought by winning the AEW Tag Team Championship in a violent I Quit match at Double or Nothing.

Why did Kouri Richins want her husband dead?

Kouri Richins published a children's book to help her sons cope with the loss of their father – then she was convicted of Eric Richins' murder.