Ars Technica
중도 성향
정치
Russia pressures university students to become wartime drone pilots
Universities promise no frontline duty and perks if students enlist in military.
🇺🇸 미국 · "PROMISE" · 총 151건
필터 보기현재 지수
50.0
0 = 부정 우세
50 = 중립
100 = 긍정 우세
최근 7일 기준 10,289건을 분석한 결과, 뉴스 심리지수는 50.0(균형)입니다. 긍정 1건(0.0%)·중립 10,287건(100.0%)·부정 1건(0.0%)이며, 중립 비중이 뚜렷하게 높습니다. 성향 지수는 종합 19.2(중도 균형)입니다.
Universities promise no frontline duty and perks if students enlist in military.
This sponsored article is brought to you by Applied Materials. At pivotal moments in history, progress has required more than individual brilliance. The most consequential breakthroughs — such as those achieved under the Human Genome Project — required a new operating paradigm: Concentrate the world’s best talent around a single mission, establish a common platform, share critical infrastructure, and collapse feedback loops. When stakes are high and timelines are compressed, sequential and siloed innovation simply cannot keep pace. Today’s AI era is creating an engineering race with similar demands. Every company is pushing to deliver higher-performance AI systems, faster. But performance is no longer defined by compute alone. AI workloads are increasingly dominated by the movement of data: In many cases, moving bits consumes as much — or more — energy than compute itself. As a result, reducing energy per bit can extend system‑level performance alongside gains in peak compute. The path to energy‑efficient AI therefore runs through system‑level engineering, spanning three tightly interconnected domains: Logic, where performance per watt depends on efficient transistor switching, low‑loss power, and signal delivery through dense wiring stacks. Memory, where surging bandwidth and capacity demands expose the memory wall, with processor capability advancing faster than memory access. Advanced packaging, where 3D integration, chiplet architectures, and high‑density interconnects bring compute and memory closer together — enabling system designs monolithic scaling can no longer sustain. These domains can no longer be optimized independently. Gains in logic efficiency stall without sufficient memory bandwidth. Advances in memory bandwidth fall short if packaging cannot deliver proximity within thermal and mechanical constraints. Packaging, in turn, is constrained by the precision of both front‑end device fabrication and back‑end integration processes. In the angstrom era, the hardest problems arise at the boundaries — between compute and memory in the package, front‑end and back‑end integration, and the tightly coupled process steps needed for precise 3D fabrication. And it is precisely this boundary‑driven complexity where the traditional innovation model breaks down. The Traditional R&D Workflow Is Too Slow for Angstrom‑Era AI For decades, the semiconductor industry’s R&D model has resembled a relay race. Capabilities are developed in one part of the ecosystem, handed off downstream through integration and manufacturing, evaluated by chip and system designers, and only then fed back for the next iteration. That model worked when progress was dominated by relatively modular steps that could be scaled independently and simply dropped into the manufacturing flow. But the AI timeline has upended these rules. At angstrom‑scale dimensions, the physics enforces inescapable coupling across the entire stack: materials choices shape integration schemes; integration defines design rules; design rules dictate power delivery; wiring sets thermal budgets; and thermals ultimately constrain packaging scaling. System architects simply cannot wait 10–15 years for each major semiconductor technology inflection to mature. Representing a roughly $5 billion investment, EPIC is the largest commitment to advanced semiconductor equipment R&D in U.S. history. A long‑term perspective is essential to align materials innovation with emerging device architectures — and to develop the tools and processes required to integrate both with manufacturable precision. At Applied Materials, together with our customers, we are charting a course across the next 3–4 generations, extending as far as 10 years down the roadmap. The angstrom era demands that we break down silos and bring together the industry’s best minds — from leading companies to leading academic institutions. If the problem is coupled, the solution must be coupled. If the timeline is compressed, the learning loop must be compressed. It’s not enough to just innovate — we must innovate how we innovate. EPIC: A Center and Platform for High‑Velocity Co‑Innovation This is the challenge that Applied Materials EPIC Center is designed to solve. Representing a roughly US $5 billion investment, EPIC is the largest commitment to advanced semiconductor equipment R&D in U.S. history. When it opens in 2026, it will deliver state‑of‑the‑art cleanroom capabilities built from the ground up to shorten the path from early‑stage research to full‑scale manufacturing. But the facilities are only one component of the model. EPIC is also a platform, an operating system for high-velocity co‑innovation that revolutionizes how ideas move from the lab to the fab. EPIC is a platform, an operating system for high-velocity co‑innovation that revolutionizes how ideas move from the lab to the fab.Applied Materials The EPIC model compresses the traditional workflow. Customer engineers work side‑by‑side with Applied technologists from day one — moving beyond isolated process optimization and downstream handoffs. Within a shared, secure environment, EPIC tightly integrates atomistic modeling, test vehicles, process development, validation, and metrology feedback. Constraints that once surfaced late in development are identified and addressed early. The result is a potentially 2x faster path that benefits the entire ecosystem under one roof: Chipmakers gain earlier access to Applied’s R&D portfolio, faster learning cycles, and accelerated transfer of next‑generation technologies into high‑volume manufacturing. Ecosystem partners gain earlier access to advanced manufacturing technology and collaboration opportunities that expand what is possible through materials innovation. Academic institutions gain opportunities to strengthen the lab‑to‑fab pipeline and help develop future semiconductor talent. Building on decades of co‑development, we are reinventing the innovation pipeline with our partners across logic, memory, and advanced packaging to deliver the next leap in energy‑efficient AI. Accelerating Advanced Logic Logic remains the engine of AI compute. In the angstrom era, however, system‑level gains are increasingly constrained by power and energy. Extending AI performance now depends on architectures that deliver more performance per watt — accelerating the move to 3D devices such as gate‑all‑around (GAA) transistors, which boost density within a compact footprint while preserving power efficiency. Architectures that deliver more performance per watt are accelerating the move to 3D devices such as gate‑all‑around (GAA) transistors, and further out, complementary FETs (CFETs), which push density scaling even more.Applied Materials These architectural shifts are unfolding at unprecedented scale, with the logic roadmap already extending beyond first‑generation GAA toward more advanced designs. One key example is GAA with backside power delivery, which relocates thick power lines to the backside of the wafer, reducing resistive losses and freeing front‑side routing for tighter logic cell integration. Another example brings adjacent GAA PMOS and NMOS transistors closer together while inserting a dielectric isolation wall between them to minimize electrical interference. Further out, complementary FETs (CFETs) push density scaling even more by stacking PMOS and NMOS devices directly atop one another. While these architectures deliver compelling gains in performance per watt and logic density without relying solely on tighter lithography, they significantly raise integration complexity. Manufacturing a single GAA device today can involve more than 2,000 tightly interdependent process steps. At the same time, wiring stacks continue to grow taller and denser to connect these advanced logic devices. Modern leading‑edge GPUs now in development pack more than 300 billion transistors into an area little larger than a postage stamp, interconnected by over 2,000 miles of wiring. Modern leading‑edge GPUs now in development pack more than 300 billion transistors into an area little larger than a postage stamp, interconnected by over 2,000 miles of wiring.Applied Materials At this level of complexity, the process steps used to create these precise 3D devices and wiring stacks cannot be optimized independently. Design and process must evolve in lockstep, and materials innovation and fabrication methods must advance alongside device architecture. EPIC’s co‑innovation model is designed to accelerate exactly this convergence — enabling logic compute to continue advancing the frontiers of AI at the pace the roadmap demands. Powering the Memory Roadmap At the same time, the AI computing era is fundamentally reshaping how data is generated, moved, and processed — making memory technologies, especially DRAM, central to delivering the energy‑efficient performance AI systems require. As models grow larger and more data‑hungry, the DRAM roadmap is shifting toward architectures that deliver higher density, greater bandwidth, and faster access per watt. At the DRAM cell level, AI performance requirements are driving a transition from 6F² buried‑channel array transistors (BCAT) to more compact 4F², and beyond that, architectures that move past what 2D scaling alone can deliver. Applied Materials At the DRAM cell level, this shift is driving a transition from 6F² buried‑channel array transistors (BCAT) to more compact 4F² architectures, which orient the transistor vertically to boost density and reduce chip area. Looking beyond 4F², sustaining gains in performance per watt will require moving past what 2D scaling alone can deliver. The industry is therefore turning to 3D DRAM, stacking memory cells vertically to add capacity within a constrained footprint. As these structures grow taller and aspect ratios intensify, high-mobility materials engineering in three dimensions becomes increasingly critical to performance and reliability. Beyond the memory cell array, another powerful lever for DRAM scaling is shrinking the peripheral circuitry, which includes logic transistors and interconnect wiring. One emerging approach places select periphery functions beneath the DRAM array by bonding two wafers — one optimized for the DRAM cells and the other for CMOS logic — using multiple wiring layers. Beyond the memory cell array, another powerful lever for DRAM scaling is shrinking the peripheral circuitry, which includes logic transistors and interconnect wiring.Applied Materials In parallel, DRAM performance is being extended by leveraging logic‑proven enhancers in the memory periphery. These include mobility boosters such as embedded silicon germanium and stress films, along with wiring upgrades like improved low‑k dielectrics and advanced copper interconnects. Memory manufacturers are also transitioning periphery transistors from planar devices to FinFET architectures, following the logic roadmap to further improve I/O speed. These valuable inflections are central to EPIC’s mission — where they can be co-developed and rapidly validated for next‑generation memory systems. Driving System Scaling With Advanced Packaging As data movement becomes the dominant energy cost in AI systems, advanced packaging has emerged as a critical lever for improving system‑level efficiency—shortening interconnect distances, increasing bandwidth density, and reducing the power required to move data between logic and memory. The rise of 3D packages such as high‑bandwidth memory (HBM) underscores why advanced packaging is becoming central to the AI era.Applied Materials High‑bandwidth memory (HBM) marks a major inflection along this path. By stacking DRAM dies — scaling to 16 layers and beyond — and placing memory much closer to the processor, HBM enables rapid access to ever‑larger working datasets. This delivers step‑function gains in both bandwidth and energy efficiency. More broadly, the rise of 3D packages such as HBM underscores why advanced packaging is becoming central to the AI era. Packaging now addresses system‑level constraints that logic and memory device scaling alone can no longer overcome. It also enables a move away from monolithic systems‑on‑chip toward chiplet‑based architectures, as AI workloads increasingly demand flexible designs that combine logic, memory, and specialized accelerators optimized for specific tasks. A vital technology powering this roadmap is hybrid bonding. With interconnect pitches approaching those of on‑chip wiring, conventional bumps and microbumps run into fundamental limits in density, power, and signal integrity. Hybrid bonding removes these barriers by allowing dramatically higher interconnect and I/O density, supporting a broad range of chiplet architectures — from memory stacking to tighter compute‑memory integration. EPIC tackles high‑value advanced‑packaging challenges through early, parallel co‑innovation across materials, integration, and manufacturing.Applied Materials As bonded structures like HBM stacks grow larger and more complex, warpage control, die placement, stack alignment, and thermal management become first‑order challenges. EPIC tackles these and other high‑value advanced‑packaging challenges through early, parallel co‑innovation across materials, integration, and manufacturing. Bringing It All Together Across logic, memory, and advanced packaging, our industry faces an ambitious roadmap that promises significant gains in energy efficiency for AI systems. But realizing that potential demands breakthrough materials innovation at a time when feature sizes are shrinking, interfaces are multiplying, and process interdependencies are escalating. These challenges cannot be solved on 10–15‑year timelines under the traditional relay‑race model. We must break down silos, align earlier across the ecosystem, and parallelize learning to keep pace with AI’s demands. In the AI era, progress will be defined by the speed at which lightbulb moments turn into manufacturing and commercialization reality. The only viable path forward is a new innovation model — and EPIC is how we are driving it.
This sponsored article is brought to you by Ampace. As AI workloads grow to gigascale levels, the global data center industry has hit a hidden physical wall. The real bottleneck is no longer just the thermal limit of the chip or the capacity of the cooling system — it is the dynamic resilience of the power chain. Modern AI computing clusters, driven by massive GPU clusters, generate high-frequency, abrupt, and synchronized spikey pulse loads. As rack densities soar beyond 100 kW, these fluctuations are amplified into a “power paradox”: while the digital logic of AI is moving faster than ever, the physical infrastructure supporting it remains tethered to legacy response capabilities. The power usage of these gigascale sites and their drastic, high frequency, abrupt load surges from the AI GPU clusters can trigger transient voltage events and frequency instability, risking the entire local grid. The grid itself is not robust enough to support these loads. This leads to the infrastructure gap: The utility is not robust enough and traditional backup sources, such as diesel generators and gas turbines, simply cannot react to millisecond-level power spikes in output. This will often force operators into a cycle of costly infrastructure over sizing just to buffer the volatility. AI infrastructure requires energy systems capable of instantaneous response while safeguarding continuity and reliability. The industry has explored various mitigations — from rack-level BBUs to 800V DC architectures — yet the mature, high volume, traditional UPS system remains the most viable and scalable foundation for gigawatt-level facilities. Consequently, the UPS-integrated battery system has emerged as the critical “physical buffer” to neutralize these pulses at the source. At Data Center World 2026 in Washington, D.C., Ampace led a pivotal technical dialogue with Eaton during the session “Powering Giga-scale AI.” Their exchange unveiled a fundamental paradigm shift: To bridge the AI power gap, energy storage must evolve from a passive insurance policy into an active, high-speed stabilizer. By aligning Ampace’s semi-solid-state battery innovation with Eaton’s proven system intelligence, we are moving beyond simple backup to solve the physical paradox of the AI era. To move beyond simple backup and solve the physical paradox of the AI era, Ampace is aligning its semi-solid-state battery innovation with Eaton’s proven system intelligence.Ampace The “Shock Absorber” physics: semi-solid chemistry for AI pulses Conventional power systems were designed for steady-state loads, not the rapid heartbeat of a massive AI GPU cluster. When thousands of GPUs synchronize their computing cycles, they generate high-frequency, abrupt pulse loads that can lead to voltage sags, frequency oscillations, and potential interruptions of critical AI training. Ampace’s PU Series semi-solid and low-electrolyte cells address this challenge by acting as high-speed “shock absorbers.” Leveraging ultra-low internal resistance (DCR) and high cycle capability, these batteries neutralize millisecond-level power spikes at the source, stabilizing the local power loop before disturbances propagate upstream to the grid or on-site generators. These high-rate cells enable 100 kW+ racks to maintain peak performance without transmitting instability across the power chain. This capability aligns closely with Eaton’s matured UPS architectures, such as double-conversion topologies and advanced power electronics upgrades, which have long prioritized rapid load responsiveness and high system stability. Together, these approaches embody a shared industry philosophy: AI infrastructure requires energy systems capable of instantaneous response while safeguarding continuity and reliability. Ampace’s semi-solid state chemistry minimizes liquid electrolyte, greatly reducing the risk of leakage and thermal runaway under continuous AI high-load conditions.Ampace Algorithmic intelligence: synchronizing energy and control Hardware alone cannot solve the AI power paradox; the system also requires intelligent coordination between energy storage and power management. Sophisticated battery management systems (BMS) like Ampace’s high-precision design track state-of-charge (SOC) with high-speed sampling, even during rapid, shallow cycling typical in AI workloads. Complementary algorithmic approaches in modern UPS platforms — such as ramp-rate control and average power management — effectively suppress sub-synchronous oscillations and optimize load smoothing. In large-scale AI training environments, where thousands of GPUs can trigger millisecond-level power pulses, these intelligent layers ensure that batteries buffer high-frequency fluctuations without compromising the mandatory emergency backup reserves. By transforming energy storage from passive “standby insurance” into active, schedulable assets, the system simultaneously safeguards continuous AI training and maintains the long-term health of the data center infrastructure. In practical terms, this means that even during peak compute bursts, the infrastructure remains stable, training cycles continue uninterrupted, and operators avoid costly oversizing or grid stress. Eaton’s dual-layer algorithms serve as a valuable benchmark in this space, demonstrating how advanced control logic can achieve similar objectives, reinforcing Ampace’s approach and philosophy within the broader data center power ecosystem. Economic scalability: optimizing AI infrastructure efficiently One of the largest costs in deploying AI infrastructure is “oversizing”: procuring transformers, generators, and UPS systems to handle brief peak spikes. This traditional approach inflates the Total Cost of Ownership (TCO) and leads to wasted capital on underutilized hardware. Ampace’s turn-key cabinet design developed by its independent R&D is engineered for seamless compatibility with mature, high volume UPS systems. By leveraging Eaton’s double-conversion UPS topologies alongside intelligent ramp-rate and average power management algorithms, AI data centers can scale dynamically without requiring costly infrastructure redesigns. This approach allows the UPS and batteries to act as active load-shapers, smoothing AI-driven pulses while strictly maintaining mandatory emergency backup capacity. By utilizing energy storage as an active, schedulable asset, operators can right-size their infrastructure, avoid unnecessary grid upgrades, and deploy gigascale AI clusters with unprecedented efficiency. Safety First: Protecting AI Infrastructure While Enabling Innovation In high-density AI facilities, safety is non-negotiable. Ampace’s semi-solid state chemistry minimizes liquid electrolyte, greatly reducing the risk of leakage and thermal runaway under continuous AI high-load conditions. Ampace’s turn-key cabinet design developed by its independent R&D is engineered for seamless compatibility with mature, high volume UPS systems. Ampace At the same time, Eaton’s UPS design emphasizes system-level energy scheduling that never sacrifices mandatory emergency backup reserves, ensuring thermal safety and uninterrupted operation. This “safety-first” approach ensures that infrastructure can sustain aggressive performance targets without compromising the physical integrity of the facility. Coupled with over a decade of proven high-cycle life operation and design under shallow pulse conditions, these systems can extend operational lifespan, reduce replacement requirements, and provide operators with confidence that safety and reliability remain uncompromised as compute density continues to grow. To remain the scalable backbone of AI data centers As AI computing scales over the next two to three years, the industry will face stricter grid requirements and even more demanding pulse load characteristics. This evolution demands a forward-looking design philosophy that harmonizes UPS, battery, and grid compatibility. Ampace views current low-electrolyte semi-solid technologies as the optimal transitional step toward a fully solid-state future — one that promises ultimate safety and performance. Ampace remains committed to this long-term technological roadmap. We view current low-electrolyte semi-solid technologies as the optimal transitional step toward a fully solid-state future — one that promises ultimate safety and performance. Whether through rack-level BBU, integrated UPS systems, or containerized storage, the universal core of the AI era remains constant: high-speed response, long shallow-cycle life, and refined energy management. By engaging in deep technical exchanges with Eaton and leading energy innovators, Ampace ensures that its solutions not only meet today’s AI pulse challenges but also harmonize with broader infrastructure strategies and shared industry best practices. Ultimately, as traditional diesel generators gradually give way to diversified alternatives, the integrated UPS-plus-energy-storage system will become the fundamental infrastructure standard. The dialogue has just begun. Ampace will continue to engage in strategic exchanges with global industrial automation leaders and digital energy pioneers, co-authoring the playbook for a safer, more efficient, and more resilient AI-ready world.
This article is brought to you by DAIMON Robotics. This April, Hong Kong-based DAIMON Robotics has released Daimon-Infinity, which it describes as the largest omni-modal robotic dataset for physical AI, featuring high resolution tactile sensing and spanning a wide range of tasks from folding laundry at home to manufacturing on factory assembly lines. The project is supported by collaborative efforts of partners across China and the globe, including Google DeepMind, Northwestern University, and the National University of Singapore. The move signals a key strategic initiative for DAIMON, a two-and-a-half-year-old company known for its advanced tactile sensor hardware, most notably a monochromatic, vision-based tactile sensor that packs over 110,000 effective sensing units into a fingertip-sized module. Drawing on its high-resolution tactile sensing technology and a distributed out-of-lab collection network capable of generating millions of hours of data annually, DAIMON is building large-scale robot manipulation datasets that include vast amounts of tactile sensing data. To accelerate the real-world deployment of embodied AI, the company has also open-sourced 10,000 hours of its data. Prof. Michael Yu Wang, co-founder and chief scientist at DAIMON Robotics, has pioneered Vision-Tactile-Language-Action (VTLA) architecture, elevating the tactile to a modality on par with vision.DAIMON Robotics Behind the strategy is Prof. Michael Yu Wang, DAIMON’s co-founder and chief scientist. Prof. Wang earned his PhD at Carnegie Mellon — studying manipulation under Matt Mason — and went on to found the Robotics Institute at the Hong Kong University of Science and Technology. An IEEE Fellow and former Editor-in-Chief of IEEE Transactions on Automation Science and Engineering, he has spent roughly four decades in the field. His objective is to address the missing “insensitivity” of robot manipulation, which practically relies on the dominant Vision-Language-Action (VLA) model. He and his team have pioneered Vision-Tactile-Language-Action (VTLA) architecture, elevating the tactile to a modality on par with vision. We spoke with Prof. Wang about how tactile feedback aims to change dexterous manipulation, how the dataset initiative is foreseen to improve our understanding of robotic hands in natural environments, and where — from hotels to convenience stores in China — he sees touch-enabled robots making their first real-world inroads. Daimon-Infinity is the world’s largest omni-modal dataset for Physical AI, featuring million-hour scale multimodal data, ultra-high-res tactile feedback, data from 80+ real scenarios and 2,000+ human skills, and more.DAIMON Robotics The Dataset Initiative This month, DAIMON Robotics released the largest and most comprehensive robotic manipulation dataset with multiple leading academic institutions and enterprises. Why releasing the dataset now, rather than continuing to focus on product development? What impact will this have on the embodied intelligence industry? DAIMON Robotics has been around for almost two and a half years. We have been committed to developing high-resolution, multimodal tactile sensing devices to perceive the interaction between a robot’s hand (particularly its fingertips) and objects. Our devices have become quite robust. They are now accepted and used by a large segment of users, including academic and research institutes as well as leading humanoid robotics companies. As embodied AI continues to advance, the critical role of data has been clearer. Data scarcity remains a primary bottleneck in robot learning, particularly the lack of physical interaction data, which is essential for robots to operate effectively in the real world. Consequently, data quality, reliability, and cost have become major concerns in both research and commercial development. This is exactly where DAIMON excels. Our vision-based tactile technology captures high-quality, multimodal tactile data. Beyond basic contact forces, it records deformation, slip and friction, material properties and surface textures — enabling a comprehensive reconstruction of physical interactions. Building on our expertise in multimodal fusion, we have developed a robust data processing pipeline that seamlessly integrates tactile feedback with vision, motion trajectories, and natural language, transforming raw inputs into training-ready dataset for machine learning models. Recognizing the industry-wide data gap, we view large-scale data collection not only as our unique competitive advantage, but as a responsibility to the broader community. By building and open-sourcing the dataset, we aim to provide the high-quality “fuel” needed to power embodied AI, ultimately accelerating the real-world deployment of general-purpose robotic foundation models. The robotics industry is highly competitive, and many teams have chosen to focus on data. DAIMON is releasing a large and highly comprehensive cross-embodiment, vision-based tactile multimodal robotic manipulation dataset. How were you able to achieve this? We have a dedicated in-house team focused on expanding our capabilities, including building hardware devices and developing our own large-scale model. Although we are a relatively small company, our core tactile sensing technology and innovative data collection paradigm enable us to build large-scale dataset. Our approach is to broaden our offering. We have built the world’s largest distributed out-of-lab data collection network. Rather than relying on centralized data factories, this lightweight and scalable system allows data to be gathered across diverse real-world environments, enabling us to generate millions of hours of data per year. “To drive the advancement of the entire embodied AI field, we have open-sourced 10,000 hours of the dataset for the broader community.” —Prof. Michael Yu Wang, DAIMON Robotics This dataset is being jointly developed with several institutions worldwide. What roles did they play in its development, and how will the dataset benefit their research and products? Besides China based teams, our partners include leading research groups from universities, such as Northwestern University and the National University of Singapore, as well as top global enterprises like Google DeepMind and China Mobile. Their decision to partner with DAIMON is a strong testament to the value of our tactile-rich dataset. Among the companies involved there are some that have already built their own models but are now incorporating tactile information. By deploying our data collection devices across research, manufacturing and other real-world scenarios, they help us to gather highly practical, application-driven data. In turn, our partners leverage the data to train models tailored to their specific use cases. Furthermore, to drive the advancement of the entire embodied AI field, we have open-sourced 10,000 hours of the dataset for the broader community. Equipped with Daimon’s visuotactile sensor, the gripper delicately senses contact and precisely controls force to pick up a fragile eggshell.Daimon Robotics From VLA to VTLA: Why Tactile Sensing Changes the Equation The mainstream paradigm in robotics is currently the Vision-Language-Action (VLA) model, but your team has proposed a Vision-Tactile-Language-Action (VTLA) model. Why is it necessary to incorporate tactile sensing? What does it enable robots to achieve, and which tasks are likely to fail without tactile feedback? Over these years of working to make generalist robots capable of performing manipulation tasks, especially dexterous manipulation — not just power grasping or holding an object, but manipulating objects and using tools to impart forces and motion onto parts — we see these robots being used in household as well as industrial assembly settings. It is well established that tactile information is essential for providing feedback about contact states so that robots can guide their hands and fingers to perform reliable manipulation. Without tactile sensing, robots are severely limited. They struggle to locate objects in dark environments, and without slip detection, they can easily drop fragile items like glass. Furthermore, the inability to precisely control force often leads to failed manipulation tasks or, in severe cases, physical damage. Naturally, the VLA approach needs to be enhanced to incorporate tactile information. We expanded the VLA framework to incorporate tactile data, creating the VTLA model. An additional benefit of our tactile sensor is that it is vision-based: We capture visual images of the deformation on the fingertip surface. We capture multiple images in a time sequence that encodes contact information, from which we can infer forces and other contact states. This aligns well with the visual framework that VLA is based upon. Having tactile information in a visual image format makes it naturally suitable for integration into the VLA framework, transforming it into a VTLA system. That is the key advantage: Vision-based tactile sensors provide very high resolution at the pixel level, and this data can be incorporated into the framework, whether it is an end-to-end model or another type of architecture. DAIMON has been known for its vision-based tactile sensors that can pack over 110,000 effective sensing units.DAIMON Robotics The Technology: Monochromatic Vision-based Tactile Sensing You and your team have spent many years deeply engaged in vision-based tactile sensing and have developed the world’s first monochromatic vision-based tactile sensing technology. Why did you choose this technical path? Once we started investigating tactile sensors, we understood our needs. We wanted sensors that closely mimic what we have under our fingertip skin. Physiological studies have well documented the capabilities humans have at their fingertips — knowing what we touch, what kind of material it is, how forces are distributed, and whether it is moving into the right position as our brain controls our hands. We knew that replicating these capabilities on a robot hand’s fingertips would help considerably. When we surveyed existing technologies, we found many types, including vision-based tactile sensors with tri-color optics and other simpler designs. We decided to integrate the best of these into an engineering-robust solution that works well without being overly complicated, keeping cost, reliability, and sensitivity within a satisfactory range, thus ultimately developing a monochromatic vision-based tactile sensing technique. This is fundamentally an engineering approach rather than a purely scientific one, since a great deal of foundational research already existed. With the growing realization of the necessity of tactile data, all of this will advance hand in hand. DAIMON vision-based tactile sensor captures high-quality, multimodal tactile data.DAIMON Robotics Last year, DAIMON launched a multi-dimensional, high-resolution, high-frequency vision-based tactile sensor. Compared with traditional tactile sensors, where does its core advantage lie? Which industries could it potentially transform? The key features of our sensors are the density of distributed force measurement and the deformation we can capture over the area of a fingertip. I believe we have the highest density in terms of sensing units. That is one very important metric. The other is dynamics: the frequency and bandwidth — how quickly we can detect force changes, transmit signals, and process them in real time. Other important aspects are largely engineering-related, such as reliability, drift, durability of the soft surface, and resistance to interference from magnetic, optical, or environmental factors. A growing number of researchers and companies are recognizing the importance of tactile sensing and adopting our technology. I believe the advances in tactile sensing will elevate the entire community and industry to a higher level. One of our potential customers is deploying humanoid robots in a small convenience store, with densely packed shelves where shelf space is at a premium. The robot needs to reach into very tight spaces — tighter than books on a shelf — to pick out an object. Current two-jaw parallel grippers cannot fit into most of these spaces. Observing how humans pick up objects, you clearly need at least three slim fingers to touch and roll the object toward you and secure it. Thus, we are starting to see very specific needs where tactile sensing capabilities are essential. From Academia to Startup After 40 years in academia — founding the HKUST Robotics Institute, earning prestigious honors including IEEE Fellow, and serving as Editor-in-Chief of IEEE TASE — what motivated you to found DAIMON Robotics? I have come a long way. I started learning robotics during my PhD at Carnegie Mellon, where there were truly remarkable groups working on locomotion under Marc Raibert, who founded Boston Dynamics, and on manipulation under my advisor, Matt Mason, a leader in the field. We have been working on dexterous manipulation, not only at Carnegie Mellon, but globally for many years. However, progress has been limited for a long time, especially in building dexterous hands and making them work. Only recently have locomotion robots truly taken off, and only in the last few years have we begun to see major advancements in robot hands. There is clearly room for advancing manipulation capabilities, which would enable robots to do work like humans. While at Hong Kong University of Science and Technology, I saw increasingly greater people entering this area in the form of students and postdoctoral researchers. We wanted to jumpstart our effort by leveraging the available capital and talent resources. Fortunately, one of my postdocs, Dr. Duan Jianghua, has a strong sense for commercial opportunities. Recognizing the rapid growth of robotics market and the unique value that our vision-based tactile sensing technology could bring, together we started DAIMON Robotics, and it has progressed well. The community has grown tremendously in China, Japan, Korea, the U.S., and Europe. Robots equipped with DAIMON technology have been deployed in factory settings. The company aims to enable robots to achieve “embodied intelligence” and close the gap between what they can see and what they can feel.DAIMON Robotics Business Model and Commercial Strategy What is DAIMON’s current business model and strategic focus? What role does the dataset release play in your commercial strategy? We started as a device company focused on making highly capable tactile sensors, especially for robot hands. But as technology and business developed, everyone realized it is not just about one component, rather the entire technology chain: devices, data of adequate quality and quantity, and finally the right framework to build, train, and deploy models on robots in real application environments. Our business strategy is best described as “3D”: Devices, Data, and Deployment. We build devices for data collection, our own ecosystem, and for deploying them in our partners’ potential application domains. This enables the collection of real-world tactile-rich data and complete closed-loop validation. This will become an integral part of the 3D business model. Most startups in this space are following a similar path until eventually some may become more specialized or more tightly integrated with other companies. For now, it is mostly vertical integration. Embodied Skills and the Convergence Moment You’ve introduced the concept of “embodied skills” as essential for humanoid robots to move beyond having just an advanced AI “brain.” What prompted this insight? What new capabilities could embodied skills enable? After the rapid evolution of models and hardware over the past two years, has your definition or roadmap for embodied skills evolved? We have come a long way now see a convergence point where electrical, electronic, and mechatronic hardware technologies have advanced tremendously in last two decades. Robots are now fully electric, do not require hydraulics, because hardware has evolved rapidly. Modern electronics provide tremendous bandwidth with high torques. If we can build intelligence into these systems, we can create truly humanoid robots with the ability to operate in unstructured environments, make decisions, and take actions autonomously. “Our vision is for robots to achieve robust manipulation capabilities and evolve into reliable partners for humans.” —Prof. Michael Yu Wang, DAIMON Robotics AI has arrived at exactly the right time. Enormous resources have been invested in AI development, especially large language models, which are now being generalized into world models that enable physical AI capabilities. We would like to see these manifested in real-world systems. While both AI and core hardware technologies continue to evolve, the focus is much clearer now. For example, human-sized robots are preferred in a home environment. This is an exciting domain with a promise of great societal benefit if we can eventually achieve safe, reliable, and cost-effective robots. The Road to Real-World Deployment Today, many robots can deliver impressive demos, yet there remains a gap before they truly enter real-world applications. What could be a potential trigger for real-world deployment? Which scenarios are most likely to achieve large-scale deployment first? I think the road toward large-scale deployment of generalist robots is still long, but we are starting to see signs of feasibility within specific domains. It is very similar to autonomous vehicles, where we are yet to see full deployment of robo-taxis, while we have already started to find mobile robots and smaller vehicles widely deployed in the hospitality industry. Virtually every major hotel in China now has a delivery robot — no arms, just a vehicle that picks up items from the hotel lobby (e.g., food deliveries). The delivery person just loads the food and selects the room number. It is up to the robot thereafter to navigate and reach the guest’s room, which includes using the elevator, to deliver the food. This is already nearly 100 percent deployed in major Chinese hotels. Hotel and restaurant robots are viewed as a model for deploying humanoid robots in specific domains like overnight drugstores and convenience stores. I expect complete deployment in such settings within a short timeframe, followed by other applications. Overall, we can expect autonomous robots, including humanoids, to progressively penetrate specific sectors, delivering value in each and expanding into others. Ultimately, our vision is for robots to achieve robust manipulation capabilities and evolve into reliable partners for humans. By seamlessly integrating into our homes and daily lives, they will genuinely benefit and serve humanity. This interview has been edited for length and clarity.
Last month, President Donald Trump hosted Japanese Prime Minister Sanae Takaichi for a visit that captured both the promise and the shortcomings of America’s Indo‑Pacific strategy.In some ways, the meeting was a success: It produced a few commercial deals, reaffirmed the strength of the bilateral relationship, and — most importantly — demonstrated a visibly warm personal rapport between the two leaders (despite an awkward moment). But as has so often been the case during America’s fitful “pivot” to Asia over the past two decades, the visit was overshadowed by yet another conflict in the Middle East that is absorbing U.S. The post Correcting Course in the Indo‑Pacific appeared first on War on the Rocks.
Hungarian Prime Minister Viktor Orbán conceded defeat in a parliamentary election on April 12, ending his 16 years in power, after his Fidesz party lost its majority in parliament. The center-right Tisza party, led by Péter Magyar, won and is projected to have a two-thirds supermajority. Orbán has been a prominent right-wing populist, with close ties to the Trump administration in Washington and warm relations with Moscow. Magyar campaigned on promises to address corruption, improve the economy, and align more closely with Europe.We asked five experts to assess how the election results will shape Hungary’s role in Europe and its relationships The post Hungary Turns a New Page appeared first on War on the Rocks.
An anticipated meeting between Taiwan's President Tsai Ing-wen and US House Speaker Kevin McCarthy in California this week has sparked concerns of a repeat of the pressure campaign China launched last year when then-Speaker Nancy Pelosi visited Taipei.
Some VIP Twitter users woke up on Saturday expecting to have lost their coveted blue verification check marks in a previously announced purge by Elon Musk. Instead, Twitter appeared to target a single account from a major publication Musk dislikes and changed the language on its site in a way that obscures why users are verified.
Scientists in Germany say they've been able to make a nasal vaccine that can shut down a Covid-19 infection in the nose and throat, where the virus gets its first foothold in the body.
Andrew Ng has serious street cred in artificial intelligence. He pioneered the use of graphics processing units (GPUs) to train deep learning models in the late 2000s with his students at Stanford University, cofounded Google Brain in 2011, and then served for three years as chief scientist for Baidu, where he helped build the Chinese tech giant’s AI group. So when he says he has identified the next big shift in artificial intelligence, people listen. And that’s what he told IEEE Spectrum in an exclusive Q&A. Ng’s current efforts are focused on his company Landing AI, which built a platform called LandingLens to help manufacturers improve visual inspection with computer vision. He has also become something of an evangelist for what he calls the data-centric AI movement, which he says can yield “small data” solutions to big issues in AI, including model efficiency, accuracy, and bias. Andrew Ng on... What’s next for really big models The career advice he didn’t listen to Defining the data-centric AI movement Synthetic data Why Landing AI asks its customers to do the work The great advances in deep learning over the past decade or so have been powered by ever-bigger models crunching ever-bigger amounts of data. Some people argue that that’s an unsustainable trajectory. Do you agree that it can’t go on that way? Andrew Ng: This is a big question. We’ve seen foundation models in NLP [natural language processing]. I’m excited about NLP models getting even bigger, and also about the potential of building foundation models in computer vision. I think there’s lots of signal to still be exploited in video: We have not been able to build foundation models yet for video because of compute bandwidth and the cost of processing video, as opposed to tokenized text. So I think that this engine of scaling up deep learning algorithms, which has been running for something like 15 years now, still has steam in it. Having said that, it only applies to certain problems, and there’s a set of other problems that need small data solutions. When you say you want a foundation model for computer vision, what do you mean by that? Ng: This is a term coined by Percy Liang and some of my friends at Stanford to refer to very large models, trained on very large data sets, that can be tuned for specific applications. For example, GPT-3 is an example of a foundation model [for NLP]. Foundation models offer a lot of promise as a new paradigm in developing machine learning applications, but also challenges in terms of making sure that they’re reasonably fair and free from bias, especially if many of us will be building on top of them. What needs to happen for someone to build a foundation model for video? Ng: I think there is a scalability problem. The compute power needed to process the large volume of images for video is significant, and I think that’s why foundation models have arisen first in NLP. Many researchers are working on this, and I think we’re seeing early signs of such models being developed in computer vision. But I’m confident that if a semiconductor maker gave us 10 times more processor power, we could easily find 10 times more video to build such models for vision. Having said that, a lot of what’s happened over the past decade is that deep learning has happened in consumer-facing companies that have large user bases, sometimes billions of users, and therefore very large data sets. While that paradigm of machine learning has driven a lot of economic value in consumer software, I find that that recipe of scale doesn’t work for other industries. Back to top It’s funny to hear you say that, because your early work was at a consumer-facing company with millions of users. Ng: Over a decade ago, when I proposed starting the Google Brain project to use Google’s compute infrastructure to build very large neural networks, it was a controversial step. One very senior person pulled me aside and warned me that starting Google Brain would be bad for my career. I think he felt that the action couldn’t just be in scaling up, and that I should instead focus on architecture innovation. “In many industries where giant data sets simply don’t exist, I think the focus has to shift from big data to good data. Having 50 thoughtfully engineered examples can be sufficient to explain to the neural network what you want it to learn.” —Andrew Ng, CEO & Founder, Landing AI I remember when my students and I published the first NeurIPS workshop paper advocating using CUDA, a platform for processing on GPUs, for deep learning—a different senior person in AI sat me down and said, “CUDA is really complicated to program. As a programming paradigm, this seems like too much work.” I did manage to convince him; the other person I did not convince. I expect they’re both convinced now. Ng: I think so, yes. Over the past year as I’ve been speaking to people about the data-centric AI movement, I’ve been getting flashbacks to when I was speaking to people about deep learning and scalability 10 or 15 years ago. In the past year, I’ve been getting the same mix of “there’s nothing new here” and “this seems like the wrong direction.” Back to top How do you define data-centric AI, and why do you consider it a movement? Ng: Data-centric AI is the discipline of systematically engineering the data needed to successfully build an AI system. For an AI system, you have to implement some algorithm, say a neural network, in code and then train it on your data set. The dominant paradigm over the last decade was to download the data set while you focus on improving the code. Thanks to that paradigm, over the last decade deep learning networks have improved significantly, to the point where for a lot of applications the code—the neural network architecture—is basically a solved problem. So for many practical applications, it’s now more productive to hold the neural network architecture fixed, and instead find ways to improve the data. When I started speaking about this, there were many practitioners who, completely appropriately, raised their hands and said, “Yes, we’ve been doing this for 20 years.” This is the time to take the things that some individuals have been doing intuitively and make it a systematic engineering discipline. The data-centric AI movement is much bigger than one company or group of researchers. My collaborators and I organized a data-centric AI workshop at NeurIPS, and I was really delighted at the number of authors and presenters that showed up. You often talk about companies or institutions that have only a small amount of data to work with. How can data-centric AI help them? Ng: You hear a lot about vision systems built with millions of images—I once built a face recognition system using 350 million images. Architectures built for hundreds of millions of images don’t work with only 50 images. But it turns out, if you have 50 really good examples, you can build something valuable, like a defect-inspection system. In many industries where giant data sets simply don’t exist, I think the focus has to shift from big data to good data. Having 50 thoughtfully engineered examples can be sufficient to explain to the neural network what you want it to learn. When you talk about training a model with just 50 images, does that really mean you’re taking an existing model that was trained on a very large data set and fine-tuning it? Or do you mean a brand new model that’s designed to learn only from that small data set? Ng: Let me describe what Landing AI does. When doing visual inspection for manufacturers, we often use our own flavor of RetinaNet. It is a pretrained model. Having said that, the pretraining is a small piece of the puzzle. What’s a bigger piece of the puzzle is providing tools that enable the manufacturer to pick the right set of images [to use for fine-tuning] and label them in a consistent way. There’s a very practical problem we’ve seen spanning vision, NLP, and speech, where even human annotators don’t agree on the appropriate label. For big data applications, the common response has been: If the data is noisy, let’s just get a lot of data and the algorithm will average over it. But if you can develop tools that flag where the data’s inconsistent and give you a very targeted way to improve the consistency of the data, that turns out to be a more efficient way to get a high-performing system. “Collecting more data often helps, but if you try to collect more data for everything, that can be a very expensive activity.” —Andrew Ng For example, if you have 10,000 images where 30 images are of one class, and those 30 images are labeled inconsistently, one of the things we do is build tools to draw your attention to the subset of data that’s inconsistent. So you can very quickly relabel those images to be more consistent, and this leads to improvement in performance. Could this focus on high-quality data help with bias in data sets? If you’re able to curate the data more before training? Ng: Very much so. Many researchers have pointed out that biased data is one factor among many leading to biased systems. There have been many thoughtful efforts to engineer the data. At the NeurIPS workshop, Olga Russakovsky gave a really nice talk on this. At the main NeurIPS conference, I also really enjoyed Mary Gray’s presentation, which touched on how data-centric AI is one piece of the solution, but not the entire solution. New tools like Datasheets for Datasets also seem like an important piece of the puzzle. One of the powerful tools that data-centric AI gives us is the ability to engineer a subset of the data. Imagine training a machine-learning system and finding that its performance is okay for most of the data set, but its performance is biased for just a subset of the data. If you try to change the whole neural network architecture to improve the performance on just that subset, it’s quite difficult. But if you can engineer a subset of the data you can address the problem in a much more targeted way. When you talk about engineering the data, what do you mean exactly? Ng: In AI, data cleaning is important, but the way the data has been cleaned has often been in very manual ways. In computer vision, someone may visualize images through a Jupyter notebook and maybe spot the problem, and maybe fix it. But I’m excited about tools that allow you to have a very large data set, tools that draw your attention quickly and efficiently to the subset of data where, say, the labels are noisy. Or to quickly bring your attention to the one class among 100 classes where it would benefit you to collect more data. Collecting more data often helps, but if you try to collect more data for everything, that can be a very expensive activity. For example, I once figured out that a speech-recognition system was performing poorly when there was car noise in the background. Knowing that allowed me to collect more data with car noise in the background, rather than trying to collect more data for everything, which would have been expensive and slow. Back to top What about using synthetic data, is that often a good solution? Ng: I think synthetic data is an important tool in the tool chest of data-centric AI. At the NeurIPS workshop, Anima Anandkumar gave a great talk that touched on synthetic data. I think there are important uses of synthetic data that go beyond just being a preprocessing step for increasing the data set for a learning algorithm. I’d love to see more tools to let developers use synthetic data generation as part of the closed loop of iterative machine learning development. Do you mean that synthetic data would allow you to try the model on more data sets? Ng: Not really. Here’s an example. Let’s say you’re trying to detect defects in a smartphone casing. There are many different types of defects on smartphones. It could be a scratch, a dent, pit marks, discoloration of the material, other types of blemishes. If you train the model and then find through error analysis that it’s doing well overall but it’s performing poorly on pit marks, then synthetic data generation allows you to address the problem in a more targeted way. You could generate more data just for the pit-mark category. “In the consumer software Internet, we could train a handful of machine-learning models to serve a billion users. In manufacturing, you might have 10,000 manufacturers building 10,000 custom AI models.” —Andrew Ng Synthetic data generation is a very powerful tool, but there are many simpler tools that I will often try first. Such as data augmentation, improving labeling consistency, or just asking a factory to collect more data. Back to top To make these issues more concrete, can you walk me through an example? When a company approaches Landing AI and says it has a problem with visual inspection, how do you onboard them and work toward deployment? Ng: When a customer approaches us we usually have a conversation about their inspection problem and look at a few images to verify that the problem is feasible with computer vision. Assuming it is, we ask them to upload the data to the LandingLens platform. We often advise them on the methodology of data-centric AI and help them label the data. One of the foci of Landing AI is to empower manufacturing companies to do the machine learning work themselves. A lot of our work is making sure the software is fast and easy to use. Through the iterative process of machine learning development, we advise customers on things like how to train models on the platform, when and how to improve the labeling of data so the performance of the model improves. Our training and software supports them all the way through deploying the trained model to an edge device in the factory. How do you deal with changing needs? If products change or lighting conditions change in the factory, can the model keep up? Ng: It varies by manufacturer. There is data drift in many contexts. But there are some manufacturers that have been running the same manufacturing line for 20 years now with few changes, so they don’t expect changes in the next five years. Those stable environments make things easier. For other manufacturers, we provide tools to flag when there’s a significant data-drift issue. I find it really important to empower manufacturing customers to correct data, retrain, and update the model. Because if something changes and it’s 3 a.m. in the United States, I want them to be able to adapt their learning algorithm right away to maintain operations. In the consumer software Internet, we could train a handful of machine-learning models to serve a billion users. In manufacturing, you might have 10,000 manufacturers building 10,000 custom AI models. The challenge is, how do you do that without Landing AI having to hire 10,000 machine learning specialists? So you’re saying that to make it scale, you have to empower customers to do a lot of the training and other work. Ng: Yes, exactly! This is an industry-wide problem in AI, not just in manufacturing. Look at health care. Every hospital has its own slightly different format for electronic health records. How can every hospital train its own custom AI model? Expecting every hospital’s IT personnel to invent new neural-network architectures is unrealistic. The only way out of this dilemma is to build tools that empower the customers to build their own models by giving them tools to engineer the data and express their domain knowledge. That’s what Landing AI is executing in computer vision, and the field of AI needs other teams to execute this in other domains. Is there anything else you think it’s important for people to understand about the work you’re doing or the data-centric AI movement? Ng: In the last decade, the biggest shift in AI was a shift to deep learning. I think it’s quite possible that in this decade the biggest shift will be to data-centric AI. With the maturity of today’s neural network architectures, I think for a lot of the practical applications the bottleneck will be whether we can efficiently get the data we need to develop systems that work well. The data-centric AI movement has tremendous energy and momentum across the whole community. I hope more researchers and developers will jump in and work on it. Back to top This article appears in the April 2022 print issue as “Andrew Ng, AI Minimalist.”
The end of Moore’s Law is looming. Engineers and designers can do only so much to miniaturize transistors and pack as many of them as possible into chips. So they’re turning to other approaches to chip design, incorporating technologies like AI into the process. Samsung, for instance, is adding AI to its memory chips to enable processing in memory, thereby saving energy and speeding up machine learning. Speaking of speed, Google’s TPU V4 AI chip has doubled its processing power compared with that of its previous version. But AI holds still more promise and potential for the semiconductor industry. To better understand how AI is set to revolutionize chip design, we spoke with Heather Gorr, senior product manager for MathWorks’ MATLAB platform. How is AI currently being used to design the next generation of chips? Heather Gorr: AI is such an important technology because it’s involved in most parts of the cycle, including the design and manufacturing process. There’s a lot of important applications here, even in the general process engineering where we want to optimize things. I think defect detection is a big one at all phases of the process, especially in manufacturing. But even thinking ahead in the design process, [AI now plays a significant role] when you’re designing the light and the sensors and all the different components. There’s a lot of anomaly detection and fault mitigation that you really want to consider. Heather GorrMathWorks Then, thinking about the logistical modeling that you see in any industry, there is always planned downtime that you want to mitigate; but you also end up having unplanned downtime. So, looking back at that historical data of when you’ve had those moments where maybe it took a bit longer than expected to manufacture something, you can take a look at all of that data and use AI to try to identify the proximate cause or to see something that might jump out even in the processing and design phases. We think of AI oftentimes as a predictive tool, or as a robot doing something, but a lot of times you get a lot of insight from the data through AI. What are the benefits of using AI for chip design? Gorr: Historically, we’ve seen a lot of physics-based modeling, which is a very intensive process. We want to do a reduced order model, where instead of solving such a computationally expensive and extensive model, we can do something a little cheaper. You could create a surrogate model, so to speak, of that physics-based model, use the data, and then do your parameter sweeps, your optimizations, your Monte Carlo simulations using the surrogate model. That takes a lot less time computationally than solving the physics-based equations directly. So, we’re seeing that benefit in many ways, including the efficiency and economy that are the results of iterating quickly on the experiments and the simulations that will really help in the design. So it’s like having a digital twin in a sense? Gorr: Exactly. That’s pretty much what people are doing, where you have the physical system model and the experimental data. Then, in conjunction, you have this other model that you could tweak and tune and try different parameters and experiments that let sweep through all of those different situations and come up with a better design in the end. So, it’s going to be more efficient and, as you said, cheaper? Gorr: Yeah, definitely. Especially in the experimentation and design phases, where you’re trying different things. That’s obviously going to yield dramatic cost savings if you’re actually manufacturing and producing [the chips]. You want to simulate, test, experiment as much as possible without making something using the actual process engineering. We’ve talked about the benefits. How about the drawbacks? Gorr: The [AI-based experimental models] tend to not be as accurate as physics-based models. Of course, that’s why you do many simulations and parameter sweeps. But that’s also the benefit of having that digital twin, where you can keep that in mind—it’s not going to be as accurate as that precise model that we’ve developed over the years. Both chip design and manufacturing are system intensive; you have to consider every little part. And that can be really challenging. It’s a case where you might have models to predict something and different parts of it, but you still need to bring it all together. One of the other things to think about too is that you need the data to build the models. You have to incorporate data from all sorts of different sensors and different sorts of teams, and so that heightens the challenge. How can engineers use AI to better prepare and extract insights from hardware or sensor data? Gorr: We always think about using AI to predict something or do some robot task, but you can use AI to come up with patterns and pick out things you might not have noticed before on your own. People will use AI when they have high-frequency data coming from many different sensors, and a lot of times it’s useful to explore the frequency domain and things like data synchronization or resampling. Those can be really challenging if you’re not sure where to start. One of the things I would say is, use the tools that are available. There’s a vast community of people working on these things, and you can find lots of examples [of applications and techniques] on GitHub or MATLAB Central, where people have shared nice examples, even little apps they’ve created. I think many of us are buried in data and just not sure what to do with it, so definitely take advantage of what’s already out there in the community. You can explore and see what makes sense to you, and bring in that balance of domain knowledge and the insight you get from the tools and AI. What should engineers and designers consider when using AI for chip design? Gorr: Think through what problems you’re trying to solve or what insights you might hope to find, and try to be clear about that. Consider all of the different components, and document and test each of those different parts. Consider all of the people involved, and explain and hand off in a way that is sensible for the whole team. How do you think AI will affect chip designers’ jobs? Gorr: It’s going to free up a lot of human capital for more advanced tasks. We can use AI to reduce waste, to optimize the materials, to optimize the design, but then you still have that human involved whenever it comes to decision-making. I think it’s a great example of people and technology working hand in hand. It’s also an industry where all people involved—even on the manufacturing floor—need to have some level of understanding of what’s happening, so this is a great industry for advancing AI because of how we test things and how we think about them before we put them on the chip. How do you envision the future of AI and chip design? Gorr: It’s very much dependent on that human element—involving people in the process and having that interpretable model. We can do many things with the mathematical minutiae of modeling, but it comes down to how people are using it, how everybody in the process is understanding and applying it. Communication and involvement of people of all skill levels in the process are going to be really important. We’re going to see less of those superprecise predictions and more transparency of information, sharing, and that digital twin—not only using AI but also using our human knowledge and all of the work that many people have done over the years.