The New York Times
진보 성향
정치
Europe is Edging Closer to a Trade War With China. Here’s Why.
As cheap goods pour in, threatening the continent’s manufacturing sector, a search for solutions is becoming increasingly urgent.
🇺🇸 미국 · "CLOSER" · 총 61건
필터 보기현재 지수
50.0
0 = 부정 우세
50 = 중립
100 = 긍정 우세
최근 7일 기준 11,424건을 분석한 결과, 뉴스 심리지수는 50.0(균형)입니다. 긍정 1건(0.0%)·중립 11,422건(100.0%)·부정 1건(0.0%)이며, 중립 비중이 뚜렷하게 높습니다. 성향 지수는 종합 19.3(중도 균형)입니다.
As cheap goods pour in, threatening the continent’s manufacturing sector, a search for solutions is becoming increasingly urgent.
The White House launched aliens.gov, a space-themed site with live illegal immigrant arrest data, ICE heat maps and a tip line to report aliens.
New renders offer a closer look at Apple’s planned AI overhaul for iOS 27, including a redesigned Siri experience powered and standalone Siri app.
The mayor is giving serious thought to getting behind Darializa Avila Chevalier, a democratic socialist who is challenging Representative Adriano Espaillat.
Senate Majority Leader John Thune (R-SD) threw his support behind Texas Attorney General Ken Paxton on Wednesday, bringing Senate leadership one step closer to coalescing around a Republican they spent months trying to defeat. Thune endorsed Paxton on the heels of his victory against Sen. John Cornyn (R-TX), telling conservative radio host Hugh Hewitt that […]
Giles Dudley brought an immersive pop-up exhibition to the U.S., showing that wars are closer to us than we might think.
The Knicks know they’ll be in their first NBA Final in 27 years. Now they’re one Oklahoma City win away from knowing they’ll face the Thunder.
From Lake Como's still Alpine reflections to a loggerhead turtle beach closer to Tunisia than to Rome
When students stop showing up, the education establishment treats it as a discipline problem. It may be closer to a performance review.
President Trump has signaled on social media that the U.S. and Iran are moving closer to a deal that could reopen the Strait of Hormuz, but Tehran refuted some of the claims. CBS News national security analyst Aaron MacLean has more.
Cuban-American lawmakers warn Cuba is near collapse and say the Trump administration has a window to reshape the Western Hemisphere's future.
President Trump on Saturday said a deal with Iran to end the war is getting closer, but a number of Republicans and other conservatives said they feared the emerging agreement was not a good one for the United States. The emerging deal is likely to take center stage on the Sunday talk shows over Memorial...
U.S. officials and negotiators were discussing a process to reopen the Strait of Hormuz, sources briefed on the conversations said.
From the Mercedes-Benz G-Class EV's perfect interior score to a Ram 1500 that rides closer to a luxury SUV than a pickup truck
The mega rocket made its debut two days after SpaceX CEO Elon Musk announced he's taking the company public. NASA Administrator Jared Isaacman said Starship is now one step closer to the moon.
Over the next few decades, billions of autonomous, AI-powered robots will work alongside people in factories, perform tedious tasks in warehouses, care for the elderly, assist in unsafe disaster areas, deliver packages and food to our doorsteps, and eventually help out in our homes. Some will look like us, and many won’t. What is certain is that regardless of form factor, robots will all rely heavily on AI in order to deliver real-world value. In 2025, total investments in robotics companies reached a record US $40.7 billion, accounting for 9 percent of all venture funding. The multibillion dollar question therefore is this: What will it take for AI-powered robots to begin to have a serious economic impact? Many of today’s robotics and AI companies are making bold claims, such as that humanoid robots will soon be coming into our homes, but there’s still a big gap between promise and reality. The promise of robots that live and work alongside us has been the stuff of science fiction for a very long time. And while many programmers have tried to make that promise a reality, the physical world is just too complicated for traditional computer programs to handle the endless complexity it presents. Thanks to AI, robots are no longer being programmed—instead, they learn to operate in the real world. With enough practice, they can learn to perceive and understand the world around them, reason about that world, and use that reason and understanding to perform tasks that are useful, reliable, and safe. The two of us have worked at the forefront of AI and robotics for the last decade, as a Professor in Robotics at Oregon State University and Co-Founder of Agility Robotics, and as former CEO of the Everyday Robots moonshot at Google X. Our experience deploying AI-powered robots in real-world settings has given us a perspective on where AI can be used to great benefit in complex robotic systems in the near term and where we are still on the frontier of science fiction. We believe AI will enable an inflection point in robotics advances, but that it will be through the well-engineered application of coordinated systems of different AI tools rather than a single ChatGPT-style breakthrough. As the excitement around AI is matched only by the uncertainty of what will be possible, here are five hard truths that will define AI in robotics. 1. The YouTube-to-Reality Gap Is Real For years, we have been seeing videos on YouTube with humanoid robots performing amazing moves on everything from a dance floor to an obstacle course. The inside knowledge in robotics is to “never trust a YouTube robot video.” The gap between real robots that can perform real work in unstructured human environments and carefully scripted and edited robot performances remains significant. The latest performance to get a lot of attention was a martial arts show featuring Unitree humanoid robots performing with children at the Chinese 2026 Spring Festival Gala. While impressive, this falls into a long lineage of tightly scripted robotic performances, where everything has been carefully choreographed and planned in advance. The low-level controls, synchronization, and choreography were stunning, yet the Spring Gala robot performance showed a level of autonomy and intelligence much closer to industrial robots building cars in a factory than something that will show up in your living room any time soon. Seeing these kinds of demos nevertheless raises questions about where robotics really is. If robots can perform kung fu moves and do backflips and dance, why aren’t they also showing up on factory floors yet? And why can’t they do the dishes in my home after dinner? The simple answer is this: Making AI-powered robots capable of performing general tasks in varied human environments is still really hard. While impressive technological feats like those at the Spring Festival may make it look like we could be very close, the use of AI in these demos is only for low-level motor control (to keep the robots from falling over) and therefore is only a small part of the solution for robots to be general purpose in the real, unstructured spaces where we humans live and work. 2. Data Is An Unsolved Challenge Large Language Models (LLMs) like OpenAI’s ChatGPT and Anthropic’s Claude were initially trained on an internet-scale database of text. The world woke up one day in late 2022 to ChatGPT demonstrating that AI computers could suddenly “speak” to us in prose or verse and about seemingly any topic. LLMs have turned out to generalize well and are now able to take multimodal input (text, images, video) and produce multimodal output. Importantly, the corpus of training data was both enormous and human-generated, which are characteristics that form the gold standard for AI training. The fastest path to robots as part of everyday life may emerge through a range of robot forms performing increasingly sophisticated applications and employing a range of AI tools.Agility Robotics Giving AI a body (in the form of a robot), so that it can engage with people in the physical world, continues to be a very difficult and broadly unsolved problem. AI models for general-purpose robotics must simultaneously satisfy multiple, often conflicting, physical, geometric, and temporal limitations while operating in unstructured, dynamic environments. In order to generalize, robot models need to be trained on data gathered in a high-dimensional configuration space, where “dimensions” represent text, lighting conditions, degrees of freedom, joint limits, velocities, force, and safety boundaries, just to mention a few. Importantly, this must be good data—it must contain many examples from what amounts to an infinite number of possible configurations in the physical world. Since there are very few existing sources of data like this, approaches like teleoperation, video analysis, motion capture of humans, and self-exploration in simulation and in the real world are all seen as important ways to collect data. It’s a herculean task. For example, at Everyday Robots at Google X, we ran 240 million robot instances in our simulator over the course of 2022 to collect training data, mostly to train a trash-sorting model. Similar amounts of data will be needed for every skill to get to a similar level of capability, which is not yet human level. 3. There Will Be No Single Robot AI We are far away from a moment where a single AI model might allow general-purpose robots to live and work alongside us. General-purpose robots can have wheels or legs. They can have one, two, three, or more arms. Some have propellers and can fly, while others may be designed to operate under water. Some will drive on busy roads. The physical world is infinitely varied and complex. And then there are all the people and other animals that will be surrounding the robots. How do you train a model to operate a robot safely and reliably in all of these settings? The simple answer is: You don’t. At least not for quite some time. We believe the winning AI architecture leading to the next big breakthroughs in general-purpose robotics will be “agentic AI” for robots, which are high-level coordinating models that can reason, plan, use tools, and learn from outcomes to execute complex tasks with limited supervision. Agentic, high-level models running on robots will invoke a system of specialized ones for different types of tasks. We will likely soon see multiple robots collaborating and coordinating with each other through their onboard agentic AI models. AI tools are unlocking new and powerful capabilities in robotics, which in turn will enable new solutions and new markets. It’s encouraging to see these new models being made broadly available, some even as open-source solutions. This availability is akin to what happened with the internet: Real progress occurred when it became ubiquitous. We anticipate an inevitable democratization of complex behaviors in robotics with wide access to these AI tools and technologies. 4. Hardware Is Still Very Hard Robots are complex systems with many parts that all need to work together with great precision. For a robot to be useful and safe, every part of it must be coordinated, from its perception systems to the computer controlling it, all the way down to its individual actuators. Actuators—that is, the motors and gears—are a good example of an important part of the robot where what got us here won’t get us there. The actuators used at scale by most industrial robots will not work for robots that will operate in human environments. If these robots accidentally collide with an obstacle, the resulting impacts are harsh, forces are high, and things break. Humans don’t move in this way. We are far more compliant in how we interact with the world, and we’re constantly making contact with our environment and using that contact to help us accomplish things. Consider the challenge of inserting a key in a lock: Humans typically don’t do this by aligning the key perfectly with the keyhole. Instead, we just feel for the edge of the keyhole and jiggle the key in. Robots need to be able to operate in novel ways to achieve comparable capabilities by using a new class of actuators that are sensitive to force and able to have a compliant interaction with the environment. While these kinds of actuators do exist, they are not yet generally available at scale for robot systems designed to operate around people. 5. Real Value Comes From “Easy” Tasks There’s a big difference between tasks that look impressive and real-world tasks that provide value. Robotics is a perfect example of Moravec’s paradox, which states that tasks that are hard for humans are easy for computers (like multiplying two big numbers), and tasks easy for humans (like a toddler’s movements) are extremely difficult for computers and robots. Serving customers is an unforgiving reality check, because customers only care about solving the real problems they have. If we are to deploy AI-based robot solutions, they must outperform the way things are currently done while demonstrating reliable performance metrics and safety. Agility Robotics’ early work to deploy our humanoid robot Digit in customer locations led to the realization that our first obstacle was safety: Robots that balance and manipulate objects in human spaces bring new types of risk to the workplace. In the first humanoid deployments, physical barriers were necessary, and Agility kicked off a multi-year engineering effort to solve the safety challenge, touching nearly every aspect of robot design and relying heavily on new AI-based approaches to human detection and behavior control. Everyday Robots at Google deployed robots in 2019 that worked autonomously in office buildings doing chores like cleaning cafe tables and sorting trash. We quickly learned how “messy” and difficult the real world is for a robot. This experience informed the architecture and deployment of our AI systems while also gathering real-world data that could be combined with simulation data for training and improving models. This focus on creating a product to meet specific customer needs and deploying robots in real-world settings is the only way to inform the structure of the AI tools and infrastructure for near-term utility on a path towards long-term broader capability and generality. There will be no “aha” moment, no silver bullet algorithm, and no volume of data sufficient to produce a general-purpose robot without extensive real-world experience. AI Robots Are Coming, One Step at a Time As we look to the future, there is no doubt that the world is bringing AI into the physical world through robots. We are at the beginning of a “Cambrian explosion“ of useful, intelligent machines. We believe AI is not one tool, but a huge frontier of technical approaches that is unlocking new capabilities so powerful, they will define our economy moving forward. This will happen not in one single definitive moment, but as an ongoing set of small and large breakthroughs, where AI-driven robots begin to provide real value in a few tasks, and then a few more, with impacts unfolding across numerous $100 billion-plus markets that will dramatically improve the quality of our lives.
Welcome to The Adversarial. Every other week, we’ll provide you with expert analysis on America’s greatest challengers: China, Russia, Iran, North Korea, and jihadists. Read more below.***IranA month after negotiators met for historic high-level talks in Pakistan, Washington and Tehran seem closer to a breakdown of the ceasefire that U.S. President Donald Trump announced on April 7 than a breakthrough. In addition to its blockade of Iranian shipping, the United States has been stepping up sanctions against Iran as part of “Economic Fury,” announcing several tranches of designations in recent days targeting its oil trade and banking networks. The toll on The post Maximalist Demands, Victory Day, and a Summit appeared first on War on the Rocks.
The IEEE Communications Society (ComSoc)’s Research Collaboration Pitch Session initiative is proving to be a catalyst for meaningful engagement between academic researchers and industry innovators. Launched last year, the program connects promising researchers with industry leaders who can offer them funding, mentorship, and connections to bring interesting ideas closer to real-world deployment. Rather than relying on chance encounters at conferences, the pitch sessions create a focused environment. Five academic presenters share their work with five industry representatives, known as “innovation scouts”: senior leaders primarily chosen from ComSoc’s Corporate Program partner companies such as Ericsson, Intel, Keysight, and Nokia. The curated format ensures that each idea receives dedicated attention from professionals who are seeking new concepts aligned with their organization’s priorities. The initiative was launched in November at the IEEE Middle East Conference on Communications and Networking (MECOM) in Cairo and appeared in December at the IEEE Global Communications Conference (GLOBECOM) in Taipei, Taiwan. AI-driven communication network One of the most compelling outcomes came from the inaugural session in Cairo. Angela Waithaka, a student member and biomedical engineering student at Kenyatta University, in Nairobi, Kenya, presented her “AI-Driven Predictive Communication Networks for Enhanced Performance in Resource-Constrained Environments” paper. You can view her presentation along with others on IEEE.tv. Waithaka’s research tackles a critical challenge: Next-generation communication systems increasingly rely on artificial intelligence and machine learning, yet most existing architectures consume abundant computational and energy resources, which are not always present in developing regions. Waithaka proposed lightweight, adaptive AI/machine learning models capable of delivering predictive, reliable communication performance even under tight resource constraints. Her vision resonated with Ruiqi “Richie” Liu, a master researcher at ZTE in China. ZTE is a global leader in integrated information and communication technology solutions. Liu says he recognized the relevance Waithaka’s proposal had to his company’s work with the International Telecommunication Union. He invited her to establish an ITU account so she could participate in the organization’s meetings discussing global telecommunications standardization projects—which would elevate her work to an international stage. Simplifying data center protocols The momentum continued at GLOBECOM. Among the presenters was Nirmala Shenoy, a professor at the Rochester Institute of Technology, in New York. Shenoy, an IEEE member, spoke on the topic of simplifying data center network protocols. She highlighted the growing complexity of the critical networks, which underpin cloud services, enterprise IT, and emerging AI workloads. Shenoy’s focus on reducing protocol complexity while maintaining scalability, resilience, and low latency caught the attention of an innovation scout from Nokia, who heads its eXtended Reality Lab in Madrid. He found the key person at Nokia for Shenoy to connect with to discuss her research, and it led her to record a video for the company detailing her approach and its potential applications. A model for accelerating innovation The early success stories demonstrate the power of intentional, structured engagement. By bringing researchers and industry leaders together in a format designed for discovery, ComSoc is helping accelerate innovation and expand opportunities for collaboration. The pitch sessions are not merely conference events; they are becoming a bridge between academic creativity and industry implementation. This year sessions will be held during the IEEE International Conference on Communications in Glasgow from 24 to 28 May, and more are scheduled during the IEEE International Mediterranean Conference on Communications and Networking in Sardinia from 6 to 9 July, and at GLOBECOM in Macau from 7 to 11 December. As the program continues to grow, it could become a signature ComSoc initiative, one that strengthens the research ecosystem, supports emerging talent, and ensures that promising ideas find pathways to real-world impact.
This sponsored article is brought to you by Applied Materials. At pivotal moments in history, progress has required more than individual brilliance. The most consequential breakthroughs — such as those achieved under the Human Genome Project — required a new operating paradigm: Concentrate the world’s best talent around a single mission, establish a common platform, share critical infrastructure, and collapse feedback loops. When stakes are high and timelines are compressed, sequential and siloed innovation simply cannot keep pace. Today’s AI era is creating an engineering race with similar demands. Every company is pushing to deliver higher-performance AI systems, faster. But performance is no longer defined by compute alone. AI workloads are increasingly dominated by the movement of data: In many cases, moving bits consumes as much — or more — energy than compute itself. As a result, reducing energy per bit can extend system‑level performance alongside gains in peak compute. The path to energy‑efficient AI therefore runs through system‑level engineering, spanning three tightly interconnected domains: Logic, where performance per watt depends on efficient transistor switching, low‑loss power, and signal delivery through dense wiring stacks. Memory, where surging bandwidth and capacity demands expose the memory wall, with processor capability advancing faster than memory access. Advanced packaging, where 3D integration, chiplet architectures, and high‑density interconnects bring compute and memory closer together — enabling system designs monolithic scaling can no longer sustain. These domains can no longer be optimized independently. Gains in logic efficiency stall without sufficient memory bandwidth. Advances in memory bandwidth fall short if packaging cannot deliver proximity within thermal and mechanical constraints. Packaging, in turn, is constrained by the precision of both front‑end device fabrication and back‑end integration processes. In the angstrom era, the hardest problems arise at the boundaries — between compute and memory in the package, front‑end and back‑end integration, and the tightly coupled process steps needed for precise 3D fabrication. And it is precisely this boundary‑driven complexity where the traditional innovation model breaks down. The Traditional R&D Workflow Is Too Slow for Angstrom‑Era AI For decades, the semiconductor industry’s R&D model has resembled a relay race. Capabilities are developed in one part of the ecosystem, handed off downstream through integration and manufacturing, evaluated by chip and system designers, and only then fed back for the next iteration. That model worked when progress was dominated by relatively modular steps that could be scaled independently and simply dropped into the manufacturing flow. But the AI timeline has upended these rules. At angstrom‑scale dimensions, the physics enforces inescapable coupling across the entire stack: materials choices shape integration schemes; integration defines design rules; design rules dictate power delivery; wiring sets thermal budgets; and thermals ultimately constrain packaging scaling. System architects simply cannot wait 10–15 years for each major semiconductor technology inflection to mature. Representing a roughly $5 billion investment, EPIC is the largest commitment to advanced semiconductor equipment R&D in U.S. history. A long‑term perspective is essential to align materials innovation with emerging device architectures — and to develop the tools and processes required to integrate both with manufacturable precision. At Applied Materials, together with our customers, we are charting a course across the next 3–4 generations, extending as far as 10 years down the roadmap. The angstrom era demands that we break down silos and bring together the industry’s best minds — from leading companies to leading academic institutions. If the problem is coupled, the solution must be coupled. If the timeline is compressed, the learning loop must be compressed. It’s not enough to just innovate — we must innovate how we innovate. EPIC: A Center and Platform for High‑Velocity Co‑Innovation This is the challenge that Applied Materials EPIC Center is designed to solve. Representing a roughly US $5 billion investment, EPIC is the largest commitment to advanced semiconductor equipment R&D in U.S. history. When it opens in 2026, it will deliver state‑of‑the‑art cleanroom capabilities built from the ground up to shorten the path from early‑stage research to full‑scale manufacturing. But the facilities are only one component of the model. EPIC is also a platform, an operating system for high-velocity co‑innovation that revolutionizes how ideas move from the lab to the fab. EPIC is a platform, an operating system for high-velocity co‑innovation that revolutionizes how ideas move from the lab to the fab.Applied Materials The EPIC model compresses the traditional workflow. Customer engineers work side‑by‑side with Applied technologists from day one — moving beyond isolated process optimization and downstream handoffs. Within a shared, secure environment, EPIC tightly integrates atomistic modeling, test vehicles, process development, validation, and metrology feedback. Constraints that once surfaced late in development are identified and addressed early. The result is a potentially 2x faster path that benefits the entire ecosystem under one roof: Chipmakers gain earlier access to Applied’s R&D portfolio, faster learning cycles, and accelerated transfer of next‑generation technologies into high‑volume manufacturing. Ecosystem partners gain earlier access to advanced manufacturing technology and collaboration opportunities that expand what is possible through materials innovation. Academic institutions gain opportunities to strengthen the lab‑to‑fab pipeline and help develop future semiconductor talent. Building on decades of co‑development, we are reinventing the innovation pipeline with our partners across logic, memory, and advanced packaging to deliver the next leap in energy‑efficient AI. Accelerating Advanced Logic Logic remains the engine of AI compute. In the angstrom era, however, system‑level gains are increasingly constrained by power and energy. Extending AI performance now depends on architectures that deliver more performance per watt — accelerating the move to 3D devices such as gate‑all‑around (GAA) transistors, which boost density within a compact footprint while preserving power efficiency. Architectures that deliver more performance per watt are accelerating the move to 3D devices such as gate‑all‑around (GAA) transistors, and further out, complementary FETs (CFETs), which push density scaling even more.Applied Materials These architectural shifts are unfolding at unprecedented scale, with the logic roadmap already extending beyond first‑generation GAA toward more advanced designs. One key example is GAA with backside power delivery, which relocates thick power lines to the backside of the wafer, reducing resistive losses and freeing front‑side routing for tighter logic cell integration. Another example brings adjacent GAA PMOS and NMOS transistors closer together while inserting a dielectric isolation wall between them to minimize electrical interference. Further out, complementary FETs (CFETs) push density scaling even more by stacking PMOS and NMOS devices directly atop one another. While these architectures deliver compelling gains in performance per watt and logic density without relying solely on tighter lithography, they significantly raise integration complexity. Manufacturing a single GAA device today can involve more than 2,000 tightly interdependent process steps. At the same time, wiring stacks continue to grow taller and denser to connect these advanced logic devices. Modern leading‑edge GPUs now in development pack more than 300 billion transistors into an area little larger than a postage stamp, interconnected by over 2,000 miles of wiring. Modern leading‑edge GPUs now in development pack more than 300 billion transistors into an area little larger than a postage stamp, interconnected by over 2,000 miles of wiring.Applied Materials At this level of complexity, the process steps used to create these precise 3D devices and wiring stacks cannot be optimized independently. Design and process must evolve in lockstep, and materials innovation and fabrication methods must advance alongside device architecture. EPIC’s co‑innovation model is designed to accelerate exactly this convergence — enabling logic compute to continue advancing the frontiers of AI at the pace the roadmap demands. Powering the Memory Roadmap At the same time, the AI computing era is fundamentally reshaping how data is generated, moved, and processed — making memory technologies, especially DRAM, central to delivering the energy‑efficient performance AI systems require. As models grow larger and more data‑hungry, the DRAM roadmap is shifting toward architectures that deliver higher density, greater bandwidth, and faster access per watt. At the DRAM cell level, AI performance requirements are driving a transition from 6F² buried‑channel array transistors (BCAT) to more compact 4F², and beyond that, architectures that move past what 2D scaling alone can deliver. Applied Materials At the DRAM cell level, this shift is driving a transition from 6F² buried‑channel array transistors (BCAT) to more compact 4F² architectures, which orient the transistor vertically to boost density and reduce chip area. Looking beyond 4F², sustaining gains in performance per watt will require moving past what 2D scaling alone can deliver. The industry is therefore turning to 3D DRAM, stacking memory cells vertically to add capacity within a constrained footprint. As these structures grow taller and aspect ratios intensify, high-mobility materials engineering in three dimensions becomes increasingly critical to performance and reliability. Beyond the memory cell array, another powerful lever for DRAM scaling is shrinking the peripheral circuitry, which includes logic transistors and interconnect wiring. One emerging approach places select periphery functions beneath the DRAM array by bonding two wafers — one optimized for the DRAM cells and the other for CMOS logic — using multiple wiring layers. Beyond the memory cell array, another powerful lever for DRAM scaling is shrinking the peripheral circuitry, which includes logic transistors and interconnect wiring.Applied Materials In parallel, DRAM performance is being extended by leveraging logic‑proven enhancers in the memory periphery. These include mobility boosters such as embedded silicon germanium and stress films, along with wiring upgrades like improved low‑k dielectrics and advanced copper interconnects. Memory manufacturers are also transitioning periphery transistors from planar devices to FinFET architectures, following the logic roadmap to further improve I/O speed. These valuable inflections are central to EPIC’s mission — where they can be co-developed and rapidly validated for next‑generation memory systems. Driving System Scaling With Advanced Packaging As data movement becomes the dominant energy cost in AI systems, advanced packaging has emerged as a critical lever for improving system‑level efficiency—shortening interconnect distances, increasing bandwidth density, and reducing the power required to move data between logic and memory. The rise of 3D packages such as high‑bandwidth memory (HBM) underscores why advanced packaging is becoming central to the AI era.Applied Materials High‑bandwidth memory (HBM) marks a major inflection along this path. By stacking DRAM dies — scaling to 16 layers and beyond — and placing memory much closer to the processor, HBM enables rapid access to ever‑larger working datasets. This delivers step‑function gains in both bandwidth and energy efficiency. More broadly, the rise of 3D packages such as HBM underscores why advanced packaging is becoming central to the AI era. Packaging now addresses system‑level constraints that logic and memory device scaling alone can no longer overcome. It also enables a move away from monolithic systems‑on‑chip toward chiplet‑based architectures, as AI workloads increasingly demand flexible designs that combine logic, memory, and specialized accelerators optimized for specific tasks. A vital technology powering this roadmap is hybrid bonding. With interconnect pitches approaching those of on‑chip wiring, conventional bumps and microbumps run into fundamental limits in density, power, and signal integrity. Hybrid bonding removes these barriers by allowing dramatically higher interconnect and I/O density, supporting a broad range of chiplet architectures — from memory stacking to tighter compute‑memory integration. EPIC tackles high‑value advanced‑packaging challenges through early, parallel co‑innovation across materials, integration, and manufacturing.Applied Materials As bonded structures like HBM stacks grow larger and more complex, warpage control, die placement, stack alignment, and thermal management become first‑order challenges. EPIC tackles these and other high‑value advanced‑packaging challenges through early, parallel co‑innovation across materials, integration, and manufacturing. Bringing It All Together Across logic, memory, and advanced packaging, our industry faces an ambitious roadmap that promises significant gains in energy efficiency for AI systems. But realizing that potential demands breakthrough materials innovation at a time when feature sizes are shrinking, interfaces are multiplying, and process interdependencies are escalating. These challenges cannot be solved on 10–15‑year timelines under the traditional relay‑race model. We must break down silos, align earlier across the ecosystem, and parallelize learning to keep pace with AI’s demands. In the AI era, progress will be defined by the speed at which lightbulb moments turn into manufacturing and commercialization reality. The only viable path forward is a new innovation model — and EPIC is how we are driving it.