Ars Technica
์ค๋ ์ฑํฅ
IT/๊ธฐ์
They call it stupid hot for a reason: Heat muddles animal brains
As temperatures rise, some creatures pick fights while others struggle to learn.
๐บ๐ธ ๋ฏธ๊ตญ ยท IT/๊ธฐ์ ยท "TEMPERATURES" ยท ์ด 4๊ฑด
ํํฐ ๋ณด๊ธฐํ์ฌ ์ง์
50.0
0 = ๋ถ์ ์ฐ์ธ
50 = ์ค๋ฆฝ
100 = ๊ธ์ ์ฐ์ธ
์ต๊ทผ 7์ผ ๊ธฐ์ค 12,036๊ฑด์ ๋ถ์ํ ๊ฒฐ๊ณผ, ๋ด์ค ์ฌ๋ฆฌ์ง์๋ 50.0(๊ท ํ)์ ๋๋ค. ๊ธ์ 1๊ฑด(0.0%)ยท์ค๋ฆฝ 12,034๊ฑด(100.0%)ยท๋ถ์ 1๊ฑด(0.0%)์ด๋ฉฐ, ์ค๋ฆฝ ๋น์ค์ด ๋๋ ทํ๊ฒ ๋์ต๋๋ค. ์ฑํฅ ์ง์๋ ์ข ํฉ 19.1(์ค๋ ๊ท ํ)์ ๋๋ค.
As temperatures rise, some creatures pick fights while others struggle to learn.
Electrons are great. We use them to move vehicles, illuminate cities, and, of course, compute. But computation is not confined to the world of electronics. And shifting to alternative nonelectronic realms can unlock unique advantages: Photonic chips, for instance, process information with light while generating little heat. Another compelling alternative is fluidics, which uses pressurized gases or liquids to build logic circuits. Pioneered in the 1960s but sidelined by microchips, the field reemerged in the 1990s as โmicrofluidics.โ This approach aims to shrink laboratories onto a single chip by creating microscopic fluid channels with integrated micropneumatic control systems. Today, there is a second fluidic revival, this time in the domain of soft robotics. Scaling microfluidic designs up to the millimeter-scale range (millifluidics) enables the higher flow rates necessary to drive robotic actuators. These robots exploit the nonlinear behaviors of soft materials to create lifelike motion and safer interactions, often utilizing pressurized air. By building systems that โthinkโ with the same air that powers them, we can drastically reduce the need for bulky electronic-to-pneumatic interfaces. This is the focus of my Soiboi Studio robotics lab. With millifluidic logic, I have steadily scaled the complexity of my designs. What began with a simple oscillator has most recently evolved into a clock featuring a soft, four-digit, seven-segment display. What Is Millifluidics? Building on microfluidics research from the early 2000s and recent developments from the Grover Lab at the University of California, Riverside, Iโve developed millifluidic devices using standard 3D printing and silicone casting. The basic architecture is simple: A flexible membrane is sandwiched between rigid layers embedded with networks of air channels. Just as electronics rely on differing voltage potentials, these fluidic circuits operate on the pressure difference between atmospheric pressure (logical 0) and a near-vacuum at around โ60 kilopascals of relative pressure (logical 1). Using negative pressure means the membrane is pulled into openings. This creates robust seals that allow me to replicate electronic building blocks. A cast silicone membrane forms the face of the clock [top], while behind it sits 3D-printed millifluidic blocks [middle rows]. An Arduino Uno controls driver boards that operate solenoids, which are connected to valves that are attached to a vacuum pump [bottom row].James Provost While fluidic resistors are easily realized by adjusting the channel geometry, the heart of the system is a valve that mimics a metal-oxide-semiconductor field-effect transistor, or MOSFET. This vacuum โtransistorโ features a flow layer with two chambers (the source and drain) divided by a central valve seat and a control layer containing a cavity (the gate). A membrane runs between the control and flow layers and normally prevents airflow between the source and drain chambers. To switch the transistor on, a vacuum is applied to the gate chamber, sucking the membrane into the cavity and lifting it off the seat. This opens a path for airflow, equivalent to closing an electric circuit. By adding a small aperture to the membrane, I created a check valveโthe fluidic equivalent of a diode. By combining transistors and resistive โpull-downโ channels, I can build a full suite of logic gates. The original microfluidic designs that inspired me were fabricated from etched glass and milled acrylic. Adapting them for a standard 3D printer required reengineering the logic elements and mastering two critical fabrication techniques. First, I need airtight prints, yet printed plastic is notoriously porous. By printing at elevated temperatures, slow speeds, and slight overextrusion, I was able to fill microscopic gaps. When youโre using transparent filament, thereโs a handy visual indicator: The more transparent the plastic appears, the lower its porosity. Second, I used glass for my print bed. By printing the upper and lower chambers directly against this bed, I got the interface surface to become mirror smooth. This finish is essential for creating reliable, airtight seals. A 0.3-millimeter silicone membrane is placed between the layers and secured with screws. How Does the Soft Clock Work? The clockface is a cast silicone membrane. Each digit segment is formed by a small underlying cavity. When air is evacuated from this cavity, the membrane is sucked inward to create a concave hollow; when atmospheric pressure is restored, the silicone pops back flush with the surface. The result is a mesmerizing, organic motion. The โbrainโ of the clock is an Arduino Uno, while the fluidics significantly reduce the hardware footprint. A four-digit, seven-segment display with two separator dots would require 29 solenoid valves to control directly. My clock needs just 11 valves. A pneumatic transistor is off when its upper control chamber is at atmospheric pressure [top]. When air is removed from the control chamber, it lifts a membrane, which allows air to flow between lower flow chambers and turns the transistor on [bottom]. James Provost To understand how it works, consider a standard electronic four-digit, seven-segment LED display. This also uses 11 pins to drive its digits. (In clockface displays, an additional pin is required to drive the separator dots.) Every digit is connected to a shared data bus with seven lines, one per segment. The four control lines select individual digits. Only one digit is illuminated at time, and strobing the digits at least 50 times per second creates the illusion that all four are simultaneously illuminated. Such high-speed switching is not possible with air. Instead, I rely on memory. Each segment acts like a capacitor: By evacuating its cavity (logic 1), you โchargeโ the segment; by restoring atmospheric pressure (logic 0), you discharge it. Hence, each digit acts as an independent 7-bit memory. If the system is sufficiently airtight, the segments maintain their state for several seconds. Like the electronic display, the system utilizes a seven-line data bus. Each line connects to a solenoid valve that provides either vacuum or atmospheric pressure. To selectively address the individual digits, I placed a fluidic transistor between each segment and its data line. All the transistorsโ control inputs for a given digit are combined into one โwrite enableโ line connected to its own solenoid valve. Activating this valve allows me to write data into the corresponding digitโs memory. The clock updates one digit per second, meaning a full cycle across the face takes 4 seconds. This cycle also drives the separator dots: A set of fluidic diodes connects the enable lines to the dotsโ cavities. Consequently, as each digit is addressed, the dots pulse automatically. This display is more than a clock; it is a soft robot that happens to tell time. By offloading computation to the same air that powers movement, the clock approaches a new class of machines that are simpler, lighter, and more integrated. Iโm now developing a guide for getting started with vacuum-powered logic and may release a refined version of this clock in the future. Watching the silicone skin morph serves as a fascinating reminder that not all logic needs silicon; sometimes, all you need is flexible silicone and a flow of air. This article appears in the June 2026 print issue as โThe Soft Clock.โ
This sponsored article is brought to you by Master Bond. Outgassing is the release of volatile substances from a cured adhesive over time. These released materials, which may include residual solvents, unreacted monomers, or other chemical species, can deposit on nearby surfaces, causing contamination that interferes with sensitive components. What Is Outgassing and How Is It Measured? The industry standard for measuring outgassing is ASTM E595, developed by NASA. This test exposes a cured sample to 125 ยฐC at high vacuum (10โปโต to 10โปโถ torr) for 24 hours, measuring Total Mass Loss (TML) and Collected Volatile Condensable Materials (CVCM). To meet NASA low outgassing requirements, materials must exhibit less than 1 percent TML and less than 0.1 percent CVCM. Optical assemblies need contamination-free bonding and prevention of fogging the optics to maintain clarity. High-vacuum scientific equipment, semiconductor manufacturing tools, and aerospace electronics also demand low outgassing materials. Key Applications Low outgassing adhesives are essential wherever contamination could compromise performance and this is particularly relevant for space and satellite systems. Optical assemblies, including cameras, telescopes, and laser systems, need contamination-free bonding and prevention of fogging the optics to maintain clarity. High-vacuum scientific equipment, semiconductor manufacturing tools, and aerospace electronics also demand low outgassing materials. Even terrestrial optical devices benefit from reduced outgassing to ensure long-term reliability. EP30-2 is a versatile system can be used in a variety of applications in aerospace, electronic, optical and specialty OEM industries, especially when optical clarity and low outgassing are important criteria.Master Bond Ensuring Low Outgassing Performance Through Proper Handling Achieving specified outgassing performance requires attention to storage, mixing, and curing. For two-part systems, use the correct mix ratio and mix thoroughly to ensure complete reaction. Follow recommended cure schedules โ adding heat, even at modest temperatures of 150-200 ยฐF, significantly improves cross-linking and reduces outgassing. For UV-curable adhesives, ensure complete cure by using the correct lamp wavelength (typically 365 nm), adequate intensity, and proper exposure time with no shadowed areas. Troubleshooting Outgassing Issues If contamination appears on optical surfaces or outgassing test results are higher than expected, an incomplete cure might be one of the root causes. The first step is to verify that the adhesive has fully hardened to its specified Shore hardness. The next step is to consider adding or extending heat cure to improve cross-linking. Master Bond Product Recommendations Master Bond offers a range of adhesives meeting NASA low outgassing requirements. EP30-2 and EP21TCHT-1 are some examples of two-part epoxy systems that have been successfully deployed in demanding vacuum applications, including ultra-high vacuum environments. For applications requiring UV cure, Master Bond provides specialty UV formulations such as UV16 meeting ASTM E595, as well as dual-cure systems (UV plus heat) such as UV22DC80-10F for assemblies where shadows prevent complete UV exposure. These dual-cure products initiate with UV light and complete curing with heat as low as 180 ยฐF (80 ยฐC).
Quantum computing is a devilishly complex technology, with many technical hurdles impacting its development. Of these challenges two critical issues stand out: miniaturization and qubit quality. IBM has adopted the superconducting qubit road map of reaching a 1,121-qubit processor by 2023, leading to the expectation that 1,000 qubits with todayโs qubit form factor is feasible. However, current approaches will require very large chips (50 millimeters on a side, or larger) at the scale of small wafers, or the use of chiplets on multichip modules. While this approach will work, the aim is to attain a better path toward scalability. Now researchers at MIT have been able to both reduce the size of the qubits and done so in a way that reduces the interference that occurs between neighboring qubits. The MIT researchers have increased the number of superconducting qubits that can be added onto a device by a factor of 100. โWe are addressing both qubit miniaturization and quality,โ said William Oliver, the director for the Center for Quantum Engineering at MIT. โUnlike conventional transistor scaling, where only the number really matters, for qubits, large numbers are not sufficient, they must also be high-performance. Sacrificing performance for qubit number is not a useful trade in quantum computing. They must go hand in hand.โ The key to this big increase in qubit density and reduction of interference comes down to the use of two-dimensional materials, in particular the 2D insulator hexagonal boron nitride (hBN). The MIT researchers demonstrated that a few atomic monolayers of hBN can be stacked to form the insulator in the capacitors of a superconducting qubit. Just like other capacitors, the capacitors in these superconducting circuits take the form of a sandwich in which an insulator material is sandwiched between two metal plates. The big difference for these capacitors is that the superconducting circuits can operate only at extremely low temperaturesโless than 0.02 degrees above absolute zero (-273.15 ยฐC). Superconducting qubits are measured at temperatures as low as 20 millikelvin in a dilution refrigerator.Nathan Fiske/MIT In that environment, insulating materials that are available for the job, such as PE-CVD silicon oxide or silicon nitride, have quite a few defects that are too lossy for quantum computing applications. To get around these material shortcomings, most superconducting circuits use what are called coplanar capacitors. In these capacitors, the plates are positioned laterally to one another, rather than on top of one another. As a result, the intrinsic silicon substrate below the plates and to a smaller degree the vacuum above the plates serve as the capacitor dielectric. Intrinsic silicon is chemically pure and therefore has few defects, and the large size dilutes the electric field at the plate interfaces, all of which leads to a low-loss capacitor. The lateral size of each plate in this open-face design ends up being quite large (typically 100 by 100 micrometers) in order to achieve the required capacitance. In an effort to move away from the large lateral configuration, the MIT researchers embarked on a search for an insulator that has very few defects and is compatible with superconducting capacitor plates. โWe chose to study hBN because it is the most widely used insulator in 2D material research due to its cleanliness and chemical inertness,โ said colead author Joel Wang, a research scientist in the Engineering Quantum Systems group of the MIT Research Laboratory for Electronics. On either side of the hBN, the MIT researchers used the 2D superconducting material, niobium diselenide. One of the trickiest aspects of fabricating the capacitors was working with the niobium diselenide, which oxidizes in seconds when exposed to air, according to Wang. This necessitates that the assembly of the capacitor occur in a glove box filled with argon gas. While this would seemingly complicate the scaling up of the production of these capacitors, Wang doesnโt regard this as a limiting factor. โWhat determines the quality factor of the capacitor are the two interfaces between the two materials,โ said Wang. โOnce the sandwich is made, the two interfaces are โsealedโ and we donโt see any noticeable degradation over time when exposed to the atmosphere.โ This lack of degradation is because around 90 percent of the electric field is contained within the sandwich structure, so the oxidation of the outer surface of the niobium diselenide does not play a significant role anymore. This ultimately makes the capacitor footprint much smaller, and it accounts for the reduction in cross talk between the neighboring qubits. โThe main challenge for scaling up the fabrication will be the wafer-scale growth of hBN and 2D superconductors like [niobium diselenide], and how one can do wafer-scale stacking of these films,โ added Wang. Wang believes that this research has shown 2D hBN to be a good insulator candidate for superconducting qubits. He says that the groundwork the MIT team has done will serve as a road map for using other hybrid 2D materials to build superconducting circuits.