Business Insider
중도 성향
IT/기술
An Anthropic employee's 2-sentence quote crystallizes the state of AI confusion at work
The employee said that when AI works well, they feel redundant, but when it doesn't, they don't know how to fix it.
🇺🇸 미국 · IT/기술 · "STALL" · 총 20건
필터 보기현재 지수
50.0
0 = 부정 우세
50 = 중립
100 = 긍정 우세
최근 7일 기준 11,558건을 분석한 결과, 뉴스 심리지수는 50.0(균형)입니다. 긍정 1건(0.0%)·중립 11,556건(100.0%)·부정 1건(0.0%)이며, 중립 비중이 뚜렷하게 높습니다. 성향 지수는 종합 18.8(중도 균형)입니다.
The employee said that when AI works well, they feel redundant, but when it doesn't, they don't know how to fix it.
The Facebook parent announced last month that it was installing new tracking software on US-based employees’ computers to capture mouse movements, clicks and keystrokes for use in training its AI models.
A glass screen protector is one of a few essential accessories that I strongly recommend to every Switch 2 owner. In fact, it should be a priority to stick one onto the console’s screen as soon as possible to avoid accidental scratches. To test the candidates below, I installed and removed Switch 2 screen protectors […]
Thermacell has launched Liv 2.0, the next generation of its Wi-Fi-connected smart mosquito protection system. It features new hardware and can cover a larger area, and Thermacell says its formula can now deter no-see-ums. But it's also more expensive and requires professional installation. Liv 2.0 uses the same setup as the original Liv - a […]
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Only three companies have ever installed investor-overriding mission guardians. Two of them, including Ben & Jerry's, failed.
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Hi, friends! Welcome to Installer No. 130, your guide to the best and Verge-iest stuff in the world. (If you're new here, welcome, don't forget to hydrate, and also you can read all the old editions at the Installer homepage.) This week, I've been reading about Victor Wembanyama and mahjong and Merlin Mann's pearls of […]
The rapid installation of AI data centers in the U.S. is causing a boom in blue-collar jobs. Experts tell CBS News that most of the opportunities are for temporary construction workers. CBS News MoneyWatch reporter Megan Cerullo breaks it down.
DuckDuckGo says installs surged after Google's AI search overhaul, hinting some users may want less AI in search.
DuckDuckGo, which positions itself as a privacy-focused alternative to Google, has experienced a significant increase in user adoption following the search giant's announcement of major changes to its search platform that heavily incorporate AI. The post DuckDuckGo Installs Surge 30% as Consumers Reject Google ‘Force-Feeding’ AI with Search Engine appeared first on Breitbart.
Google overhauled Search at I/O 2026, replacing blue links with AI agents. The backlash has been swift. DuckDuckGo app installs spiked 30% as users seek a way out.
From a Kentucky congressional race to the Los Angeles mayor's contest, deepfake political ads are turning up across the country. George Gerbo examines the science behind why they work, who's most susceptible, and the bipartisan push -- so far stalled -- to rein them in.
American Airlines is planning to install SpaceX's Starlink Wi-Fi in hundreds of its airplanes, the airline announced today. American says the deployment will start in the first quarter of 2027, and will span more than 500 aircraft, including its new A321XLR and A321neo planes from Airbus. Starlink will join Viastat and SES (previously known as […]
Hi, friends! Welcome to Installer No. 129, your guide to the best and Verge-iest stuff in the world. (If you're new here, welcome, come on you Gunners, and also you can read all the old editions at the Installer homepage.) This week, I've mostly been sick, which has meant nearly a full rewatch of Parks […]
According to users on X, the website was hijacked by hackers in an attempt to trick visitors into installing malware.
This sponsored article is brought to you by Applied Materials. At pivotal moments in history, progress has required more than individual brilliance. The most consequential breakthroughs — such as those achieved under the Human Genome Project — required a new operating paradigm: Concentrate the world’s best talent around a single mission, establish a common platform, share critical infrastructure, and collapse feedback loops. When stakes are high and timelines are compressed, sequential and siloed innovation simply cannot keep pace. Today’s AI era is creating an engineering race with similar demands. Every company is pushing to deliver higher-performance AI systems, faster. But performance is no longer defined by compute alone. AI workloads are increasingly dominated by the movement of data: In many cases, moving bits consumes as much — or more — energy than compute itself. As a result, reducing energy per bit can extend system‑level performance alongside gains in peak compute. The path to energy‑efficient AI therefore runs through system‑level engineering, spanning three tightly interconnected domains: Logic, where performance per watt depends on efficient transistor switching, low‑loss power, and signal delivery through dense wiring stacks. Memory, where surging bandwidth and capacity demands expose the memory wall, with processor capability advancing faster than memory access. Advanced packaging, where 3D integration, chiplet architectures, and high‑density interconnects bring compute and memory closer together — enabling system designs monolithic scaling can no longer sustain. These domains can no longer be optimized independently. Gains in logic efficiency stall without sufficient memory bandwidth. Advances in memory bandwidth fall short if packaging cannot deliver proximity within thermal and mechanical constraints. Packaging, in turn, is constrained by the precision of both front‑end device fabrication and back‑end integration processes. In the angstrom era, the hardest problems arise at the boundaries — between compute and memory in the package, front‑end and back‑end integration, and the tightly coupled process steps needed for precise 3D fabrication. And it is precisely this boundary‑driven complexity where the traditional innovation model breaks down. The Traditional R&D Workflow Is Too Slow for Angstrom‑Era AI For decades, the semiconductor industry’s R&D model has resembled a relay race. Capabilities are developed in one part of the ecosystem, handed off downstream through integration and manufacturing, evaluated by chip and system designers, and only then fed back for the next iteration. That model worked when progress was dominated by relatively modular steps that could be scaled independently and simply dropped into the manufacturing flow. But the AI timeline has upended these rules. At angstrom‑scale dimensions, the physics enforces inescapable coupling across the entire stack: materials choices shape integration schemes; integration defines design rules; design rules dictate power delivery; wiring sets thermal budgets; and thermals ultimately constrain packaging scaling. System architects simply cannot wait 10–15 years for each major semiconductor technology inflection to mature. Representing a roughly $5 billion investment, EPIC is the largest commitment to advanced semiconductor equipment R&D in U.S. history. A long‑term perspective is essential to align materials innovation with emerging device architectures — and to develop the tools and processes required to integrate both with manufacturable precision. At Applied Materials, together with our customers, we are charting a course across the next 3–4 generations, extending as far as 10 years down the roadmap. The angstrom era demands that we break down silos and bring together the industry’s best minds — from leading companies to leading academic institutions. If the problem is coupled, the solution must be coupled. If the timeline is compressed, the learning loop must be compressed. It’s not enough to just innovate — we must innovate how we innovate. EPIC: A Center and Platform for High‑Velocity Co‑Innovation This is the challenge that Applied Materials EPIC Center is designed to solve. Representing a roughly US $5 billion investment, EPIC is the largest commitment to advanced semiconductor equipment R&D in U.S. history. When it opens in 2026, it will deliver state‑of‑the‑art cleanroom capabilities built from the ground up to shorten the path from early‑stage research to full‑scale manufacturing. But the facilities are only one component of the model. EPIC is also a platform, an operating system for high-velocity co‑innovation that revolutionizes how ideas move from the lab to the fab. EPIC is a platform, an operating system for high-velocity co‑innovation that revolutionizes how ideas move from the lab to the fab.Applied Materials The EPIC model compresses the traditional workflow. Customer engineers work side‑by‑side with Applied technologists from day one — moving beyond isolated process optimization and downstream handoffs. Within a shared, secure environment, EPIC tightly integrates atomistic modeling, test vehicles, process development, validation, and metrology feedback. Constraints that once surfaced late in development are identified and addressed early. The result is a potentially 2x faster path that benefits the entire ecosystem under one roof: Chipmakers gain earlier access to Applied’s R&D portfolio, faster learning cycles, and accelerated transfer of next‑generation technologies into high‑volume manufacturing. Ecosystem partners gain earlier access to advanced manufacturing technology and collaboration opportunities that expand what is possible through materials innovation. Academic institutions gain opportunities to strengthen the lab‑to‑fab pipeline and help develop future semiconductor talent. Building on decades of co‑development, we are reinventing the innovation pipeline with our partners across logic, memory, and advanced packaging to deliver the next leap in energy‑efficient AI. Accelerating Advanced Logic Logic remains the engine of AI compute. In the angstrom era, however, system‑level gains are increasingly constrained by power and energy. Extending AI performance now depends on architectures that deliver more performance per watt — accelerating the move to 3D devices such as gate‑all‑around (GAA) transistors, which boost density within a compact footprint while preserving power efficiency. Architectures that deliver more performance per watt are accelerating the move to 3D devices such as gate‑all‑around (GAA) transistors, and further out, complementary FETs (CFETs), which push density scaling even more.Applied Materials These architectural shifts are unfolding at unprecedented scale, with the logic roadmap already extending beyond first‑generation GAA toward more advanced designs. One key example is GAA with backside power delivery, which relocates thick power lines to the backside of the wafer, reducing resistive losses and freeing front‑side routing for tighter logic cell integration. Another example brings adjacent GAA PMOS and NMOS transistors closer together while inserting a dielectric isolation wall between them to minimize electrical interference. Further out, complementary FETs (CFETs) push density scaling even more by stacking PMOS and NMOS devices directly atop one another. While these architectures deliver compelling gains in performance per watt and logic density without relying solely on tighter lithography, they significantly raise integration complexity. Manufacturing a single GAA device today can involve more than 2,000 tightly interdependent process steps. At the same time, wiring stacks continue to grow taller and denser to connect these advanced logic devices. Modern leading‑edge GPUs now in development pack more than 300 billion transistors into an area little larger than a postage stamp, interconnected by over 2,000 miles of wiring. Modern leading‑edge GPUs now in development pack more than 300 billion transistors into an area little larger than a postage stamp, interconnected by over 2,000 miles of wiring.Applied Materials At this level of complexity, the process steps used to create these precise 3D devices and wiring stacks cannot be optimized independently. Design and process must evolve in lockstep, and materials innovation and fabrication methods must advance alongside device architecture. EPIC’s co‑innovation model is designed to accelerate exactly this convergence — enabling logic compute to continue advancing the frontiers of AI at the pace the roadmap demands. Powering the Memory Roadmap At the same time, the AI computing era is fundamentally reshaping how data is generated, moved, and processed — making memory technologies, especially DRAM, central to delivering the energy‑efficient performance AI systems require. As models grow larger and more data‑hungry, the DRAM roadmap is shifting toward architectures that deliver higher density, greater bandwidth, and faster access per watt. At the DRAM cell level, AI performance requirements are driving a transition from 6F² buried‑channel array transistors (BCAT) to more compact 4F², and beyond that, architectures that move past what 2D scaling alone can deliver. Applied Materials At the DRAM cell level, this shift is driving a transition from 6F² buried‑channel array transistors (BCAT) to more compact 4F² architectures, which orient the transistor vertically to boost density and reduce chip area. Looking beyond 4F², sustaining gains in performance per watt will require moving past what 2D scaling alone can deliver. The industry is therefore turning to 3D DRAM, stacking memory cells vertically to add capacity within a constrained footprint. As these structures grow taller and aspect ratios intensify, high-mobility materials engineering in three dimensions becomes increasingly critical to performance and reliability. Beyond the memory cell array, another powerful lever for DRAM scaling is shrinking the peripheral circuitry, which includes logic transistors and interconnect wiring. One emerging approach places select periphery functions beneath the DRAM array by bonding two wafers — one optimized for the DRAM cells and the other for CMOS logic — using multiple wiring layers. Beyond the memory cell array, another powerful lever for DRAM scaling is shrinking the peripheral circuitry, which includes logic transistors and interconnect wiring.Applied Materials In parallel, DRAM performance is being extended by leveraging logic‑proven enhancers in the memory periphery. These include mobility boosters such as embedded silicon germanium and stress films, along with wiring upgrades like improved low‑k dielectrics and advanced copper interconnects. Memory manufacturers are also transitioning periphery transistors from planar devices to FinFET architectures, following the logic roadmap to further improve I/O speed. These valuable inflections are central to EPIC’s mission — where they can be co-developed and rapidly validated for next‑generation memory systems. Driving System Scaling With Advanced Packaging As data movement becomes the dominant energy cost in AI systems, advanced packaging has emerged as a critical lever for improving system‑level efficiency—shortening interconnect distances, increasing bandwidth density, and reducing the power required to move data between logic and memory. The rise of 3D packages such as high‑bandwidth memory (HBM) underscores why advanced packaging is becoming central to the AI era.Applied Materials High‑bandwidth memory (HBM) marks a major inflection along this path. By stacking DRAM dies — scaling to 16 layers and beyond — and placing memory much closer to the processor, HBM enables rapid access to ever‑larger working datasets. This delivers step‑function gains in both bandwidth and energy efficiency. More broadly, the rise of 3D packages such as HBM underscores why advanced packaging is becoming central to the AI era. Packaging now addresses system‑level constraints that logic and memory device scaling alone can no longer overcome. It also enables a move away from monolithic systems‑on‑chip toward chiplet‑based architectures, as AI workloads increasingly demand flexible designs that combine logic, memory, and specialized accelerators optimized for specific tasks. A vital technology powering this roadmap is hybrid bonding. With interconnect pitches approaching those of on‑chip wiring, conventional bumps and microbumps run into fundamental limits in density, power, and signal integrity. Hybrid bonding removes these barriers by allowing dramatically higher interconnect and I/O density, supporting a broad range of chiplet architectures — from memory stacking to tighter compute‑memory integration. EPIC tackles high‑value advanced‑packaging challenges through early, parallel co‑innovation across materials, integration, and manufacturing.Applied Materials As bonded structures like HBM stacks grow larger and more complex, warpage control, die placement, stack alignment, and thermal management become first‑order challenges. EPIC tackles these and other high‑value advanced‑packaging challenges through early, parallel co‑innovation across materials, integration, and manufacturing. Bringing It All Together Across logic, memory, and advanced packaging, our industry faces an ambitious roadmap that promises significant gains in energy efficiency for AI systems. But realizing that potential demands breakthrough materials innovation at a time when feature sizes are shrinking, interfaces are multiplying, and process interdependencies are escalating. These challenges cannot be solved on 10–15‑year timelines under the traditional relay‑race model. We must break down silos, align earlier across the ecosystem, and parallelize learning to keep pace with AI’s demands. In the AI era, progress will be defined by the speed at which lightbulb moments turn into manufacturing and commercialization reality. The only viable path forward is a new innovation model — and EPIC is how we are driving it.
Cybersecurity consultants have never been more in demand. Information security analyst roles are projected to grow nearly 30 percent between now and 2034, according to the U.S. Bureau of Labor Statistics. More than 15 million cybercrime incidents occurred worldwide in 2024, Statista reported. Data breaches are costly and pose direct safety risks. Statista reported that more than US $10 trillion is spent annually repairing the damage caused by cybercrime, most commonly phishing, spoofing, extortion, and data breaches. In one example in the United States, breathalyzer devices installed in vehicles became disabled, leaving hundreds of drivers stranded, as detailed in an IEEE Spectrum article. To help you acquire the skills you need to distinguish yourself from other cybersecurity job candidates, the IEEE Computer Society offers a “What Makes a Great Cybersecurity Consultant” guide. The 23-page PDF includes hard and soft skills you need, a list of certifications to pursue, and key IEEE cybersecurity conferences for staying updated on developments in the field. The guide includes advice from two cybersecurity experts. John D. Johnson, an IEEE senior member, is the founder and CEO of Aligned Security in Bettendorf, Iowa. Ricardo J. Rodriguez is an associate professor of computer science and systems engineering at the Universidad de Zaragoza, in Spain, who researches digital forensics and other cybersecurity topics. “Technology, remote work, and a shortage of skilled workers make this the ideal time to consider becoming a cybersecurity consultant,” Johnson says in the guide. “Consulting can give you the flexibility, variety, and control over where you want your career to go.” Hard and soft skills At a minimum, cybersecurity professionals should have a general understanding of IT including operating systems, communication protocols, network architecture, and programming languages such as C++, Java, and Python. They also should be well-versed in security auditing, firewall management, penetration testing, and encryption technologies. The principles of ethical hacking and coding would be handy as well. “To be able to defend a system well, you first have to know how to attack it,” Rodriguez says. The guide explains that there are now more technologies available to help cybersecurity consultants monitor threats and protect systems. They include security orchestration, automation, and response (SOAR) platforms, which automate workflows to collect security data, streamline incident response, and automate repetitive tasks. Rodriguez points to advances in domain name system security extensions (DNSSEC), which uses digital signatures based on public-key cryptography to strengthen the authentication of the domain name system. By validating data authenticity, DNSSEC safeguards against attacks such as DNS spoofing and guarantees that users connect to the correct IP address. Technologies such as artificial intelligence, blockchain, and quantum computing will increasingly be used to help thwart cyberattacks, the guide suggests. AI is expected to enhance the quality of data analysis, Rodriguez says. Although hard skills are important, soft skills are just as crucial, according to the guide. Critical thinking, project management, flexibility, teamwork, and organizational and presentation skills are essential. It’s not enough to be good at analyzing security vulnerabilities; you also need to clearly describe the situation and explain possible solutions. “Soft skills are important to achieve good team cohesion,” Rodriguez says, “because consultants often lead diverse teams from within their client’s organization.” “It’s essential,” Johnson adds, “that you demonstrate to clients you’re a team player and a capable communicator, and that you meet your commitments.” Security certifications Possessing security-specific credentials is a valuable way to demonstrate your expertise to potential clients, according to the guide. Because hundreds of certifications are available, Johnson says, pinpointing the most relevant ones can be challenging. Some people focus on theoretical knowledge, while others want to cover practical applications of technology. “Survey the industry and compare it to your skills,” Johnson recommends. “Decide what you want to do, and identify where you have gaps in your skills and experience.” Here are four of the nine certifications listed in the guide that are frequently cited as being important. All the providers are cybersecurity organizations. Certified information security manager. This globally recognized certification from the ISACA is for professionals managing enterprise information security. Certified cloud security professional. Offered by ISC2, this credential validates advanced technical skills in designing, managing, and securing cloud infrastructure. Certified ethical hacker. This certification from the International Council of E-Commerce Consultants (C-Council) confirms proficiency in using methods commonly employed by malicious hackers to detect vulnerabilities. Offensive security certified professional. A hands-on, 24-hour certification exam offered by OffSec covers practical testing skills. Additional industry-specific certifications might be required for organizations in finance, government, health care, or manufacturing. Sound general knowledge—backed by experience, training, and certification—is an essential foundation for being a specialist, Johnson says. Conferences and networking opportunities Events sponsored by the IEEE Computer Society can help you learn about the latest research and advancements in cybersecurity: IEEE Symposium on Security and Privacy, from 18 to 21 May in San Francisco. IEEE European Symposium on Security and Privacy, from 6 to 10 July in Lisbon. IEEE International Conference on Cyber Security and Resilience, from 3 to 5 August in Lisbon. IEEE Secure Development Conference, from 14 to 16 October in Indianapolis. Conferences can give you insight into the field and let you do some networking, but it’s important to network elsewhere as well, experts say. Consider joining the IEEE Technical Community on Security and Privacy, which connects experts and professionals advancing research in areas such as encryption, operating system security, and data privacy. Learning and meeting people keeps your knowledge sharp and can lead to mentorship opportunities with established cybersecurity consultants, Johnson says. Other IEEE resources The IEEE Computer Society’s cybersecurity resources page offers a wealth of information including fundamentals, possible career paths, and standards development. To keep you updated on trends, the society publishes IEEE Transactions on Privacy and the IEEE Security and Privacy magazine. In addition to the guide, the IEEE Learning Network offers nearly 30 courses on cybersecurity. And you can find research papers in the IEEE Xplore Digital Library.
More than 30 years ago, in the mountain village of Mbem in northwest Cameroon, the moon and stars in the night sky were the only light young Jude Numfor knew after the sunset. Electricity had not yet reached his rural community. “There was one person in the village with a petrol generator and a small television,” Numfor says. “When he turned it on, all the children would run to his house and peep through the window.” That memory became the spark for Numfor’s mission: to bring electricity to rural communities like his hometown. To accomplish his goal, in 2006 he cofounded Wireless Light and Power, since renamed Renewable Energy Innovators Cameroon, and he serves as its CEO. REI Cameroon designs, installs, and maintains solar minigrids for rural electrification. The minigrids use photovoltaic technology and battery-energy storage systems to generate electricity at 50 hertz. The electricity is distributed through smart meters. In 2017 the company received a grant from IEEE Smart Village to fund the expansion of REI’s minigrid operations and refine its business model. Smart Village supports projects and organizations bringing electricity and educational and employment opportunities to remote communities worldwide. The program is supported by IEEE societies and donations to the IEEE Foundation. The partnership has led to a collaboration developing open source metering, a free, community-driven way of tracking energy usage. Unlike proprietary utility meters, the system allows users, researchers, and utilities to view, customize, and verify how data is collected, ensuring transparency in billing, consumption tracking, and grid management. Smart Village’s support has been pivotal, Numfor says: “It’s not just about money. We share ideas, we get advice, and we have made friends. Entrepreneurship is lonely, but with the [Smart Village] community, it is different.” From teenage tinkerer to entrepreneur Numfor’s first experience of life with electricity was in 2001, after moving in with a missionary family in the small village of Allat. They used solar panels to power their whole home—an unimaginable luxury in Mbem. “I could watch TV, eat ice cream, and turn on lights,” he says. “It made me wish my brothers in Mbem had the same opportunity.” Numfor’s curiosity about electricity was ignited when a motion-sensor solar light in the family’s home stopped working. He tinkered with the device to find out why. “My missionary family told me to play with it like a toy,” he says, laughingly. “I replaced the dead battery with a motorcycle battery and was able to bring the power back for the night.” Jude Numfor [right] testing a rechargeable solar lantern, which aimed to replace hazardous kerosene lamps—known locally as “bush lamps.”REI Cameroon His missionary parents encouraged Numfor to study technology and engineering on his own, as none of the country’s universities offered solar energy educational programs at the time. They built him a library and stocked it with books on engineering, management, and entrepreneurship. In 2006, armed with his new knowledge, Numfor launched Wireless Light and Power with a friend, Ludwig Teichgraber. The nonprofit aimed to replace hazardous kerosene lamps—known locally as “bush lamps”—with rechargeable solar lanterns. These solar lanterns—called “light packs”—were built locally by Numfor and a team of 11 young Cameroonians using PVC pipes, nickel-metal hydride batteries, and LED bulbs. Families rented the lamps for a small fee, swapping discharged lamps for fully charged ones at solar-powered charging kiosks when they ran out of power. The kiosks then recharged the depleted lamps, making them available for the next swap. “The solar lantern was safer and cleaner, plus it gave children a chance to read at night,” Numfor explains. “People loved them.” Between 2006 and 2010, his team replicated the model across several villages. But when the global financial crisis hit in 2008, donor support dwindled, forcing the organization to evolve. “We pivoted from being an NGO to a commercial venture,” he says. “That’s how REI was born.” Building solar minigrids to serve community needs The new company’s goal was to move away from the lanterns and toward full electrification of communities. Villagers’ aspirations changed, Numfor says, as they now wanted to power their TVs, music systems, and mobile phones. In response, in 2010, REI developed one of the first solar minigrids in West Africa. Using locally procured components, the prototype supplied steady power to six households. The minigrid system used 12 123-watt solar photovoltaic panels manufactured by Sharp, 16 12-volt 100 ampere-hour automatic gain control lead acid batteries, and a Xantrex charge controller and inverter. Locally sourced wooden light poles were erected to distribute electricity throughout the village. REI charged each household a fee for the electricity. “It was a product-market-fit moment,” Numfor says. “People immediately asked, ‘When can we get this, too?’” The word-of-mouth, grassroots growth caught the attention of global partners. Numfor connected with Smart Village and in 2017, REI Cameroon received its first seed grant from the program. With that funding, Numfor was able to grow organically and attract additional grants, including one from the U.S. Trade Development Agency (USTDA), in partnership with the U.S. Department of Energy’s National Renewable Energy Laboratory. REI has since expanded to six villages, providing power to more than 1,000 households and businesses. With a dedicated team of 16 people, the company operates in multiple regions of the country, each with unique terrain, languages, and cultural dynamics. “It wasn’t easy,” he acknowledges. “I’m not an academic person—I had to learn everything by doing. [Smart Village] helped me structure the project and grow as an entrepreneur.” Today, Numfor pays it forward by sharing his Smart Village experience and mentoring new entrepreneurs. Launching a coalition for smart metering Minigrids can’t operate efficiently without clarifying operating rules to ensure quality service requirements and consumer protection, while also enabling reliable and effective monitoring of the system, Numfor says. “We need to know how power is being used, detect problems early, and manage the minigrid from a distance,” he explains. Existing commercial smart-meter providers offer limited and proprietary solutions. One major provider left the market, making their technology infrastructure obsolete. “It’s risky for an entire sector to depend on a few companies for such a critical technology,” Numfor says. In 2025, with the help of the Smart Village technical community, Numfor convened a consortium of open-source power advocates, including the Africa Mini-Grid Developers Association, EnAccess, Energy IOT, and NESL. The goal was to develop an open smart metering system that is accessible, transparent, and sustainable for all energy providers. “These organizations are collaborating as Open Advanced Metering Infrastructure [OpenAMI], which is about giving control back to the people who deliver the energy,” he says. Scaling for impact Numfor’s passion has grown from bringing light to local rural communities to bringing light to his entire country. Just 54 percent of Cameroon’s citizens have access to electricity, according to the International Energy Agency. For Numfor, the challenge is not just technological—it’s social and economic as well. “Electricity is the most important enabler of education and economic growth today,” he says. “When you have power, you unlock everything else.” “Electricity changed my life. Now I want to make sure every child can grow up with that same light.” —Jude Numfor Across the villages where REI has installed sustainable electricity solutions, small businesses are flourishing. Barbershops hum with community chatter, food vendors can preserve perishables, and entrepreneurs run companies such as phone-charging stations and small mills. “Some villages even have laundromats now,” Numfor says proudly. “Electricity creates jobs and changes mindsets.” Still, it has been a bumpy journey. It wasn’t until 2025 that REI obtained its official authorization (license) from Cameroon’s government to produce and distribute electricity in off-grid areas using solar minigrids. This was a major milestone because REI is one of the first private enterprises in the country to receive such authorization. “We were stuck between pilot projects and growth,” he explains. “Our projects were successful, and there was community demand for more, but to grow, we needed investors who require legal guarantees before committing funds. Now we can scale up and attract investors.” REI plans to expand its reach dramatically, beginning with 134 new villages identified through a feasibility study supported by the USTDA. Their long-term goal is to electrify 760 villages across Cameroon by 2031. While authorization opens doors, financing remains one of REI’s biggest challenges. “The minigrid space doesn’t attract venture capitalists easily,” Numfor notes. “Our return on investment is under 15 percent, so it’s not a typical tech startup model. The real return here is the impact” on the community. He hopes to attract investors who understand that access to electricity drives education, health care, and entrepreneurship. “There are people out there who want to make meaningful change,” he says. “We just need to connect with them. When you electrify a village, you never know who the next innovator will be. Maybe it’s another kid like me, looking through a window, dreaming.” Finding skilled staff is another challenge, Numfor says. To address this, REI developed an intensive recruitment and training process. “It used to take years to find the right people,” he says. “Now, we can identify who fits our company culture within six months.” Numfor’s wife, Angela Taliklong, who joined the venture in 2010, now oversees administration and human resources. A brighter Cameroon and beyond Numfor offers simple words of advice to other impact-driven entrepreneurs: Keep moving. “One of my mistakes early on was trying to be perfect,” he says. “I was spending time improving prototypes instead of increasing the number of our project installations and scaling how many communities we could electrify. You must keep momentum. Don’t wait until everything is perfect before you move forward.” That mindset, rooted in resilience and experimentation, has defined his journey. Rajan Kapur, president of Smart Village, says Numfor is a “shining example” of the program’s vision: “scalable and enduring impact through local entrepreneurs, local procurement, and community engagement based on the use of IEEE technology in underserved communities.” With the ongoing Smart Village partnership, Numfor is determined to bring light and opportunity to every corner of Cameroon, and beyond. He already has launched REI Nigeria. “Electricity changed my life,” he says. “Now I want to make sure every child can grow up with that same light.”
Laboratory or in-field measurements are often considered the gold standard for certain aspects of power system design; however, measurement approaches always have limitations. Simulation can help overcome some of these limitations, including speeding up the design process, reducing design costs, and assessing situations that are often not feasible to measure directly. In this presentation, we will discuss two examples from the power system industry. The first case we will discuss involves corona performance testing of high-voltage transmission line hardware. Corona-free insulator hardware performance is critical for operation of transmission lines, particularly at 500 kV, 765 kV, or higher voltages. Laboratory mockups are commonly used to prove corona performance, but physical space constraints usually restrict testing to a partial single-phase setup. This requires establishing equivalence between the laboratory setup and real-world three-phase conditions. In practice, this can be difficult to do, but modern simulation capabilities can help. The second case involves submarine HVDC cables, which are commonly used for offshore wind interconnects. HVDC cables are often considered to be environmentally inert from an external electric field perspective (i.e., electric fields are contained in the cable, and the cable’s static magnetic fields induce no voltages externally). However, simulation demonstrates that ocean currents moving through the static magnetic field satisfy the relative motion requirement of Faraday’s law. Thus, externally induced electric fields can exist around the cable and are within a range detectable by various aquatic species. Key Takeaway: Learn how to use modern simulation to translate single-phase laboratory corona mockups into accurate three-phase real-world performance for 500 kV and 765 kV systems. Explore the physics behind how ocean currents interacting with HVDC submarine cables create induced electric fields—a phenomenon often overlooked but detectable by aquatic species. Gain actionable insights into how to leverage simulation to reduce design costs and bypass the physical space constraints that often stall traditional testing. See a practical application of electromagnetic theory as we demonstrate how relative motion in static magnetic fields necessitates simulation where direct measurement is unfeasible. Register now for this free webinar!