🇺🇸 미국 · IT/기술 · "SOLE" · 총 17건
필터 보기현재 지수
50.0
0 = 부정 우세
50 = 중립
100 = 긍정 우세
최근 7일 기준 11,627건을 분석한 결과, 뉴스 심리지수는 50.0(균형)입니다. 긍정 1건(0.0%)·중립 11,625건(100.0%)·부정 1건(0.0%)이며, 중립 비중이 뚜렷하게 높습니다. 성향 지수는 종합 18.5(중도 균형)입니다.
Tech giants are shifting from solely providing computing power to distributing AI models, unlocking a lucrative new revenue stream.
The caveat is that one of the world's most famous living directors is using the tech solely for storyboarding.
A glass screen protector is one of a few essential accessories that I strongly recommend to every Switch 2 owner. In fact, it should be a priority to stick one onto the console’s screen as soon as possible to avoid accidental scratches. To test the candidates below, I installed and removed Switch 2 screen protectors […]
The new line of Windows laptops and desktops will be the first ever to run solely on an Nvidia-made chip, the RTX Spark, as the AI giant looks to take on rivals Intel and AMD.
The new line of Windows laptops and desktops will be the first ever to run solely on an Nvidia-made chip, the RTX Spark, as the AI giant looks to take on rivals Intel and AMD.
As handheld consoles continue to grow and push the limits of what you can actually hold in your hands, the Arduboy FX-C comes in a refreshingly pocketable package. It manages to squeeze the best features of past models and some welcome upgrades into a handheld that’s still no larger or thicker than a few credit […]
Mill CEO and Nest co-founder Matt Rogers watched Apple render startups obsolete overnight. He says the same dynamic is playing out in AI — and the survival playbook looks familiar.
Electrons are great. We use them to move vehicles, illuminate cities, and, of course, compute. But computation is not confined to the world of electronics. And shifting to alternative nonelectronic realms can unlock unique advantages: Photonic chips, for instance, process information with light while generating little heat. Another compelling alternative is fluidics, which uses pressurized gases or liquids to build logic circuits. Pioneered in the 1960s but sidelined by microchips, the field reemerged in the 1990s as “microfluidics.” This approach aims to shrink laboratories onto a single chip by creating microscopic fluid channels with integrated micropneumatic control systems. Today, there is a second fluidic revival, this time in the domain of soft robotics. Scaling microfluidic designs up to the millimeter-scale range (millifluidics) enables the higher flow rates necessary to drive robotic actuators. These robots exploit the nonlinear behaviors of soft materials to create lifelike motion and safer interactions, often utilizing pressurized air. By building systems that “think” with the same air that powers them, we can drastically reduce the need for bulky electronic-to-pneumatic interfaces. This is the focus of my Soiboi Studio robotics lab. With millifluidic logic, I have steadily scaled the complexity of my designs. What began with a simple oscillator has most recently evolved into a clock featuring a soft, four-digit, seven-segment display. What Is Millifluidics? Building on microfluidics research from the early 2000s and recent developments from the Grover Lab at the University of California, Riverside, I’ve developed millifluidic devices using standard 3D printing and silicone casting. The basic architecture is simple: A flexible membrane is sandwiched between rigid layers embedded with networks of air channels. Just as electronics rely on differing voltage potentials, these fluidic circuits operate on the pressure difference between atmospheric pressure (logical 0) and a near-vacuum at around −60 kilopascals of relative pressure (logical 1). Using negative pressure means the membrane is pulled into openings. This creates robust seals that allow me to replicate electronic building blocks. A cast silicone membrane forms the face of the clock [top], while behind it sits 3D-printed millifluidic blocks [middle rows]. An Arduino Uno controls driver boards that operate solenoids, which are connected to valves that are attached to a vacuum pump [bottom row].James Provost While fluidic resistors are easily realized by adjusting the channel geometry, the heart of the system is a valve that mimics a metal-oxide-semiconductor field-effect transistor, or MOSFET. This vacuum “transistor” features a flow layer with two chambers (the source and drain) divided by a central valve seat and a control layer containing a cavity (the gate). A membrane runs between the control and flow layers and normally prevents airflow between the source and drain chambers. To switch the transistor on, a vacuum is applied to the gate chamber, sucking the membrane into the cavity and lifting it off the seat. This opens a path for airflow, equivalent to closing an electric circuit. By adding a small aperture to the membrane, I created a check valve—the fluidic equivalent of a diode. By combining transistors and resistive “pull-down” channels, I can build a full suite of logic gates. The original microfluidic designs that inspired me were fabricated from etched glass and milled acrylic. Adapting them for a standard 3D printer required reengineering the logic elements and mastering two critical fabrication techniques. First, I need airtight prints, yet printed plastic is notoriously porous. By printing at elevated temperatures, slow speeds, and slight overextrusion, I was able to fill microscopic gaps. When you’re using transparent filament, there’s a handy visual indicator: The more transparent the plastic appears, the lower its porosity. Second, I used glass for my print bed. By printing the upper and lower chambers directly against this bed, I got the interface surface to become mirror smooth. This finish is essential for creating reliable, airtight seals. A 0.3-millimeter silicone membrane is placed between the layers and secured with screws. How Does the Soft Clock Work? The clockface is a cast silicone membrane. Each digit segment is formed by a small underlying cavity. When air is evacuated from this cavity, the membrane is sucked inward to create a concave hollow; when atmospheric pressure is restored, the silicone pops back flush with the surface. The result is a mesmerizing, organic motion. The “brain” of the clock is an Arduino Uno, while the fluidics significantly reduce the hardware footprint. A four-digit, seven-segment display with two separator dots would require 29 solenoid valves to control directly. My clock needs just 11 valves. A pneumatic transistor is off when its upper control chamber is at atmospheric pressure [top]. When air is removed from the control chamber, it lifts a membrane, which allows air to flow between lower flow chambers and turns the transistor on [bottom]. James Provost To understand how it works, consider a standard electronic four-digit, seven-segment LED display. This also uses 11 pins to drive its digits. (In clockface displays, an additional pin is required to drive the separator dots.) Every digit is connected to a shared data bus with seven lines, one per segment. The four control lines select individual digits. Only one digit is illuminated at time, and strobing the digits at least 50 times per second creates the illusion that all four are simultaneously illuminated. Such high-speed switching is not possible with air. Instead, I rely on memory. Each segment acts like a capacitor: By evacuating its cavity (logic 1), you “charge” the segment; by restoring atmospheric pressure (logic 0), you discharge it. Hence, each digit acts as an independent 7-bit memory. If the system is sufficiently airtight, the segments maintain their state for several seconds. Like the electronic display, the system utilizes a seven-line data bus. Each line connects to a solenoid valve that provides either vacuum or atmospheric pressure. To selectively address the individual digits, I placed a fluidic transistor between each segment and its data line. All the transistors’ control inputs for a given digit are combined into one “write enable” line connected to its own solenoid valve. Activating this valve allows me to write data into the corresponding digit’s memory. The clock updates one digit per second, meaning a full cycle across the face takes 4 seconds. This cycle also drives the separator dots: A set of fluidic diodes connects the enable lines to the dots’ cavities. Consequently, as each digit is addressed, the dots pulse automatically. This display is more than a clock; it is a soft robot that happens to tell time. By offloading computation to the same air that powers movement, the clock approaches a new class of machines that are simpler, lighter, and more integrated. I’m now developing a guide for getting started with vacuum-powered logic and may release a refined version of this clock in the future. Watching the silicone skin morph serves as a fascinating reminder that not all logic needs silicon; sometimes, all you need is flexible silicone and a flow of air. This article appears in the June 2026 print issue as “The Soft Clock.”
Consoles with disc drives are the easiest way to enjoy all kinds of physical media, but that could end with the next-gen PlayStation 6 and Microsoft's Project Helix.
Activision is planning to drop support for PS4 and Xbox One consoles in Call of Duty: Warzone later this year. Players will need to upgrade to a PS5 or Xbox Series S / X console to continue playing Call of Duty: Warzone once season 6 of Call of Duty: Black Ops 7 finishes later this […]
The Nintendo Switch 2 can be enjoyed right out of the box, but it’s even better with the right accessories. Some of these add-ons are more crucial than others, especially if you’re deciding what to buy early on. For example, a case and a screen protector can keep your console safe from scuffs, scratches, and […]
If you foresee a bunch of Nintendo purchases in your future, Newegg’s deal on Nintendo gift cards might just help save your wallet. The retailer is offering a deal that lets gamers get $200 worth of credit towards games, consoles, and accessories for just $170. Best of all, the gift cards can stack in your […]
Keep your phone, laptop, handheld gaming console, and other electronics running with these travel-friendly power banks.
Nintendo recently teased the “Choose Your Game” Switch 2 console and digital game bundle, coming in early June. However, multiple retailers (including Nintendo itself) are already offering the $499.99 bundle. The list currently includes GameStop, Amazon, Best Buy, and the Nintendo Store. It’s a deal worth hopping on ahead of the holiday season, since Nintendo […]
For years, the field of robotics has used the terms “dull, dirty, and dangerous” (DDD) to describe the types of tasks or jobs where robots might be useful—by doing work that’s undesirable for people. A classic example of a DDD job is one of “repetitive physical labor on a steaming hot factory floor involving heavy machinery that threatens life and limb.” But determining which human activities fit into these categories is not as straightforward as it seems. What exactly is a “dull” task, and who makes that assumption? Is “dirty” work just about needing to wash your hands afterwards, or is there also an aspect of social stigma? What data can we rely on to classify jobs as “dangerous?” Our recent work (which was not dull at all) tackles these questions and proposes a framework to help roboticists understand the job context for our technology. First, we did an empirical analysis of robotics publications between 1980 and 2024 that mention DDD and found that only 2.7 percent define DDD and only 8.7 percent provide examples of tasks or jobs. The definitions vary, and many of the examples aren’t particularly specific (for example, “industrial manufacturing,” “home care”). Next, we reviewed the social science literature in anthropology, economics, political science, psychology, and sociology to develop better definitions for “dull,” “dirty,” and “dangerous” work. Again, while it might seem intuitive which tasks to put into these buckets, it turns out that there are some underlying social, economic, and cultural factors that matter. Dangerous Work: Occupations or tasks that result in injury or risk of harm It’s possible to measure the danger of a task or job by using reported information. There are administrative records and surveys that provide numbers on occupational injury rates and hazardous risk factors. While that seems straightforward, it’s important to understand how this data was collected, reported, and verified. First, occupational injuries tend to be underreported, with some studies estimating up to 70 percent of cases missing in administrative databases. Second, injuries and risk factors are rarely disaggregated by characteristics like gender, migration status, formal/informal employment, and work activities. For example, because most personal protective equipment—such as masks, vests, and gloves—are sized for men, women in dangerous work environments face increased safety risks. These caveats are an opportunity for robotics to be helpful. If we went out and looked for it, we could probably find some less obviously dangerous work where robotics might be an important intervention, not to mention some groups that are disproportionately affected and would benefit from more workplace safety. Dirty Work: Occupations or tasks that are physically, socially, or morally tainted Colloquially, most people might think of dirty work as involving physical dirtiness, such as trash removal, cleaning, or dealing with hazardous substances. But social science literature makes clear that dirty work is also about stigma. Socially tainted jobs are often servile or involve interacting with stigmatized groups (for example, correctional officers), and morally tainted jobs include tasks that people commonly perceive as sinful, deceptive, or otherwise defying norms of civility (like a stripper or a collection agent). “Dirty work” is a social construct that can vary across time (like tattoo industry stigma in the United States) and culture (such as nursing in the U.S. versus in Bangladesh). One way to measure whether work is “dirty” is by using the closely related concept of occupational prestige, captured through quantitative surveys where people rank jobs. Another way to measure it is through qualitative data, like ethnographies and interviews. Similar to “dangerous,” we see some hidden opportunities for robotics in “dirty” work. But one of our more interesting takeaways from the data is that a lower-ranked job can be something that the workers themselves enjoy or find immense pride and meaning in. If we care about what tasks are truly undesirable, understanding this worker perspective is important. Dull Work: Occupations or tasks that are repetitive and lacking in autonomy When it comes to defining dull work, what matters most is workers’ own experiences. Outsiders can make a lot of false assumptions about what tasks have value and meaning. Sometimes things that seem boring or routine create the right conditions for developing skills and competence, such as the concentration needed for woodworking, or for socializing and support, when tasks are done alongside others. Instead of assuming that repetitive work is negative, it’s important to examine qualitative data on how people experience the work and what purpose it serves for them. DDD: An actionable framework In our paper, we propose a framework to help the robotics community explore how automation impacts individual jobs. For each term—dull, dirty, and dangerous—the framework gathers key pieces of information to reflect on what physical or social aspects of the task are, in fact, DDD. Worker perspective is an important part of all three considerations. The framework also emphasizes awareness of context—meaning the physical and social environment of an occupation and industry that can influence the DDD nature of a task. Our corresponding worksheet suggests existing data sources to draw on and encourages us to seek out multiple perspectives and consider potential sources of bias in the information. What makes tasks dull, dirty, or dangerous depends on the perspective of the humans doing those tasks.RAI Let’s take, for example, the waste and recycling industry. The world generates over 2 billion tonnes of waste annually, and this figure is expected to rise to nearly 4 billion tonnes by 2050. Intuitively, trash collection seems like a job that hits all the Ds. Going through our worksheet, we confirm that globally, workers in this industry face significant health hazards (dangerous), and waste collection is ranked as a low-status job (dirty), although interestingly, many workers take pride in providing this essential service. The job is also repetitive, but there are aspects that make it not dull. Specifically, workers cite the day-to-day interaction with their coworkers (which includes extensive insider vocabulary, work hacks, and mutual aid groups) and task variety as two of the most enjoyable aspects of the job. Task variety includes inspecting their vehicle and equipment, driving their truck, coordinating with crew members, lifting bins and bags, detecting incorrect sorting of waste, and unloading at the end destination. This finding matters because some types of robotic solutions will eliminate the parts of the job that workers most appreciate. For instance, the National Institute for Occupational Safety and Health (NIOSH) recommends the adoption of automated side loader trucks and collision avoidance systems. This innovation increases safety, which is great, but it also results in a sole worker operating a joystick in a cab, surrounded by sensor and camera surveillance. Instead, we should challenge ourselves to think of solutions that make jobs safer without making them terrible in a different way. To do this, we need to understand all aspects of what makes a job dull, dirty, or dangerous (or not). Our framework aims to facilitate this understanding. Finally, it’s important to note that DDD is only one of many possible approaches to classify what work might be better served by robots. There are lots of ways we could think about which types of tasks or jobs to automate (for example, economic impact or environmental sustainability). Given the popularity of DDD in robotics, we chose this common phrase as a starting point. We would love to see more work in this space, whether it’s data collection on DDD itself or the creation of other frameworks. At RAI, we believe that the fusion of robotics and social sciences opens a whole new world of information, perspectives, opportunities, and value. It fosters a culture of curiosity and mutual learning, and allows us to create actionable tools for anyone in robotics who cares about societal impact. Dull, Dirty, Dangerous: Understanding the Past, Present, and Future of a Key Motivation for Robotics, by Nozomi Nakajima, Pedro Reynolds-Cuéllar, Caitrin Lynch, and Kate Darling from the RAI Institute, was presented at the 21st ACM/IEEE International Conference on Human-Robot Interaction (HRI) in Edinburgh, Scotland.
This sponsored article is brought to you by Applied Materials. At pivotal moments in history, progress has required more than individual brilliance. The most consequential breakthroughs — such as those achieved under the Human Genome Project — required a new operating paradigm: Concentrate the world’s best talent around a single mission, establish a common platform, share critical infrastructure, and collapse feedback loops. When stakes are high and timelines are compressed, sequential and siloed innovation simply cannot keep pace. Today’s AI era is creating an engineering race with similar demands. Every company is pushing to deliver higher-performance AI systems, faster. But performance is no longer defined by compute alone. AI workloads are increasingly dominated by the movement of data: In many cases, moving bits consumes as much — or more — energy than compute itself. As a result, reducing energy per bit can extend system‑level performance alongside gains in peak compute. The path to energy‑efficient AI therefore runs through system‑level engineering, spanning three tightly interconnected domains: Logic, where performance per watt depends on efficient transistor switching, low‑loss power, and signal delivery through dense wiring stacks. Memory, where surging bandwidth and capacity demands expose the memory wall, with processor capability advancing faster than memory access. Advanced packaging, where 3D integration, chiplet architectures, and high‑density interconnects bring compute and memory closer together — enabling system designs monolithic scaling can no longer sustain. These domains can no longer be optimized independently. Gains in logic efficiency stall without sufficient memory bandwidth. Advances in memory bandwidth fall short if packaging cannot deliver proximity within thermal and mechanical constraints. Packaging, in turn, is constrained by the precision of both front‑end device fabrication and back‑end integration processes. In the angstrom era, the hardest problems arise at the boundaries — between compute and memory in the package, front‑end and back‑end integration, and the tightly coupled process steps needed for precise 3D fabrication. And it is precisely this boundary‑driven complexity where the traditional innovation model breaks down. The Traditional R&D Workflow Is Too Slow for Angstrom‑Era AI For decades, the semiconductor industry’s R&D model has resembled a relay race. Capabilities are developed in one part of the ecosystem, handed off downstream through integration and manufacturing, evaluated by chip and system designers, and only then fed back for the next iteration. That model worked when progress was dominated by relatively modular steps that could be scaled independently and simply dropped into the manufacturing flow. But the AI timeline has upended these rules. At angstrom‑scale dimensions, the physics enforces inescapable coupling across the entire stack: materials choices shape integration schemes; integration defines design rules; design rules dictate power delivery; wiring sets thermal budgets; and thermals ultimately constrain packaging scaling. System architects simply cannot wait 10–15 years for each major semiconductor technology inflection to mature. Representing a roughly $5 billion investment, EPIC is the largest commitment to advanced semiconductor equipment R&D in U.S. history. A long‑term perspective is essential to align materials innovation with emerging device architectures — and to develop the tools and processes required to integrate both with manufacturable precision. At Applied Materials, together with our customers, we are charting a course across the next 3–4 generations, extending as far as 10 years down the roadmap. The angstrom era demands that we break down silos and bring together the industry’s best minds — from leading companies to leading academic institutions. If the problem is coupled, the solution must be coupled. If the timeline is compressed, the learning loop must be compressed. It’s not enough to just innovate — we must innovate how we innovate. EPIC: A Center and Platform for High‑Velocity Co‑Innovation This is the challenge that Applied Materials EPIC Center is designed to solve. Representing a roughly US $5 billion investment, EPIC is the largest commitment to advanced semiconductor equipment R&D in U.S. history. When it opens in 2026, it will deliver state‑of‑the‑art cleanroom capabilities built from the ground up to shorten the path from early‑stage research to full‑scale manufacturing. But the facilities are only one component of the model. EPIC is also a platform, an operating system for high-velocity co‑innovation that revolutionizes how ideas move from the lab to the fab. EPIC is a platform, an operating system for high-velocity co‑innovation that revolutionizes how ideas move from the lab to the fab.Applied Materials The EPIC model compresses the traditional workflow. Customer engineers work side‑by‑side with Applied technologists from day one — moving beyond isolated process optimization and downstream handoffs. Within a shared, secure environment, EPIC tightly integrates atomistic modeling, test vehicles, process development, validation, and metrology feedback. Constraints that once surfaced late in development are identified and addressed early. The result is a potentially 2x faster path that benefits the entire ecosystem under one roof: Chipmakers gain earlier access to Applied’s R&D portfolio, faster learning cycles, and accelerated transfer of next‑generation technologies into high‑volume manufacturing. Ecosystem partners gain earlier access to advanced manufacturing technology and collaboration opportunities that expand what is possible through materials innovation. Academic institutions gain opportunities to strengthen the lab‑to‑fab pipeline and help develop future semiconductor talent. Building on decades of co‑development, we are reinventing the innovation pipeline with our partners across logic, memory, and advanced packaging to deliver the next leap in energy‑efficient AI. Accelerating Advanced Logic Logic remains the engine of AI compute. In the angstrom era, however, system‑level gains are increasingly constrained by power and energy. Extending AI performance now depends on architectures that deliver more performance per watt — accelerating the move to 3D devices such as gate‑all‑around (GAA) transistors, which boost density within a compact footprint while preserving power efficiency. Architectures that deliver more performance per watt are accelerating the move to 3D devices such as gate‑all‑around (GAA) transistors, and further out, complementary FETs (CFETs), which push density scaling even more.Applied Materials These architectural shifts are unfolding at unprecedented scale, with the logic roadmap already extending beyond first‑generation GAA toward more advanced designs. One key example is GAA with backside power delivery, which relocates thick power lines to the backside of the wafer, reducing resistive losses and freeing front‑side routing for tighter logic cell integration. Another example brings adjacent GAA PMOS and NMOS transistors closer together while inserting a dielectric isolation wall between them to minimize electrical interference. Further out, complementary FETs (CFETs) push density scaling even more by stacking PMOS and NMOS devices directly atop one another. While these architectures deliver compelling gains in performance per watt and logic density without relying solely on tighter lithography, they significantly raise integration complexity. Manufacturing a single GAA device today can involve more than 2,000 tightly interdependent process steps. At the same time, wiring stacks continue to grow taller and denser to connect these advanced logic devices. Modern leading‑edge GPUs now in development pack more than 300 billion transistors into an area little larger than a postage stamp, interconnected by over 2,000 miles of wiring. Modern leading‑edge GPUs now in development pack more than 300 billion transistors into an area little larger than a postage stamp, interconnected by over 2,000 miles of wiring.Applied Materials At this level of complexity, the process steps used to create these precise 3D devices and wiring stacks cannot be optimized independently. Design and process must evolve in lockstep, and materials innovation and fabrication methods must advance alongside device architecture. EPIC’s co‑innovation model is designed to accelerate exactly this convergence — enabling logic compute to continue advancing the frontiers of AI at the pace the roadmap demands. Powering the Memory Roadmap At the same time, the AI computing era is fundamentally reshaping how data is generated, moved, and processed — making memory technologies, especially DRAM, central to delivering the energy‑efficient performance AI systems require. As models grow larger and more data‑hungry, the DRAM roadmap is shifting toward architectures that deliver higher density, greater bandwidth, and faster access per watt. At the DRAM cell level, AI performance requirements are driving a transition from 6F² buried‑channel array transistors (BCAT) to more compact 4F², and beyond that, architectures that move past what 2D scaling alone can deliver. Applied Materials At the DRAM cell level, this shift is driving a transition from 6F² buried‑channel array transistors (BCAT) to more compact 4F² architectures, which orient the transistor vertically to boost density and reduce chip area. Looking beyond 4F², sustaining gains in performance per watt will require moving past what 2D scaling alone can deliver. The industry is therefore turning to 3D DRAM, stacking memory cells vertically to add capacity within a constrained footprint. As these structures grow taller and aspect ratios intensify, high-mobility materials engineering in three dimensions becomes increasingly critical to performance and reliability. Beyond the memory cell array, another powerful lever for DRAM scaling is shrinking the peripheral circuitry, which includes logic transistors and interconnect wiring. One emerging approach places select periphery functions beneath the DRAM array by bonding two wafers — one optimized for the DRAM cells and the other for CMOS logic — using multiple wiring layers. Beyond the memory cell array, another powerful lever for DRAM scaling is shrinking the peripheral circuitry, which includes logic transistors and interconnect wiring.Applied Materials In parallel, DRAM performance is being extended by leveraging logic‑proven enhancers in the memory periphery. These include mobility boosters such as embedded silicon germanium and stress films, along with wiring upgrades like improved low‑k dielectrics and advanced copper interconnects. Memory manufacturers are also transitioning periphery transistors from planar devices to FinFET architectures, following the logic roadmap to further improve I/O speed. These valuable inflections are central to EPIC’s mission — where they can be co-developed and rapidly validated for next‑generation memory systems. Driving System Scaling With Advanced Packaging As data movement becomes the dominant energy cost in AI systems, advanced packaging has emerged as a critical lever for improving system‑level efficiency—shortening interconnect distances, increasing bandwidth density, and reducing the power required to move data between logic and memory. The rise of 3D packages such as high‑bandwidth memory (HBM) underscores why advanced packaging is becoming central to the AI era.Applied Materials High‑bandwidth memory (HBM) marks a major inflection along this path. By stacking DRAM dies — scaling to 16 layers and beyond — and placing memory much closer to the processor, HBM enables rapid access to ever‑larger working datasets. This delivers step‑function gains in both bandwidth and energy efficiency. More broadly, the rise of 3D packages such as HBM underscores why advanced packaging is becoming central to the AI era. Packaging now addresses system‑level constraints that logic and memory device scaling alone can no longer overcome. It also enables a move away from monolithic systems‑on‑chip toward chiplet‑based architectures, as AI workloads increasingly demand flexible designs that combine logic, memory, and specialized accelerators optimized for specific tasks. A vital technology powering this roadmap is hybrid bonding. With interconnect pitches approaching those of on‑chip wiring, conventional bumps and microbumps run into fundamental limits in density, power, and signal integrity. Hybrid bonding removes these barriers by allowing dramatically higher interconnect and I/O density, supporting a broad range of chiplet architectures — from memory stacking to tighter compute‑memory integration. EPIC tackles high‑value advanced‑packaging challenges through early, parallel co‑innovation across materials, integration, and manufacturing.Applied Materials As bonded structures like HBM stacks grow larger and more complex, warpage control, die placement, stack alignment, and thermal management become first‑order challenges. EPIC tackles these and other high‑value advanced‑packaging challenges through early, parallel co‑innovation across materials, integration, and manufacturing. Bringing It All Together Across logic, memory, and advanced packaging, our industry faces an ambitious roadmap that promises significant gains in energy efficiency for AI systems. But realizing that potential demands breakthrough materials innovation at a time when feature sizes are shrinking, interfaces are multiplying, and process interdependencies are escalating. These challenges cannot be solved on 10–15‑year timelines under the traditional relay‑race model. We must break down silos, align earlier across the ecosystem, and parallelize learning to keep pace with AI’s demands. In the AI era, progress will be defined by the speed at which lightbulb moments turn into manufacturing and commercialization reality. The only viable path forward is a new innovation model — and EPIC is how we are driving it.
More than 30 years ago, in the mountain village of Mbem in northwest Cameroon, the moon and stars in the night sky were the only light young Jude Numfor knew after the sunset. Electricity had not yet reached his rural community. “There was one person in the village with a petrol generator and a small television,” Numfor says. “When he turned it on, all the children would run to his house and peep through the window.” That memory became the spark for Numfor’s mission: to bring electricity to rural communities like his hometown. To accomplish his goal, in 2006 he cofounded Wireless Light and Power, since renamed Renewable Energy Innovators Cameroon, and he serves as its CEO. REI Cameroon designs, installs, and maintains solar minigrids for rural electrification. The minigrids use photovoltaic technology and battery-energy storage systems to generate electricity at 50 hertz. The electricity is distributed through smart meters. In 2017 the company received a grant from IEEE Smart Village to fund the expansion of REI’s minigrid operations and refine its business model. Smart Village supports projects and organizations bringing electricity and educational and employment opportunities to remote communities worldwide. The program is supported by IEEE societies and donations to the IEEE Foundation. The partnership has led to a collaboration developing open source metering, a free, community-driven way of tracking energy usage. Unlike proprietary utility meters, the system allows users, researchers, and utilities to view, customize, and verify how data is collected, ensuring transparency in billing, consumption tracking, and grid management. Smart Village’s support has been pivotal, Numfor says: “It’s not just about money. We share ideas, we get advice, and we have made friends. Entrepreneurship is lonely, but with the [Smart Village] community, it is different.” From teenage tinkerer to entrepreneur Numfor’s first experience of life with electricity was in 2001, after moving in with a missionary family in the small village of Allat. They used solar panels to power their whole home—an unimaginable luxury in Mbem. “I could watch TV, eat ice cream, and turn on lights,” he says. “It made me wish my brothers in Mbem had the same opportunity.” Numfor’s curiosity about electricity was ignited when a motion-sensor solar light in the family’s home stopped working. He tinkered with the device to find out why. “My missionary family told me to play with it like a toy,” he says, laughingly. “I replaced the dead battery with a motorcycle battery and was able to bring the power back for the night.” Jude Numfor [right] testing a rechargeable solar lantern, which aimed to replace hazardous kerosene lamps—known locally as “bush lamps.”REI Cameroon His missionary parents encouraged Numfor to study technology and engineering on his own, as none of the country’s universities offered solar energy educational programs at the time. They built him a library and stocked it with books on engineering, management, and entrepreneurship. In 2006, armed with his new knowledge, Numfor launched Wireless Light and Power with a friend, Ludwig Teichgraber. The nonprofit aimed to replace hazardous kerosene lamps—known locally as “bush lamps”—with rechargeable solar lanterns. These solar lanterns—called “light packs”—were built locally by Numfor and a team of 11 young Cameroonians using PVC pipes, nickel-metal hydride batteries, and LED bulbs. Families rented the lamps for a small fee, swapping discharged lamps for fully charged ones at solar-powered charging kiosks when they ran out of power. The kiosks then recharged the depleted lamps, making them available for the next swap. “The solar lantern was safer and cleaner, plus it gave children a chance to read at night,” Numfor explains. “People loved them.” Between 2006 and 2010, his team replicated the model across several villages. But when the global financial crisis hit in 2008, donor support dwindled, forcing the organization to evolve. “We pivoted from being an NGO to a commercial venture,” he says. “That’s how REI was born.” Building solar minigrids to serve community needs The new company’s goal was to move away from the lanterns and toward full electrification of communities. Villagers’ aspirations changed, Numfor says, as they now wanted to power their TVs, music systems, and mobile phones. In response, in 2010, REI developed one of the first solar minigrids in West Africa. Using locally procured components, the prototype supplied steady power to six households. The minigrid system used 12 123-watt solar photovoltaic panels manufactured by Sharp, 16 12-volt 100 ampere-hour automatic gain control lead acid batteries, and a Xantrex charge controller and inverter. Locally sourced wooden light poles were erected to distribute electricity throughout the village. REI charged each household a fee for the electricity. “It was a product-market-fit moment,” Numfor says. “People immediately asked, ‘When can we get this, too?’” The word-of-mouth, grassroots growth caught the attention of global partners. Numfor connected with Smart Village and in 2017, REI Cameroon received its first seed grant from the program. With that funding, Numfor was able to grow organically and attract additional grants, including one from the U.S. Trade Development Agency (USTDA), in partnership with the U.S. Department of Energy’s National Renewable Energy Laboratory. REI has since expanded to six villages, providing power to more than 1,000 households and businesses. With a dedicated team of 16 people, the company operates in multiple regions of the country, each with unique terrain, languages, and cultural dynamics. “It wasn’t easy,” he acknowledges. “I’m not an academic person—I had to learn everything by doing. [Smart Village] helped me structure the project and grow as an entrepreneur.” Today, Numfor pays it forward by sharing his Smart Village experience and mentoring new entrepreneurs. Launching a coalition for smart metering Minigrids can’t operate efficiently without clarifying operating rules to ensure quality service requirements and consumer protection, while also enabling reliable and effective monitoring of the system, Numfor says. “We need to know how power is being used, detect problems early, and manage the minigrid from a distance,” he explains. Existing commercial smart-meter providers offer limited and proprietary solutions. One major provider left the market, making their technology infrastructure obsolete. “It’s risky for an entire sector to depend on a few companies for such a critical technology,” Numfor says. In 2025, with the help of the Smart Village technical community, Numfor convened a consortium of open-source power advocates, including the Africa Mini-Grid Developers Association, EnAccess, Energy IOT, and NESL. The goal was to develop an open smart metering system that is accessible, transparent, and sustainable for all energy providers. “These organizations are collaborating as Open Advanced Metering Infrastructure [OpenAMI], which is about giving control back to the people who deliver the energy,” he says. Scaling for impact Numfor’s passion has grown from bringing light to local rural communities to bringing light to his entire country. Just 54 percent of Cameroon’s citizens have access to electricity, according to the International Energy Agency. For Numfor, the challenge is not just technological—it’s social and economic as well. “Electricity is the most important enabler of education and economic growth today,” he says. “When you have power, you unlock everything else.” “Electricity changed my life. Now I want to make sure every child can grow up with that same light.” —Jude Numfor Across the villages where REI has installed sustainable electricity solutions, small businesses are flourishing. Barbershops hum with community chatter, food vendors can preserve perishables, and entrepreneurs run companies such as phone-charging stations and small mills. “Some villages even have laundromats now,” Numfor says proudly. “Electricity creates jobs and changes mindsets.” Still, it has been a bumpy journey. It wasn’t until 2025 that REI obtained its official authorization (license) from Cameroon’s government to produce and distribute electricity in off-grid areas using solar minigrids. This was a major milestone because REI is one of the first private enterprises in the country to receive such authorization. “We were stuck between pilot projects and growth,” he explains. “Our projects were successful, and there was community demand for more, but to grow, we needed investors who require legal guarantees before committing funds. Now we can scale up and attract investors.” REI plans to expand its reach dramatically, beginning with 134 new villages identified through a feasibility study supported by the USTDA. Their long-term goal is to electrify 760 villages across Cameroon by 2031. While authorization opens doors, financing remains one of REI’s biggest challenges. “The minigrid space doesn’t attract venture capitalists easily,” Numfor notes. “Our return on investment is under 15 percent, so it’s not a typical tech startup model. The real return here is the impact” on the community. He hopes to attract investors who understand that access to electricity drives education, health care, and entrepreneurship. “There are people out there who want to make meaningful change,” he says. “We just need to connect with them. When you electrify a village, you never know who the next innovator will be. Maybe it’s another kid like me, looking through a window, dreaming.” Finding skilled staff is another challenge, Numfor says. To address this, REI developed an intensive recruitment and training process. “It used to take years to find the right people,” he says. “Now, we can identify who fits our company culture within six months.” Numfor’s wife, Angela Taliklong, who joined the venture in 2010, now oversees administration and human resources. A brighter Cameroon and beyond Numfor offers simple words of advice to other impact-driven entrepreneurs: Keep moving. “One of my mistakes early on was trying to be perfect,” he says. “I was spending time improving prototypes instead of increasing the number of our project installations and scaling how many communities we could electrify. You must keep momentum. Don’t wait until everything is perfect before you move forward.” That mindset, rooted in resilience and experimentation, has defined his journey. Rajan Kapur, president of Smart Village, says Numfor is a “shining example” of the program’s vision: “scalable and enduring impact through local entrepreneurs, local procurement, and community engagement based on the use of IEEE technology in underserved communities.” With the ongoing Smart Village partnership, Numfor is determined to bring light and opportunity to every corner of Cameroon, and beyond. He already has launched REI Nigeria. “Electricity changed my life,” he says. “Now I want to make sure every child can grow up with that same light.”