2028’s AI moment
Potential Democratic and Republican candidates are beginning to stake out positions on A.I. ahead of the 2028 election
🇺🇸 미국 · IT/기술 · "DATES" · 총 27건
필터 보기현재 지수
50.0
0 = 부정 우세
50 = 중립
100 = 긍정 우세
최근 7일 기준 11,269건을 분석한 결과, 뉴스 심리지수는 50.0(균형)입니다. 긍정 1건(0.0%)·중립 11,267건(100.0%)·부정 1건(0.0%)이며, 중립 비중이 뚜렷하게 높습니다. 성향 지수는 종합 18.6(중도 균형)입니다.
Potential Democratic and Republican candidates are beginning to stake out positions on A.I. ahead of the 2028 election
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{beacon} Technology Technology The Big Story Florida GOP ramps up AI crackdown as DeSantis exits Top Florida Republican leaders and candidates are doubling down on their push to regulate artificial intelligence as Florida Gov. Ron DeSantis (R), a fierce critic of the technology, prepares to leave office. © Chris O'Meara, Associated Press Sunshine State...
This sponsored article is brought to you by Black & Veatch. The biggest challenge facing utilities today isn’t what it seems. It’s not demand, even as load growth accelerates. It’s not extreme weather, even as “major events” become routine. It’s not cybersecurity, even as connections expand across the grid. The real challenge is this: Distribution systems were designed for a different reality. Long gone are the days of predictable demand, one-way power flow and isolated disruptions. At Black & Veatch, we see that leading utilities are no longer debating whether to modernize. They’re deciding how quickly they can do it, and how to do it at scale. Across grid modernization programs globally, three truths consistently emerge. They define what it takes to prepare the distribution system for what’s next: 1. Outage response is not a resilience strategy Resilience is being redefined in real time. A strategy centered on mobilizing crews and restoring service as quickly as possible is reactive, and increasingly insufficient. Resilience has to shift upstream into integrated system design. That starts with hardening. Stronger poles, undergrounding and structural upgrades all have a role, particularly in high-risk corridors. We’re also seeing meaningful gains from how the network is configured and how quickly it can respond without waiting on manual intervention. This is where distribution automation programs can change outcomes. Strategically placed reclosers, automated switches and fault indicators help contain disruptions before they spread. When combined with feeder reconfiguration and updated protection strategies, distribution automation investments allow utilities to set more aggressive recovery targets and achieve measurable reductions in outage duration and customer impact. 2. Future-readiness depends on DERs at scale Forecasting is less and less reliable. Only 19 percent of utilities report strong confidence in their ability to predict future load growth, according to the Black & Veatch 2025 Electric Report. Distributed Energy Resources (DERs) like solar, storage, EVs and behind-the-meter generation are exciting solutions; but they fundamentally change how the system operates. Power is no longer just delivered. It’s injected, stored and redirected in ways the system was never designed to manage. At scale, these challenges show up quickly — particularly on feeders where distributed generation is approaching or exceeding hosting capacity. Protection coordination becomes more difficult when fault current comes from multiple directions. Voltage becomes less predictable as generation fluctuates throughout the day. And planning models must now account for highly variable, location-specific behavior. Distribution modernization is fundamentally changing how the system is designed and operated so it can absorb disruption, manage bi-directional flows and respond in real time. Adapting to bi-directional power flow requires more than incremental updates. Leading utilities are responding by building flexibility into the system, moving beyond static assumptions toward dynamic hosting capacity and interconnection studies, planning that incorporates DER, EV adoption and localized load growth, and infrastructure aligned with the communications and control needed to manage it. 3. The edge must be intelligent, visible and secure As system stress and complexity increase, utilities need far greater visibility and control over the network. Historically, utilities relied on customer calls, Supervisory Control and Data Acquisition (SCADA) at the substation level and field crews to understand what was happening on the system. That model doesn’t hold up. You can’t effectively manage a system you can’t see. Plus, the most critical events are increasingly happening beyond the substation — on feeders, laterals, and at the edge where DER and customer behavior are interacting with the grid. Grid-edge technologies have become essential. Sensors, Advanced Metering Infrastructure (AMI) and automated switching provide the raw data and control needed to move from reactive to proactive operations. In more advanced deployments, utilities are creating centralized control environments that allow operators to see and manage the distribution system in near real time. That capability is enabled by: Advanced communications networks to form the backbone of real-time grid visibility Distribution Management System (DMS) and Outage Management System (OMS) to enable faster, more coordinated system response Analytics, AI and machine learning to improve situational awareness, anticipate system conditions, and support operational decision-making The same connectivity enabling this real-time visibility and control also introduces new vulnerabilities, blurring the line between physical and cyber risk, yet many utilities manage them separately. Only 22 percent have unified teams in place, even as threats continue to rise, including a 50 percent increase in substation attacks and growing exposure to malware and ransomware, according to the Black & Veatch 2025 Electric Report. Cybersecurity and resilient network design must be embedded into the architecture from the outset—not layered on after the fact. See what bolder vision looks like Distribution modernization is fundamentally changing how the system is designed and operated so it can absorb disruption, manage bi-directional flows and respond in real time. To learn about a successful program, check out Georgia Power’s recent grid modernization program. Black & Veatch partnered with the utility on large-scale infrastructure upgrades. The results? Outages are down 76 percent, restoration times have improved by more than 80 percent and communities across Georgia are powered by a grid built to meet the future head-on. When the state faced the most destructive storm in the company’s history, Hurricane Helene, Georgia Power deployed a rapid response team that utilized its “smart grid” and restored power to more than 1 million customers within days. A grid built to meet the future head-on—that’s the result of bolder vision.
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Top Florida Republican leaders and candidates are doubling down on their push to regulate artificial intelligence as Florida Gov. Ron DeSantis (R), a fierce critic of the technology, prepares to leave office. Sunshine State Republicans are promising to ramp up rules on AI — including on chatbots — even as the Trump administration pushes back...
Microsoft just kicked off Build 2026 with a keynote from CEO Satya Nadella and other company leaders. As expected, it was filled with announcements, ranging from new Surface hardware to an always-on personal assistant and updates across Microsoft's in-house AI models. If you didn't watch the event live, you can catch up on all the […]
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Electrons are great. We use them to move vehicles, illuminate cities, and, of course, compute. But computation is not confined to the world of electronics. And shifting to alternative nonelectronic realms can unlock unique advantages: Photonic chips, for instance, process information with light while generating little heat. Another compelling alternative is fluidics, which uses pressurized gases or liquids to build logic circuits. Pioneered in the 1960s but sidelined by microchips, the field reemerged in the 1990s as “microfluidics.” This approach aims to shrink laboratories onto a single chip by creating microscopic fluid channels with integrated micropneumatic control systems. Today, there is a second fluidic revival, this time in the domain of soft robotics. Scaling microfluidic designs up to the millimeter-scale range (millifluidics) enables the higher flow rates necessary to drive robotic actuators. These robots exploit the nonlinear behaviors of soft materials to create lifelike motion and safer interactions, often utilizing pressurized air. By building systems that “think” with the same air that powers them, we can drastically reduce the need for bulky electronic-to-pneumatic interfaces. This is the focus of my Soiboi Studio robotics lab. With millifluidic logic, I have steadily scaled the complexity of my designs. What began with a simple oscillator has most recently evolved into a clock featuring a soft, four-digit, seven-segment display. What Is Millifluidics? Building on microfluidics research from the early 2000s and recent developments from the Grover Lab at the University of California, Riverside, I’ve developed millifluidic devices using standard 3D printing and silicone casting. The basic architecture is simple: A flexible membrane is sandwiched between rigid layers embedded with networks of air channels. Just as electronics rely on differing voltage potentials, these fluidic circuits operate on the pressure difference between atmospheric pressure (logical 0) and a near-vacuum at around −60 kilopascals of relative pressure (logical 1). Using negative pressure means the membrane is pulled into openings. This creates robust seals that allow me to replicate electronic building blocks. A cast silicone membrane forms the face of the clock [top], while behind it sits 3D-printed millifluidic blocks [middle rows]. An Arduino Uno controls driver boards that operate solenoids, which are connected to valves that are attached to a vacuum pump [bottom row].James Provost While fluidic resistors are easily realized by adjusting the channel geometry, the heart of the system is a valve that mimics a metal-oxide-semiconductor field-effect transistor, or MOSFET. This vacuum “transistor” features a flow layer with two chambers (the source and drain) divided by a central valve seat and a control layer containing a cavity (the gate). A membrane runs between the control and flow layers and normally prevents airflow between the source and drain chambers. To switch the transistor on, a vacuum is applied to the gate chamber, sucking the membrane into the cavity and lifting it off the seat. This opens a path for airflow, equivalent to closing an electric circuit. By adding a small aperture to the membrane, I created a check valve—the fluidic equivalent of a diode. By combining transistors and resistive “pull-down” channels, I can build a full suite of logic gates. The original microfluidic designs that inspired me were fabricated from etched glass and milled acrylic. Adapting them for a standard 3D printer required reengineering the logic elements and mastering two critical fabrication techniques. First, I need airtight prints, yet printed plastic is notoriously porous. By printing at elevated temperatures, slow speeds, and slight overextrusion, I was able to fill microscopic gaps. When you’re using transparent filament, there’s a handy visual indicator: The more transparent the plastic appears, the lower its porosity. Second, I used glass for my print bed. By printing the upper and lower chambers directly against this bed, I got the interface surface to become mirror smooth. This finish is essential for creating reliable, airtight seals. A 0.3-millimeter silicone membrane is placed between the layers and secured with screws. How Does the Soft Clock Work? The clockface is a cast silicone membrane. Each digit segment is formed by a small underlying cavity. When air is evacuated from this cavity, the membrane is sucked inward to create a concave hollow; when atmospheric pressure is restored, the silicone pops back flush with the surface. The result is a mesmerizing, organic motion. The “brain” of the clock is an Arduino Uno, while the fluidics significantly reduce the hardware footprint. A four-digit, seven-segment display with two separator dots would require 29 solenoid valves to control directly. My clock needs just 11 valves. A pneumatic transistor is off when its upper control chamber is at atmospheric pressure [top]. When air is removed from the control chamber, it lifts a membrane, which allows air to flow between lower flow chambers and turns the transistor on [bottom]. James Provost To understand how it works, consider a standard electronic four-digit, seven-segment LED display. This also uses 11 pins to drive its digits. (In clockface displays, an additional pin is required to drive the separator dots.) Every digit is connected to a shared data bus with seven lines, one per segment. The four control lines select individual digits. Only one digit is illuminated at time, and strobing the digits at least 50 times per second creates the illusion that all four are simultaneously illuminated. Such high-speed switching is not possible with air. Instead, I rely on memory. Each segment acts like a capacitor: By evacuating its cavity (logic 1), you “charge” the segment; by restoring atmospheric pressure (logic 0), you discharge it. Hence, each digit acts as an independent 7-bit memory. If the system is sufficiently airtight, the segments maintain their state for several seconds. Like the electronic display, the system utilizes a seven-line data bus. Each line connects to a solenoid valve that provides either vacuum or atmospheric pressure. To selectively address the individual digits, I placed a fluidic transistor between each segment and its data line. All the transistors’ control inputs for a given digit are combined into one “write enable” line connected to its own solenoid valve. Activating this valve allows me to write data into the corresponding digit’s memory. The clock updates one digit per second, meaning a full cycle across the face takes 4 seconds. This cycle also drives the separator dots: A set of fluidic diodes connects the enable lines to the dots’ cavities. Consequently, as each digit is addressed, the dots pulse automatically. This display is more than a clock; it is a soft robot that happens to tell time. By offloading computation to the same air that powers movement, the clock approaches a new class of machines that are simpler, lighter, and more integrated. I’m now developing a guide for getting started with vacuum-powered logic and may release a refined version of this clock in the future. Watching the silicone skin morph serves as a fascinating reminder that not all logic needs silicon; sometimes, all you need is flexible silicone and a flow of air. This article appears in the June 2026 print issue as “The Soft Clock.”
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I have been an application-specific IC (ASIC) designer for almost three decades. Over that time, I’ve moved through the full academic trajectory, from graduate student to full professor; later, I transitioned to industry after an unsuccessful stint at entrepreneurship. When I made the switch to the private sector in 2019, I began focusing on a critically important aspect of the electronic industry: silicon intellectual property. As much as 80 percent of the physical area in today’s most advanced chips is occupied by blocks that aren’t made for specific products or even designed by the consumer-facing companies that built them. Instead, chipmakers draw heavily on established silicon IP from companies like Arm, Cadence, Rambus, Synopsys, and the company I work for, Silicon Creations. Throughout my career, I’ve designed chips for very different purposes, including enabling the research program in my academic lab and expanding the IP portfolio of my company. When I joined Silicon Creations, I had no idea how differently the industry approaches IC design and encountered a steep learning curve. Initially, it seemed that much of my two decades of academic research and training did not directly translate to the role. I had to learn new skills and adopt a new mindset. Today, demand for ASICs is rapidly growing, driven by the need for specialized chips in the automotive sector, AI applications, and more. By one market estimate, the ASIC market is expected to grow from US $23.4 billion to $38.8 billion by 2033, and the semiconductor industry as a whole is projected to hit $1 trillion by 2030. The industry needs more chip designers—but if you’re coming from an academic background as I did, there are a few things you’ll need to know. Different goals lead to different strategies The differences between industry and academe begin with a divergence in purpose. In academia, my primary objective was to generate new knowledge: to propose a novel circuit technique, validate an unconventional architecture, or explore the limits of performance in a given domain. A successful chip is one that demonstrates a concept. In industry, it is not nearly enough to prove that something can work. The goal is to ensure that it works reliably, repeatedly, and at scale. Success is measured not by novelty but by whether the silicon meets specifications, yields as expected in production, and supports a competitive product delivered on schedule. This leads to a stark contrast in risk tolerance. Academic designs often deliberately push into unproven territory, where even partial success can yield valuable insight. In industry, however, we systematically minimize risk. The cost of failure makes first-time silicon success a central requirement—especially at advanced technology nodes, where the lithography masks used to transfer circuit designs onto silicon wafers alone can cost tens of millions of dollars. As a result, industry design flows are built around eliminating uncertainty through conservative margins, extensive validation, and careful reuse of proven solutions. “Academia explores the design space, asking what is possible, while industry exploits it, determining what is viable at scale.” This paradigm has existed since the 1970s, when application-specific chip design was established. However, the gulf between academia and industry has expanded since the mid-2010s, when FinFET technology, a 3D architecture using vertical “fins” of silicon, was widely adopted in industry. System designs are also becoming increasingly modular with the advent of chiplets. This fundamentally altered the economics and complexity of ASIC development, with design costs rising by almost an order of magnitude. Initiatives like Taiwan Semiconductor Manufacturing Co.’s University FinFET Program and new government-funded chip-design hubs now let some well-resourced universities design for more advanced architectures, but the technology is still out of reach for many academics. What the industry-academia split means in practice Consider a startup developing an ASIC. Its engineering team may have deep expertise in a particular algorithm, sensor interface, or system architecture, the features that define its competitive advantage. But it is unlikely to possess world-class expertise in every supporting function. Developing each of these blocks internally would require significant time, capital, and specialized talent. Doing so could delay market entry beyond the startup’s viability. Even large semiconductor companies face similar constraints. Advanced-node development demands intense focus. Allocating a team to redesign a standard interface block that has already been implemented elsewhere may be difficult to justify when differentiation lies at the system level, such as an inference chip’s ability to speed up neural network computations. The time it takes to move a new chip from conception to market and risk mitigation, not self-sufficiency, govern most decisions about in-house development versus outsourcing. The economics of advanced IC manufacturing reinforce this reality. When the development cost of a leading-edge chip reaches hundreds of millions of dollars, minimizing risk becomes a central design imperative. In this context, silicon IP emerged as a practical solution. Similar to how software developers rely on preexisting libraries rather than writing every function from scratch, ASIC designers license predesigned, preverified silicon blocks—such as processor cores, memory interfaces, and security engines—from highly specialized IP vendors. These blocks can then be integrated into larger, increasingly complex systems. Design scope, verification, and time horizons With the use of silicon IP, industry is able to widen the scope of its designs. Academic efforts tend to focus on block-level innovation: a new analog-to-digital converter architecture or an ultralow-noise amplifier, for instance. These designs typically abstract away many of the complexities of bringing a chip to market, such as packaging constraints, long-term reliability, and manufacturing yield. In industry, the focus shifts to system-level integration. Modern systems on chips, or SoCs, incorporate dozens or even hundreds of functional blocks. Managing signal integrity, timing, firmware interaction, and system-level validation becomes as critical as the design of any individual block. Verification philosophy also diverges sharply. In academia, the goal of verification is to demonstrate that the concept works under nominal conditions, which may not always reflect how it would perform in real applications. Even if only a fraction of fabricated chips from a multiproject wafer operates correctly, the design may still be considered a success if it validates the underlying idea. At my academic lab for instance, we used to receive 40 chips from a TSMC prototyping service and started testing them in batches of five. If the first five or 10 chips proved functional, we had already collected more than enough data for a publication. If some of them failed, we weren’t required to mention this when publishing the results. In industry, verification is exhaustive, critical, and often dominates the development schedule. Failures are measured in parts per million, and even rare anomalies are carefully analyzed and documented to identify root causes and prevent recurrence. When I started at Silicon Creations, I was surprised by the level of detail and scrutiny designs face. Differences in time horizons and economic constraints reinforce each of these contrasts. Academic projects operate on flexible timelines aligned with research and funding cycles. If I missed a deadline, I just had to wait for the next cycle. Industry projects are driven by fixed product schedules and market windows, frequently targeting costly leading-edge nodes to achieve competitive performance, power, and area efficiency. Missing a deadline can negate the value of an entire design and may have major financial consequences along the entire supply chain. In essence, academia explores the design space, asking what is possible, while industry exploits it, determining what is viable at scale. Both are indispensable, but they operate under fundamentally different definitions of success. As ASIC complexity continues to grow, understanding both perspectives will be essential for the next generation of engineers navigating the evolving semiconductor landscape. This article appears in the June 2026 print issue.
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