Monolithic Integration of Piezo-Optomechanical Photonics and CMOS Electronics

Next-generation photonic architectures for AI, sensing, and quantum computing require thousands to millions of reprogrammable photonic devices on a chip[1].

The monolithic integration of Electronically-backed Photonic Integrated Circuits (EPICs) allows for very high density electrical interconnection and electronic drivers that can scale with photonics.

Piezo-optomechanical photonic integrated circuits (POMPICs) offer low power consumption, high speed modulation, cryogenic compatibility and broadband optical transparency from ultraviolet to infrared wavelengths[2,3], but have not been demonstrated with monolithically integrated CMOS electronics.

Here, we show a fully monolithic, all-CMOS fabricated platform for POMPICs co-fabricated with commercial control electronics.

200 millimeter photonic wafers are constructed directly on completed CMOS driver wafers by back-end-of-line processing, connecting integrated piezoelectric actuators under broadband silicon nitride waveguides to a high-density digital backplane comprising >2 million electrical connections per die with 6.4x6.4 micron electrode pitch.

We introduce segmented POMPIC components as Photonic Digital-to-Analog converters (PDACs) that convert low-voltage digital electronic signals to multi-bit analog optical phase and amplitude modulation, and we demonstrate parallel control of optical phase shifters, Mach-Zehnder interferometers, optical routing trees, and tunable ring resonators using a standard HDMI interface to program CMOS electronics.

We test multiple reticles and perform electronic and photonic characterization across the entire wafer to establish uniformity and yield, demonstrating wafer-scale integration of POMPICs on an electronic backplane and enabling dense, scalable electronic control of piezo-optomechanical circuits.