삼전 ‘테슬라’ 넘고, 하이닉스 ‘마이크론’ 제쳤다…세계 뒤흔든 ‘K-반도체’

AI Summary

SK Hynix delivered prototype samples of a next-generation high-bandwidth memory chip (HBM4E) to customer partners for design validation and technical evaluation. The announcement came approximately three weeks after Samsung Electronics disclosed similar capabilities, underscoring intense competition between South Korea's two dominant chipmakers for dominance in the AI processor memory market. The new generation provides higher data transmission rates and reduced power consumption relative to its predecessor, designed to address the performance and efficiency demands of artificial intelligence acceleration systems.