Samsung readies next-gen AI memeory HBM4E chip

Samsung Electronics said Friday it has begun shipping samples of its latest high-bandwidth memory (HBM) chip, the 12-layer HBM4E, marking the world's first shipment of the next-generation artificial intelligence memory product.

The move comes just three months after Samsung became the first company to begin mass production and shipments of sixth-generation HBM4 chips in February, underscoring its efforts to strengthen its leadership in the rapidly growing AI memory market.

According to the compa ...