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Huawei’s next smartphone chip taps new scaling law for performance boost: paper
South China Morning Post

Huawei Technologies’ coming smartphone processor is on track for a performance boost, without the need for more advanced processing nodes or lithography technology, according to new production data unveiled by the firm.
Using Huawei’s LogicFolding architecture, the Kirin 2026, a mobile processor set to power the firm’s coming flagship Mate handsets launching this autumn, has increased transistor density by 55 per cent compared to last year’s Kirin9030 Pro, according to an updated paper on the...
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