SK hynix’s iHBM tackles heat choking next-gen HBM

SK hynix on Tuesday introduced a packaging technology that builds cooling channels directly into its high-bandwidth memory chips to combat heat, one of the engineering challenges standing between today's AI memory and the next generation.

High-bandwidth memory, or HBM, is the specialized memory stacked next to AI accelerator chips, and SK hynix is the world's leading supplier of it.

As stacks grow taller and faster to feed AI workloads, they generate more heat, and that heat now caps how far the ...