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I'm building a parallel internet, and it's called The Thinnernet
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🇺🇸 미국 · "PARALLEL" · 총 26건
필터 보기현재 지수
48.9
0 = 부정 우세
50 = 중립
100 = 긍정 우세
최근 7일 기준 10,413건을 분석한 결과, 뉴스 심리지수는 48.9(균형)입니다. 긍정 1,032건(9.9%)·중립 7,512건(72.1%)·부정 1,869건(17.9%)이며, 중립 비중이 뚜렷하게 높습니다. 성향 지수는 종합 20.9(보수 경향)입니다.
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The Broadway revival of the musical (nominated for 11 Tony Awards) depicts drama, joy and heartbreak in the pursuit of the American Dream at the turn of the 20th century, with parallels to the contemporary world, from issues of race to the immigrant experience.
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In its initial phases, the 2026 Los Angeles mayoral contest was as low key (bordering on boring) as the parallel California gubernatorial race. Mayor Karen Bass has had persistently low job approval numbers, dating back to her shaky handling of the Palisades fire early last year. But several potential big-dog rivals (including her wealthy 2022 opponent, mall developer Rick Caruso) gave the race a pass. So it seemed, L.A. would give the incumbent a second term, as it's done many time in the past.
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This article is adapted by the author with permission from Tech Policy Press. Read the original article. South Africa is not just another developing country struggling to govern artificial intelligence; it is the exception with leverage, and the window to act on it is closing. It holds approximately 88 percent of global platinum-group metal reserves, critical inputs to parts of the semiconductor and data-center supply chains that make AI infrastructure possible. It hosts the largest data-center market on the continent. Its existing hyperscaler relationships give it procurement leverage that most African states will never have. And a major geopolitical contest over AI infrastructure is being fought on its soil right now, between Chinese and American technology companies competing for control of the systems that will underpin an entire continent’s public sector. In physics, leverage requires three things: a fulcrum, a lever arm, and the ability to apply force. The Bushveld Complex, the world’s largest platinum-group metal deposit, is the fulcrum: a mineral endowment that gives South Africa a position in the semiconductor supply chain that no other African state holds. The since-withdrawn draft policy is the lever arm. The unresolved “OPTION” provisions in the policy are where force would be applied. Without a policy that specifies what South Africa wants in return for market access, the lever arm sits unused, and the weight of two of the world’s largest technology ecosystems settles exactly where those ecosystems want it to settle. This makes South Africa a global test case. Not because its proposed means of governance is exemplary, but because it is the one developing country with enough structural leverage to negotiate genuinely different terms, and the one that is choosing, through inaction, not to. The recent announcement of a new panel to update the draft policy is an important opportunity. But the deeper failure is not that an AI policy contained bad references. It is that no verification process caught them before the document entered the public domain. That is a systems problem, not merely a political one. It points to a missing layer in how governments are adopting AI. The contest already underway Last year, Huawei pitched an emerging-product bundle to tech executives across the continent. Huawei was now bundling access to DeepSeek’s large language model with its own cloud and storage infrastructure. The price differential was stark—in some cases by more than 90 percent. At the same time, Microsoft announced plans to spend ZAR 5.4 billion ($300 million) by the end of 2027 on cloud and AI infrastructure in South Africa, building on a prior ZAR 20.4 billion investment. Google, Amazon Web Services, and Oracle already have cloud regions in the country. According to one analysis, the country’s data-center market was valued at US $2.16 billion in 2024, the largest in Africa. These are not commercially neutral investments. Huawei’s infrastructure reach has been explicitly linked to Chinese strategic objectives, including a documented track record of providing governments with surveillance infrastructure through its Safe Cities network. U.S. hyperscaler investment comes with its own dependency structure: closed models, pricing set unilaterally, and terms of access that no African government has meaningfully shaped. South Africa is being asked to choose between these dependency models without a policy that specifies what it wants in return. The leverage it has There is a particular irony in South Africa’s position. The country whose mines supply platinum-group metals essential to semiconductor manufacturing, and through them to AI compute, has drafted a policy that treats it as a consumer of AI systems rather than a stakeholder in their governance. South Africa digs up the minerals that make AI possible. It has no say over the AI built from them. The AI triad framework covers algorithms, compute, and data. South Africa has no frontier model development capacity. South Africa holds significant data assets in financial services, health care, and agriculture, with no clear framework for their sovereign management. South Africa possesses PGM (Platinum Group Metals) leverage of global significance on the compute axis, currently being transferred without meaningful condition. It also has exceptionally high solar irradiance and significant renewable-energy potential. A country that can offer both critical mineral inputs and the energy to power the infrastructure those minerals help build occupies a negotiating position of unusual strength. The Draft Policy proposes no minimum terms for hyperscaler investment, no data sovereignty requirements, no technology transfer conditions and no compute visibility mechanism. Multiple provisions are explicitly left unresolved, marked “OPTION,” including the most consequential choices about how governance will function. Infrastructure decisions made now determine what is renegotiable later, and the answer is: very little. Three futures, one default The three infrastructure futures on offer each create a structurally different form of dependency, and only one creates sovereign capability. The Huawei-hosted DeepSeek integration offers low cost and open-source weights, but with data stored on infrastructure potentially accessible under Chinese legal frameworks, creating surveillance dependency in a pattern already documented across Africa. The second is U.S. closed-model dependency: higher capability, more reliable data protection, but complete API dependency on developers abroad. The third is locally hosted open-weight infrastructure: models governed under South African data-sovereignty rules, on infrastructure subject to minimum terms, developed with South African data. As Nathan Lambert at Interconnects has observed, open-weight models are likely the only realistic way to get sovereign AI off the ground as a real effort, enabling local communities and economies to integrate meaningfully with the technology. But this requires procurement conditions, not goodwill. What binding governance looks like The GovAI “Governing Through the Cloud” framework identifies four roles compute providers should accept as conditions of operating at scale: securers (protecting model weights and training data), record keepers (maintaining infrastructure usage logs), verifiers (confirming customer compliance with safety standards) and enforcers (restricting access when violations occur). These are operational requirements, not theoretical categories—specific, enforceable, and well within the bargaining power of a market of South Africa’s size and mineral position. A detailed policy analysis submitted to the Department of Communications and Digital Technologies (DCDT) identifies the specific provisions the final policy must contain: mandatory minimum terms for foreign compute infrastructure investments above ZAR 500 million (~$30 million); a compute reporting threshold; a National AI Safety Institute mandate covering defensive monitoring of AI capability accumulation; and National AI Champion Sector designations to create data assets for domestic model development. Each provision converts a structural advantage into a governance instrument before that advantage is foreclosed by market reality. Just as modern software security increasingly depends on knowing what components are inside a system—model provider, training data, compute environment, evaluation methods, update cadence, human review points, and failure-reporting procedures—public-sector AI governance requires a clear account of the stack before deployment, not after a problem surfaces. A public institution that cannot verify the sources in its own AI policy is unlikely to be ready to verify the AI systems it procures, deploys, or regulates. Why this is the continental test case South Africa’s choices will establish a regional precedent for what is commercially negotiable in AI infrastructure. If South Africa negotiates data-sovereignty guarantees and technology-transfer conditions as requirements for hyperscaler investment, it creates a replicable model. If Microsoft’s $300 million investment and Huawei’s infrastructure expansion proceed on standard commercial terms, as they are currently, it normalizes extractive AI infrastructure across the continent. The lesson is not specific to Africa. Governments everywhere are producing AI strategies while lacking AI assurance infrastructure. South Africa is an early warning, not an isolated case. The public comment period closed when the policy was withdrawn. But a parallel process remains live: the National Treasury’s Draft General Public Procurement Regulations—the legal instrument that will govern every government AI contract—closes for comment on June 15. Those regulations contain no AI-specific provisions. South Africa has more AI leverage than any country on the continent. Some argue, with force, that governance requirements risk deterring the infrastructure investment South Africa urgently needs: compute capacity, reliable energy, venture capital, and talent retention. That concern deserves a direct answer. Minimum procurement terms, compute reporting thresholds, and technology transfer conditions are not barriers to investment. They are the conditions under which investment serves the host country rather than extracting from it. Infrastructure built without minimum terms produces dependency. Infrastructure built with them produces leverage. To serve the public interest, its AI policy must use it. When late last month News24 reported AI-hallucinated references in the draft AI policy, Minister of Communications and Digital Technologies Solly Malatsi withdrew the draft policy. That was a mistake that could cost South Africa and the rest of the continent the initiative on this urgent issue. His more recent constitution of an independent panel is a belated step in the right direction, if it can turn South Africa’s leverage into policy. The panel—chaired by Professor Benjamin Rosman of the Wits Machine Intelligence and Neural Discovery Institute, and including Professors Vukosi Marivate and Alison Gillwald of Research ICT Africa and Dr. Jabu Mtsweni of the Council for Scientific and Industrial Research—has the technical and governance credibility to produce a stronger document. What it has not yet produced is a timeline. No revised draft has been scheduled. South Africa remains without a formal AI governance framework in the interim.
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What if the next decisive intelligence advantage isn’t a recruited insider but a nation’s ability to model entire societies from its digital exhaust? Salt Typhoon’s multi-year cyber campaigns against U.S. telecommunications networks and critical infrastructure demonstrate China’s unparalleled focus on data-centric espionage: collect widely, analyze fast, and operationalize at scale — alongside continued investments in traditional intelligence disciplines. This approach reshapes how the United States has conventionally thought about intelligence advantage. From Exquisite to ExhaustFor decades, the U.S. intelligence community has prized what analysts call “exquisite” intelligence: narrowly sourced, high-confidence insight into adversary intent. That model depends on scarcity — secrets The post Machine Overmatch: What Salt Typhoon Reveals About China’s Data-Centric Intelligence Strategy appeared first on War on the Rocks.
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This sponsored article is brought to you by Melbourne Convention Bureau (MCB) supported by Business Events Australia. Melbourne’s reputation as a global events city, from the Australian Open tennis and Formula 1 Australian Grand Prix to hosting NFL regular season games, now intersects with a different form of scale: large-scale compute, data-intensive research, and advanced engineering. Long recognized for delivering complex international events, the city is applying the same organisational capability to the infrastructure that underpins modern AI research, positioning Melbourne at the convergence of global convening and high-performance digital systems. Consistently ranked among the world’s most livable cities, Melbourne was named Time Out’s Best City in the World in 2026, the first Australian city to hold the title. Melbourne, Australia’s premier conference destination. Tourism Australia More materially for research and innovation, Melbourne is also the nation’s fastest‑growing capital, attracting increasing concentrations of engineering and technology talent, investment and international engagement. Australia’s artificial intelligence (AI) ecosystem is entering a new phase, defined less by isolated initiatives and more by the convergence of compute infrastructure, research intensity and international collaboration. Melbourne sits at this intersection. Melbourne’s trajectory highlights what enables research at scale: access to frontier-grade compute, proximity to industry-ready infrastructure, and repeated opportunities for global research communities to convene. Sovereign AI compute, expanding hyperscale data center campuses and a growing pipeline of international research-led conferences are reshaping the city’s research landscape. Together, these elements position Melbourne as a focal point for applied AI research, advanced engineering and data-intensive science. The growing global influence of AI engineering, underscored by NVIDIA CEO Jensen Huang receiving the 2026 IEEE Medal of Honor, reflects the scale of this shift. In Melbourne, these factors form a reinforcing research flywheel linking infrastructure, discovery and collaboration. Rather than focusing on startup density or short-term commercial output, Melbourne’s trajectory highlights what enables research at scale: access to frontier-grade compute, proximity to industry-ready infrastructure, and repeated opportunities for global research communities to convene. NVIDIA CEO Jensen Huang received the 2026 IEEE Medal of Honor.IEEE Sovereign AI foundations The most recent cornerstone of Melbourne’s AI capability is MAVERIC (Monash AdVanced Environment for Research and Intelligent Computing), Australia’s largest university-based AI supercomputer. Built and deployed by Monash University in partnership with NVIDIA, Dell Technologies, and CDC Data Centres, MAVERIC has been engineered specifically for large scale AI and data intensive science, with medical research representing a key priority. Indeed, in these regards MAVERIC has been designed to function as a Next Generation Trusted Research Environment thus ensuring that it is state-of-the-art and provides a safe and secure framework for the analysis of large sensitive datasets. Designed to support research projects including cancer and neurodegenerative disease detection, clinical trial analysis and drug discovery through to materials science and engineering, MAVERIC enables Australian researchers to train and evaluate large models domestically while keeping highly sensitive datasets secure and under national jurisdiction. This sovereign design is particularly relevant in fields such as medical research where privacy, regulation or intellectual property constraints limit the use of offshore cloud resources. Monash University Vice-Chancellor and President Professor Sharon Pickering with researchers [left to right] Professor Anton Peleg, Professor Victoria Mar, Professor James Whisstock, Vice-President (Strategy and Major Projects) Teresa Finlayson, and Professor Patrick Kwan.Eamon Gallagher (Australian Financial Review) Technically, the system reflects the latest shifts in high performance AI architecture. Built on NVIDIA GB200 NVL72 platforms and integrated using Dell’s rack scale infrastructure, MAVERIC employs closed loop liquid cooling to reduce water consumption compared with conventional air-cooled systems, aligning large scale compute growth with sustainability objectives while supporting high density, high throughput workloads. Professor James Whisstock, Deputy Dean Research of Monash’s Faculty of Medicine, Nursing, and Health Sciences commented, “MAVERIC provides a huge leap forward in our compute capability that will revolutionize our researchers’ ability to address the most challenging and important research questions across the fields of medical research, information technology, and STEM disciplines. It will seed wonderful new cross-disciplinary collaborations, underpin the work of our best and brightest young researchers and will allow our scientists to continue to make major discoveries that positively impact the Australian and global population more broadly.” “MAVERIC provides a huge leap forward in our compute capability that will revolutionize our researchers’ ability to address the most challenging and important research questions across the fields of medical research, information technology, and STEM disciplines.” —Professor James Whisstock, Deputy Dean Research of Monash’s Faculty of Medicine, Nursing, and Health Sciences Monash University frames MAVERIC not as a standalone asset, but as part of the national research infrastructure, intended to strengthen collaboration across academia, healthcare, government and industry. This approach positions Melbourne at the forefront of sovereign AI enabled research in the region. Data center scale as research infrastructure The infrastructure demands of modern AI research extend well beyond individual systems. Melbourne’s expanding data center footprint now supports hyperscale compute, applied AI deployment and large-scale research workloads simultaneously. Total data center investment, US$ billions.Source: Data Centres Global Report 2025 In February 2026, CDC Data Centres opened its first Melbourne campus in Brooklyn, with two live facilities and a third in planning. Combined with CDC’s Laverton campus, Melbourne is projected to host more than 800 megawatts of sovereign digital capacity, critical for AI workloads requiring sustained access to high-density power, cooling and secure environments. Parallel investment is underway in Fishermans Bend, where NEXTDC is developing a AUD $2 billion AI and digital infrastructure hub adjacent to the Innovation Precinct. Planned facilities include an AI Factory, a Mission Critical Operations Center and a Technology Center of Excellence, enabling sovereign AI, high-performance computing and cross-sector collaboration across health, defence and finance. Melbourne hosts Australia’s largest cluster of AI firms, with 188 companies, and more than 40 data centers currently operate across Victoria. The Victorian Government has complemented this growth with an initial AUD $5.5 million investment in the Sustainable Data Center Action Plan. Together, these developments reinforce Melbourne’s role as a national and increasingly global hub for high-performance AI infrastructure as model complexity and infrastructure dependency continue to accelerate. Applied AI research at scale Monash University is home to MAVERIC, Australia’s largest university-based AI supercomputer, built and deployed by Monash in partnership with NVIDIA, Dell Technologies, and CDC Data Centres.Monash University Melbourne’s research strength is underpinned by a dense university network with deep capability across AI, data science and engineering. Institutions including Monash University, the University of Melbourne, Deakin University, La Trobe University, RMIT University and Swinburne University of Technology collectively support research across machine learning, robotics, human-computer interaction, extended reality and advanced manufacturing. This concentration fosters applied collaboration where AI intersects with medicine, sustainability, cognitive systems and immersive technologies. For visiting researchers, it provides access not only to academic expertise but also to live infrastructure environments where research can be tested and validated, reinforcing Melbourne’s position as one of the Asia-Pacific’s most integrated AI research ecosystems. Conferences as research accelerators Plenary session at Melbourne Convention and Exhibition Center.Melbourne Convention Bureau Melbourne’s selection as host city for a growing number of international technology conferences reflects the convergence of research capability and infrastructure maturity. In September 2026, Data Center World Australia and The AI Summit Australia will be co-located at the Melbourne Convention and Exhibition Center, bringing together global leaders across AI, digital infrastructure and enterprise technology. The pairing highlights a broader reality: advances in AI are inseparable from the infrastructure that enables them. Melbourne’s expanding data center footprint now supports hyperscale compute, applied AI deployment and large-scale research workloads simultaneously. Research-led conferences are also expanding Melbourne’s global footprint. ICONIP 2026, hosted by Deakin University, will bring up to 700 researchers in neural networks and machine learning, followed in 2027 by IEEE VR, the leading conference on virtual reality and 3D user interfaces, attracting up to 1,000 delegates. In this context, conferences function not simply as events, but as infrastructure for knowledge transfer, supporting standards exchange, collaboration and system-level learning at global scale. A global platform for advancing research Sovereign compute, data center scale and a strong conference pipeline create a reinforcing cycle, enabling researchers to engage directly with infrastructure and industry well beyond the event itself. By closing the gap between theory and deployment, Melbourne supports deeper technical exchange and more enduring global research networks. This role was recognized in 2025 when the IEEE awarded Melbourne Convention Bureau the 2025 Organisational Supporting Friend of IEEE Member and Geographic Activities (MGA) — the first convention bureau in the Asia Pacific region to receive the acknowledgement as a result of the longstanding partnership with the IEEE Victorian Section. Melbourne Convention Bureau (MCB) representative Fatima Aboudrar, Senior Business Development Manager, with Vijay S. Paul, Immediate Past Chair, IEEE Victorian Section, receiving Supporting Friend Member recognition in 2025. As AI research becomes increasingly dependent on infrastructure scale, sovereign capability, and global collaboration, Melbourne is moving beyond hosting conversations to actively enabling the systems that advance AI and data‑driven research at global scale. Conference support in Melbourne Your browser does not support the video tag. Why host a conference in Melbourne, Australia.Melbourne Convention Bureau This ecosystem is underpinned by Melbourne’s highly accessible city center, where world-class venues, research institutions and industry hubs are located in close proximity. Free public transport and a compact city footprint enable seamless movement from conference floor to real-world application. Melbourne Convention Bureau (MCB) is a not-for-profit state government agency with over 60 years’ experience, that provides IEEE and its members with free support to bring international conferences to Melbourne, Australia. MCB’s support spans early-stage exploration and international bidding through to securing government funding, connecting organizers with venues, accommodation and event suppliers, and providing destination support for conference planning and delivery. Organizations considering a conference in Australia are encouraged to connect with MCB’s dedicated team, which supports IEEE conferences in Melbourne. Enquiries can be directed to info@melbournecb.com.au.
This sponsored article is brought to you by Applied Materials. At pivotal moments in history, progress has required more than individual brilliance. The most consequential breakthroughs — such as those achieved under the Human Genome Project — required a new operating paradigm: Concentrate the world’s best talent around a single mission, establish a common platform, share critical infrastructure, and collapse feedback loops. When stakes are high and timelines are compressed, sequential and siloed innovation simply cannot keep pace. Today’s AI era is creating an engineering race with similar demands. Every company is pushing to deliver higher-performance AI systems, faster. But performance is no longer defined by compute alone. AI workloads are increasingly dominated by the movement of data: In many cases, moving bits consumes as much — or more — energy than compute itself. As a result, reducing energy per bit can extend system‑level performance alongside gains in peak compute. The path to energy‑efficient AI therefore runs through system‑level engineering, spanning three tightly interconnected domains: Logic, where performance per watt depends on efficient transistor switching, low‑loss power, and signal delivery through dense wiring stacks. Memory, where surging bandwidth and capacity demands expose the memory wall, with processor capability advancing faster than memory access. Advanced packaging, where 3D integration, chiplet architectures, and high‑density interconnects bring compute and memory closer together — enabling system designs monolithic scaling can no longer sustain. These domains can no longer be optimized independently. Gains in logic efficiency stall without sufficient memory bandwidth. Advances in memory bandwidth fall short if packaging cannot deliver proximity within thermal and mechanical constraints. Packaging, in turn, is constrained by the precision of both front‑end device fabrication and back‑end integration processes. In the angstrom era, the hardest problems arise at the boundaries — between compute and memory in the package, front‑end and back‑end integration, and the tightly coupled process steps needed for precise 3D fabrication. And it is precisely this boundary‑driven complexity where the traditional innovation model breaks down. The Traditional R&D Workflow Is Too Slow for Angstrom‑Era AI For decades, the semiconductor industry’s R&D model has resembled a relay race. Capabilities are developed in one part of the ecosystem, handed off downstream through integration and manufacturing, evaluated by chip and system designers, and only then fed back for the next iteration. That model worked when progress was dominated by relatively modular steps that could be scaled independently and simply dropped into the manufacturing flow. But the AI timeline has upended these rules. At angstrom‑scale dimensions, the physics enforces inescapable coupling across the entire stack: materials choices shape integration schemes; integration defines design rules; design rules dictate power delivery; wiring sets thermal budgets; and thermals ultimately constrain packaging scaling. System architects simply cannot wait 10–15 years for each major semiconductor technology inflection to mature. Representing a roughly $5 billion investment, EPIC is the largest commitment to advanced semiconductor equipment R&D in U.S. history. A long‑term perspective is essential to align materials innovation with emerging device architectures — and to develop the tools and processes required to integrate both with manufacturable precision. At Applied Materials, together with our customers, we are charting a course across the next 3–4 generations, extending as far as 10 years down the roadmap. The angstrom era demands that we break down silos and bring together the industry’s best minds — from leading companies to leading academic institutions. If the problem is coupled, the solution must be coupled. If the timeline is compressed, the learning loop must be compressed. It’s not enough to just innovate — we must innovate how we innovate. EPIC: A Center and Platform for High‑Velocity Co‑Innovation This is the challenge that Applied Materials EPIC Center is designed to solve. Representing a roughly US $5 billion investment, EPIC is the largest commitment to advanced semiconductor equipment R&D in U.S. history. When it opens in 2026, it will deliver state‑of‑the‑art cleanroom capabilities built from the ground up to shorten the path from early‑stage research to full‑scale manufacturing. But the facilities are only one component of the model. EPIC is also a platform, an operating system for high-velocity co‑innovation that revolutionizes how ideas move from the lab to the fab. EPIC is a platform, an operating system for high-velocity co‑innovation that revolutionizes how ideas move from the lab to the fab.Applied Materials The EPIC model compresses the traditional workflow. Customer engineers work side‑by‑side with Applied technologists from day one — moving beyond isolated process optimization and downstream handoffs. Within a shared, secure environment, EPIC tightly integrates atomistic modeling, test vehicles, process development, validation, and metrology feedback. Constraints that once surfaced late in development are identified and addressed early. The result is a potentially 2x faster path that benefits the entire ecosystem under one roof: Chipmakers gain earlier access to Applied’s R&D portfolio, faster learning cycles, and accelerated transfer of next‑generation technologies into high‑volume manufacturing. Ecosystem partners gain earlier access to advanced manufacturing technology and collaboration opportunities that expand what is possible through materials innovation. Academic institutions gain opportunities to strengthen the lab‑to‑fab pipeline and help develop future semiconductor talent. Building on decades of co‑development, we are reinventing the innovation pipeline with our partners across logic, memory, and advanced packaging to deliver the next leap in energy‑efficient AI. Accelerating Advanced Logic Logic remains the engine of AI compute. In the angstrom era, however, system‑level gains are increasingly constrained by power and energy. Extending AI performance now depends on architectures that deliver more performance per watt — accelerating the move to 3D devices such as gate‑all‑around (GAA) transistors, which boost density within a compact footprint while preserving power efficiency. Architectures that deliver more performance per watt are accelerating the move to 3D devices such as gate‑all‑around (GAA) transistors, and further out, complementary FETs (CFETs), which push density scaling even more.Applied Materials These architectural shifts are unfolding at unprecedented scale, with the logic roadmap already extending beyond first‑generation GAA toward more advanced designs. One key example is GAA with backside power delivery, which relocates thick power lines to the backside of the wafer, reducing resistive losses and freeing front‑side routing for tighter logic cell integration. Another example brings adjacent GAA PMOS and NMOS transistors closer together while inserting a dielectric isolation wall between them to minimize electrical interference. Further out, complementary FETs (CFETs) push density scaling even more by stacking PMOS and NMOS devices directly atop one another. While these architectures deliver compelling gains in performance per watt and logic density without relying solely on tighter lithography, they significantly raise integration complexity. Manufacturing a single GAA device today can involve more than 2,000 tightly interdependent process steps. At the same time, wiring stacks continue to grow taller and denser to connect these advanced logic devices. Modern leading‑edge GPUs now in development pack more than 300 billion transistors into an area little larger than a postage stamp, interconnected by over 2,000 miles of wiring. Modern leading‑edge GPUs now in development pack more than 300 billion transistors into an area little larger than a postage stamp, interconnected by over 2,000 miles of wiring.Applied Materials At this level of complexity, the process steps used to create these precise 3D devices and wiring stacks cannot be optimized independently. Design and process must evolve in lockstep, and materials innovation and fabrication methods must advance alongside device architecture. EPIC’s co‑innovation model is designed to accelerate exactly this convergence — enabling logic compute to continue advancing the frontiers of AI at the pace the roadmap demands. Powering the Memory Roadmap At the same time, the AI computing era is fundamentally reshaping how data is generated, moved, and processed — making memory technologies, especially DRAM, central to delivering the energy‑efficient performance AI systems require. As models grow larger and more data‑hungry, the DRAM roadmap is shifting toward architectures that deliver higher density, greater bandwidth, and faster access per watt. At the DRAM cell level, AI performance requirements are driving a transition from 6F² buried‑channel array transistors (BCAT) to more compact 4F², and beyond that, architectures that move past what 2D scaling alone can deliver. Applied Materials At the DRAM cell level, this shift is driving a transition from 6F² buried‑channel array transistors (BCAT) to more compact 4F² architectures, which orient the transistor vertically to boost density and reduce chip area. Looking beyond 4F², sustaining gains in performance per watt will require moving past what 2D scaling alone can deliver. The industry is therefore turning to 3D DRAM, stacking memory cells vertically to add capacity within a constrained footprint. As these structures grow taller and aspect ratios intensify, high-mobility materials engineering in three dimensions becomes increasingly critical to performance and reliability. Beyond the memory cell array, another powerful lever for DRAM scaling is shrinking the peripheral circuitry, which includes logic transistors and interconnect wiring. One emerging approach places select periphery functions beneath the DRAM array by bonding two wafers — one optimized for the DRAM cells and the other for CMOS logic — using multiple wiring layers. Beyond the memory cell array, another powerful lever for DRAM scaling is shrinking the peripheral circuitry, which includes logic transistors and interconnect wiring.Applied Materials In parallel, DRAM performance is being extended by leveraging logic‑proven enhancers in the memory periphery. These include mobility boosters such as embedded silicon germanium and stress films, along with wiring upgrades like improved low‑k dielectrics and advanced copper interconnects. Memory manufacturers are also transitioning periphery transistors from planar devices to FinFET architectures, following the logic roadmap to further improve I/O speed. These valuable inflections are central to EPIC’s mission — where they can be co-developed and rapidly validated for next‑generation memory systems. Driving System Scaling With Advanced Packaging As data movement becomes the dominant energy cost in AI systems, advanced packaging has emerged as a critical lever for improving system‑level efficiency—shortening interconnect distances, increasing bandwidth density, and reducing the power required to move data between logic and memory. The rise of 3D packages such as high‑bandwidth memory (HBM) underscores why advanced packaging is becoming central to the AI era.Applied Materials High‑bandwidth memory (HBM) marks a major inflection along this path. By stacking DRAM dies — scaling to 16 layers and beyond — and placing memory much closer to the processor, HBM enables rapid access to ever‑larger working datasets. This delivers step‑function gains in both bandwidth and energy efficiency. More broadly, the rise of 3D packages such as HBM underscores why advanced packaging is becoming central to the AI era. Packaging now addresses system‑level constraints that logic and memory device scaling alone can no longer overcome. It also enables a move away from monolithic systems‑on‑chip toward chiplet‑based architectures, as AI workloads increasingly demand flexible designs that combine logic, memory, and specialized accelerators optimized for specific tasks. A vital technology powering this roadmap is hybrid bonding. With interconnect pitches approaching those of on‑chip wiring, conventional bumps and microbumps run into fundamental limits in density, power, and signal integrity. Hybrid bonding removes these barriers by allowing dramatically higher interconnect and I/O density, supporting a broad range of chiplet architectures — from memory stacking to tighter compute‑memory integration. EPIC tackles high‑value advanced‑packaging challenges through early, parallel co‑innovation across materials, integration, and manufacturing.Applied Materials As bonded structures like HBM stacks grow larger and more complex, warpage control, die placement, stack alignment, and thermal management become first‑order challenges. EPIC tackles these and other high‑value advanced‑packaging challenges through early, parallel co‑innovation across materials, integration, and manufacturing. Bringing It All Together Across logic, memory, and advanced packaging, our industry faces an ambitious roadmap that promises significant gains in energy efficiency for AI systems. But realizing that potential demands breakthrough materials innovation at a time when feature sizes are shrinking, interfaces are multiplying, and process interdependencies are escalating. These challenges cannot be solved on 10–15‑year timelines under the traditional relay‑race model. We must break down silos, align earlier across the ecosystem, and parallelize learning to keep pace with AI’s demands. In the AI era, progress will be defined by the speed at which lightbulb moments turn into manufacturing and commercialization reality. The only viable path forward is a new innovation model — and EPIC is how we are driving it.